公开(公告)号：US07498205B2

公开(公告)日：2009-03-03

申请号：US11524404

申请日：2006-09-21

Applicant: Hoe Ku Jung ,  Myung Sam Kang ,  Jung Hyun Park

Inventor： Hoe Ku Jung ,  Myung Sam Kang ,  Jung Hyun Park

IPC: H01L21/00

CPC classification number: H05K3/4652 ,  H01L21/481 ,  H01L23/13 ,  H01L23/49805 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K3/4697 ,  H05K2203/0769 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for manufacturing a substrate having a cavity which includes forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master; coating a thermosetting material in the area where the cavity is to be formed; laminating a dielectric layer and a copper foil layer on the copper foil laminated master, on which the thermosetting material is coated; pressing the laminated dielectric layer and copper foil layer using a press plate, on which a protruded part is formed in an area corresponding to the area where the cavity is to be formed; forming an external circuit pattern in the upper part of the laminated dielectric layer; and dissolving the coated thermosetting material using a solvent and forming the cavity.

Abstract translation: 一种用于制造具有空腔的基板的方法，所述基板包括在铜箔层压母版上形成空腔周围的预定区域周围的阻挡层，形成在铜箔层压母板中的内部电路; 在要形成空腔的区域中涂覆热固性材料; 在铜箔层压母版上层叠电介质层和铜箔层，涂覆热固性材料; 使用压板对叠层电介质层和铜箔层进行压制，在其上形成有与要形成空腔的区域相对应的区域中的突出部分; 在叠层电介质层的上部形成外部电路图案; 并使用溶剂溶解涂覆的热固性材料并形成空腔。

公开(公告)号：US07516545B2

公开(公告)日：2009-04-14

申请号：US11591586

申请日：2006-11-02

Applicant: Myung Sam Kang ,  Shuhichi Okabe ,  Jung Hyun Park ,  Hoe Ku Jung ,  Ji Eun Kim

Inventor： Myung Sam Kang ,  Shuhichi Okabe ,  Jung Hyun Park ,  Hoe Ku Jung ,  Ji Eun Kim

IPC: H01K3/10 ,  H05K3/02

CPC classification number: H05K1/116 ,  H05K3/0094 ,  H05K3/421 ,  H05K3/428 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/0959 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/0542 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed is a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless via hole without the upper land of a via hole using a photoresist (P-LPR) which is loaded in the via hole. Therefore, in this invention, since a circuit pattern is formed using only copper of a copper clad laminate, the width thereof is minimized, thus easily realizing a fine circuit pattern. Further, the landless via hole structure is applied, resulting in a highly dense circuit pattern.

Abstract translation: 公开了一种具有无地过孔的印刷电路板的制造方法。 具体而言，本发明提供一种制造印刷电路板的方法，所述印刷电路板具有无通孔通孔，所述无通孔通孔使用装载在所述通孔中的光致抗蚀剂（P-LPR）而不具有通孔的上部焊盘。 因此，在本发明中，由于仅使用覆铜层压板的铜形成电路图案，所以其宽度被最小化，因此容易实现精细电路图案。 此外，施加无地通孔结构，导致高度密集的电路图案。