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公开(公告)号：US20070063213A1
公开(公告)日：2007-03-22
申请号：US11230574
申请日：2005-09-21
申请人： Hsiang-Cheng Hsieh , Teng-Huei Huang , Wen-Lung Su
发明人： Hsiang-Cheng Hsieh , Teng-Huei Huang , Wen-Lung Su
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/00
摘要： A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.
摘要翻译： 允许敏捷地部署每个LED芯片的位置的包装包括散热块以固定多个LED芯片，两个引线框架，沿着热块的边缘延伸的导电区域以及将热段和 这些多个LED芯片的引线框架通过金线连接到导电区域而不会引起引线框架的存在。
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公开(公告)号：US20060012988A1
公开(公告)日：2006-01-19
申请号：US10710265
申请日：2004-06-30
IPC分类号： F21V9/00
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A fine-tunable RGB mixing LED has a red LED unit electrically connected to a first embedded variable resistor, a green LED unit electrically connected to a second embedded variable resistor, and a blue LED unit electrically connected to a third embedded variable resistor. The spectrum of the RGB mixing LED can be fine-tuned using a laser to trim the first, second and/or third embedded variable resistors.
摘要翻译： 微调RGB混合LED具有电连接到第一嵌入式可变电阻器的红色LED单元，电连接到第二嵌入式可变电阻器的绿色LED单元和电连接到第三嵌入式可变电阻器的蓝色LED单元。 可以使用激光器对RGB混合LED的频谱进行微调，以修整第一，第二和/或第三嵌入式可变电阻器。
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公开(公告)号：US06936862B1
公开(公告)日：2005-08-30
申请号：US10710928
申请日：2004-08-13
IPC分类号： F21V5/00 , F21V9/10 , H01L23/28 , H01L25/16 , H01L33/50 , H01L33/52 , H01L33/60 , H01L33/62 , H01L33/00
CPC分类号： H01L33/502 , H01L25/167 , H01L33/501 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/12032 , H01L2924/181 , H01L2933/0091 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode package includes a light emitting diode device disposed in the light emitting diode package, and a molding material covering the light emitting diode device. The molding material includes a plurality of scatter supported wavelength converters. Portions of light beams emitted from the light emitting diode device incident to each of the scatter supported wavelength converters are scattered by each of the scatter supported wavelength converters and absorbed to excite each of the scatter supported wavelength converters to emit light in another wavelength.
摘要翻译： 发光二极管封装包括设置在发光二极管封装中的发光二极管器件和覆盖发光二极管器件的成型材料。 成型材料包括多个散射支持的波长转换器。 入射到每个散射支持的波长转换器的从发光二极管器件发射的光束的部分被散射支持的波长转换器中的每一个散射，并被吸收以激发每个散射支持的波长转换器以发射另一波长的光。
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4.发明授权公开(公告)号：US07479733B2
公开(公告)日：2009-01-20
申请号：US11160287
申请日：2005-06-17
IPC分类号： H01J1/62
CPC分类号： C09K11/7774 , H01L33/502 , H01L33/56 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0
摘要翻译： 提供了包括载体，LED芯片，密封剂和PL材料的LED封装结构，其中LED芯片设置在载体上用于发光。 密封剂封装了LED芯片。 PL材料分布在密封剂中。 PL材料适合于被LED芯片发出的光激发并散射光线。 此外，本发明提供了分子式为WmMon（Y，Ce，Tb，Gd，Sc）3 + t + u（Al，Ga，Tl，In，B）5 + u + 2v（O ，S，Se）12 + 2t + 3u + 3v + 3m + 3n：Ce3 +，Tb3 +，其中0
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公开(公告)号：US20080224096A1
公开(公告)日：2008-09-18
申请号：US12129644
申请日：2008-05-29
CPC分类号： C09K11/7774 , H01L33/502 , H01L33/56 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sb)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n:Ce3+,Tb3+, wherein 0
摘要翻译： 提供了包括载体，LED芯片，密封剂和PL材料的LED封装结构，其中LED芯片设置在载体上用于发光。 密封剂封装了LED芯片。 PL材料分布在密封剂中。 PL材料适合于被LED芯片发出的光激发并散射光线。 此外，本发明提供了具有分子式为W m（n，Ce，Tb，Gd，Sb）3 + t的新型PL材料 （O，S，Se）12 + 2t + 3u + 3v + 3m + 3n（O，S，Se）12 + 2t + 3u + 3v + 3m + 3n 其中0
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6.发明申请LIGHT-EMITTING DIODE PACKAGE STRUCTURE, COLD CATHODE FLOURESCENT LAMP AND PHOTOLUMINESCENT MATERIAL THEREOF 有权发光二极管封装结构，冷阴极灯泡及其光致发光材料公开(公告)号：US20060214562A1
公开(公告)日：2006-09-28
申请号：US11160287
申请日：2005-06-17
IPC分类号： H01J1/62
CPC分类号： C09K11/7774 , H01L33/502 , H01L33/56 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0
摘要翻译： 提供了包括载体，LED芯片，密封剂和PL材料的LED封装结构，其中LED芯片设置在载体上用于发光。 密封剂封装了LED芯片。 PL材料分布在密封剂中。 PL材料适合于被LED芯片发出的光激发并散射光线。 此外，本发明提供了具有分子式为W m（n，Ce，Tb，Gd，Sc）3 + t的新型PL材料 （O，S，Se）12 + 2t + 3u + 3v + 3m + 3n（O，S，Se）12 + 2t + 3u + 3v + 3m + 3n 其中0
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7.发明申请Wavelength converting substance and light emitting device and encapsulating material comprising the same 审中-公开波长转换物质和发光器件以及包含该物质的封装材料公开(公告)号：US20060152139A1
公开(公告)日：2006-07-13
申请号：US10908189
申请日：2005-05-02
CPC分类号： C09K11/7774 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H05B33/14 , H01L2924/00014
摘要： A wavelength converting substance comprises a wavelength converting material particle and a transparent layer on the wavelength converting material particle. The wavelength converting substance is a material possessing both wavelength converting and light scattering properties. Thus, when the wavelength converting substance is used in a light emitting device, the brightness is improved and the light mixing is more uniform than that of a traditional package. A light emitting device and an encapsulating material comprising the wavelength converting substance are also disclosed.
