摘要:
A data input circuit for use in a semiconductor device, the data input circuit reducing a load difference between a fetch signal and a plurality of groups of data. The data input circuit includes first through Nth latching units for latching each one of N groups of data in response to a reference clock, respectively (N is a natural number greater than 2), and a bus for transmitting the reference clock and the N groups of data to the first through Nth latching units. Each of the first through Nth latching units includes a clock buffer for buffering the reference clock; a data buffer for buffering a corresponding group of data of the N groups of data; N−1 dummy elements for respectively receiving each one of the N groups of data, except for the group of data input to the data buffer; and latches for latching data output from the data buffer in synchronization with a signal output from the clock buffer. Use of the data input circuit makes a load on a reference clock the same or substantially the same as that on each group of data. Therefore, a load difference between the reference clock and each group of data is reduced to reduce a skew therebetween.
摘要:
An embodiment of the invention comprises a digital phase detector with substantially zero phase offset. The digital phase detector receives a clock signal and a reference clock signal and provides a phase indicator signal to identify whether the clock signal leads or lags the reference clock signal. An embodiment of the invention comprises a method that adds substantially zero phase offset in processing an input clock signal and a delayed clock signal to generate a control signal. The control signal is processed in a variable delay line to generate the delayed clock signal. In an embodiment, a first processor comprises a delay locked loop having a digital phase detector, the digital phase detector comprising a first differential sense amplifier cross-coupled to a second differential sense amplifier, the digital phase detector receiving a clock signal and generating one or more delayed clock signals, a control signal, and a gated data signal.
摘要:
A computer memory, having one or more of a semiconductor memory device having an internal memory array comprising a plurality of semiconductor dynamic random access memory (DRAM) cells arranged in a matrix of rows and columns, and provided as a memory module rank of such memory devices arranged in an array on a DIMM of one or more of said semiconductor memory device on a substrate which can be coupled via a memory device data interface to a memory system as a memory subsystem, each of said memory device having a low power shut-down state that can be activated using a common memory data interface. Control of power to a DRAM issues over the data interface two commands to a DRAM power control command decode, a power-state program signal and a power-state reset signal as a power-state control commands to control the power state of said DRAM, and to activate for READ/WRITE a memory cell as a normal active or spare device.
摘要:
A method and structures are provided for implementing decoupling capacitors within a DRAM TSV stack. A DRAM is formed with a plurality of TSVs extending completely through the substrate and filled with a conducting material. A layer of glass is grown on both the top and bottom of the DRAM providing an insulator. A layer of metal is grown on each glass layer providing a conductor. The metal and glass layers are etched through to TSVs with a gap provided around the perimeter of via pads. A respective solder ball is formed on the TSVs to connect to another DRAM chip in the DRAM TSV stack. The metal layers are connected to at least one TSV by one respective solder ball and are connected to a voltage source and a dielectric is inserted between the metal layers in the DRAM TSV stack to complete the decoupling capacitor.
摘要:
A method and structure are provided for implementing multiple different types of dies for memory stacking. A common wafer is provided with a predefined reticle type. The reticle type includes a plurality of arrays, and a plurality of periphery segments. A plurality of through-silicon-vias (TSVs) is placed at boundaries between array and periphery segments. Multiple different types of dies for memory stacking are obtained based upon selected scribing of the dies from the common wafer.
摘要:
A memory system with a programmable refresh cycle including a memory device that includes a memory array of memory cells and refresh circuitry that is in communication with the memory array and with a memory controller. The refresh circuitry is configured to receive a refresh command from the memory controller and for refreshing a number of the memory cells in the memory device in response to receiving the refresh command. The number of memory cells refreshed in response to receiving the refresh command is programmable.
摘要:
A stacked 3D integrated circuit structure is manufactured with a common image design for dies which allows diced master dies to cut from the common wafer and diced slave dies cut to be cut from a wafer which has the common image design. In an embodiment is stacked to form a wafer-to-wafer 3D stack before dicing. Master and slave elements which are used for only one kind of separated individual integrated circuit dies which are located along die edges and at die centers before dicing separation of individual integrated circuit chips. A master wafer is shifted ½ way across a die to make cutting along a kerf line effective to provide both master and slave dies. Multiple slaves can be stacked and coupled to a master die which acts as a bus master when attached to a bus to which only the master die is directly connected. The use of a common wafer design minimizes cost of manufacture of chips destined to be stacked as 3D integrated circuits.
摘要:
Methods and systems for calibrating parameters for communication between a controller and a memory device. A memory controller may be configured to calibrate one or more of the read latency and/or the latency window of a memory controller such that a data signal and a data strobe signal are received by the memory controller within the latency window of the memory controller.
摘要:
Methods and systems for calibrating parameters for communication between a controller and a memory device. A memory controller may be configured to calibrate one or more of the write latency and/or the latency window of a memory device such that a data signal and a data strobe signal are received by the memory device within the latency window of the memory device.
摘要:
A computer memory, having one or more of a semiconductor memory device having an internal memory array comprising a plurality of semiconductor dynamic random access memory (DRAM) cells arranged in a matrix of rows and columns, and provided as a memory module rank of such memory devices arranged in an array on a DIMM of one or more of said semiconductor memory device on a substrate which can be coupled via a memory device data interface to a memory system as a memory subsystem, each of said memory device having a low power shut-down state that can be activated using a common memory data interface. Control of power to a DRAM issues over the data interface two commands to a DRAM power control command decode, a power-state program signal and a power-state reset signal as a power-state control commands to control the power state of said DRAM, and to activate for READ/WRITE a memory cell as a normal active or spare device.