摘要翻译： 波长转换物质包括波长转换材料颗粒和波长转换材料颗粒上的透明层。 波长转换物质是具有波长转换和光散射性质的材料。 因此，当在发光器件中使用波长转换物质时，亮度提高，并且光混合比传统封装更加均匀。 还公开了一种发光器件和包含波长转换物质的封装材料。
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公开(公告)号：US20070284605A1
公开(公告)日：2007-12-13
申请号：US11518936
申请日：2006-09-12
申请人： Ying-Tso Chen , Teng-Huei Huang
发明人： Ying-Tso Chen , Teng-Huei Huang
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A casting adapted to carry a light emitting diode die and an anti-static die is disclosed. The casting comprises two electrodes for opposite electrodes and a wall. The light emitting diode die is mounted one of electrodes and the anti-static die is mounted on the other electrode. The wall is arranged between the light emitting diode die and the anti-static die. Further, the height of the wall is larger than that of the anti-static die to shade the anti-static die, whereby reflecting the light emitted from the light emitting diode die. Therefore, the reflection ratio of the light emitting diode die is improved, and the intensity generated by the whole light emitting diode is also improved.
摘要翻译： 公开了一种适用于承载发光二极管管芯和抗静电管芯的铸件。 铸件包括用于相对电极和壁的两个电极。 发光二极管管芯安装在电极之一中，防静电管芯安装在另一个电极上。 壁布置在发光二极管管芯和防静电管芯之间。 此外，壁的高度大于防静电模具的高度以遮蔽防静电模具，从而反射从发光二极管管芯发射的光。 因此，发光二极管管芯的反射率提高，并且由整个发光二极管产生的强度也得到改善。
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公开(公告)号：US07288798B2
公开(公告)日：2007-10-30
申请号：US10908977
申请日：2005-06-02
申请人： Chih-Chin Chang , Teng-Huei Huang , Chien-Lung Lee
发明人： Chih-Chin Chang , Teng-Huei Huang , Chien-Lung Lee
IPC分类号： H01L29/22
CPC分类号： H01L33/648 , F21K9/00 , H01L25/0753 , H01L33/50 , H01L2224/48247 , H01L2924/181 , H01L2924/00012
摘要： Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.
摘要翻译： 这里公开了一种光模块，其包括基板，基板上的至少一个发光元件，基板上的密封盖和覆盖发光元件，以及形成在密封盖之间的空间中的流体， 发光元件和基板，使得散热快速且封装材料变黄延迟。
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公开(公告)号：US07714347B2
公开(公告)日：2010-05-11
申请号：US11518936
申请日：2006-09-12
申请人： Ying-Tso Chen , Teng-Huei Huang
发明人： Ying-Tso Chen , Teng-Huei Huang
IPC分类号： H01L29/74
CPC分类号： H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A casting adapted to carry a light emitting diode die and an anti-static die is disclosed. The casting comprises two electrodes for opposite electrodes and a wall. The light emitting diode die is mounted one of electrodes and the anti-static die is mounted on the other electrode. The wall is arranged between the light emitting diode die and the anti-static die. Further, the height of the wall is larger than that of the anti-static die to shade the anti-static die, whereby reflecting the light emitted from the light emitting diode die. Therefore, the reflection ratio of the light emitting diode die is improved, and the intensity generated by the whole light emitting diode is also improved.
摘要翻译： 公开了一种适用于承载发光二极管管芯和抗静电管芯的铸件。 铸件包括用于相对电极和壁的两个电极。 发光二极管管芯安装在电极之一中，防静电管芯安装在另一个电极上。 壁布置在发光二极管管芯和防静电管芯之间。 此外，壁的高度大于防静电模具的高度以遮蔽防静电模具，从而反射从发光二极管管芯发射的光。 因此，发光二极管管芯的反射率提高，并且由整个发光二极管产生的强度也得到改善。
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