公开(公告)号：US20130307140A1

公开(公告)日：2013-11-21

申请号：US13475674

申请日：2012-05-18

Applicant: Hui-Min HUANG ,  Yen-Chang HU ,  Chih-Wei LIN ,  Ming-Da CHENG ,  Chung-Shi LIU ,  Chen-Shien CHEN

Inventor： Hui-Min HUANG ,  Yen-Chang HU ,  Chih-Wei LIN ,  Ming-Da CHENG ,  Chung-Shi LIU ,  Chen-Shien CHEN

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/48

CPC classification number: H01L23/495 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/19 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor die. The mechanisms involve using a molding compound to attach the semiconductor die to the interposer frame and forming a redistribution layer on one or both sides of the semiconductor die. The redistribution layer(s) in the package enables fan-out connections and formation of external connection structures. Conductive columns in the interposer frame assist in thermal management.

Abstract translation: 使用插入器框架来封装半导体管芯的机构能够实现扇出结构并减小封装半导体管芯的外形尺寸。 这些机构涉及使用模制化合物将半导体管芯附接到插入器框架并在半导体管芯的一侧或两侧上形成再分布层。 封装中的再分配层可以进行扇出连接并形成外部连接结构。 插入式框架中的导电柱有助于热管理。

公开(公告)号：US20130260535A1

公开(公告)日：2013-10-03

申请号：US13476340

申请日：2012-05-21

Applicant: Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L21/78 ,  B29C53/16

CPC classification number: B29C53/18 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.

Abstract translation: 提供了用于使封装结构平坦化的机构的实施例。 这些机构涉及压平装置以及在封装结构和平坦化装置的表面之间利用保护层。 保护层由柔软和不粘的材料制成，以保护封装结构的暴露的易碎元件并且在加工之后易于分离。 扁平化过程的实施例涉及在升高的加工温度下通过压力使翘曲的包装结构变平。 在高温下进行处理可使包装结构在合理的处理时间内变平。

公开(公告)号：US20120235719A1

公开(公告)日：2012-09-20

申请号：US13422772

申请日：2012-03-16

Applicant: Hui-Min HUANG

Inventor： Hui-Min HUANG

IPC: H03L7/10

CPC classification number: H03L7/10 ,  H03L7/0891

Abstract: Nowadays, electronic product designs are aimed at saving, due to the trend to reduce energy consumption and carbon output. Ethernet technology has also been aimed specifically at saving energy; IEEE P802.3az standard (Energy Efficient Ethernet, EEE), for Ethernet released by Broadcom is one example. The disclosure turns off the phase-locked loop when the network communication stops, effectively saving the energy consumption of the network chip under the EEE standard. In the case of network reconnection, the disclosure turns on the phase-locked loop to start the network communication through adjusting the current of current source and the parameters of a low pass filter to increase the charging speed for the reference voltage generation of the low pass filter. The disclosure then shortens the start-up time to quickly output the standard output frequency and phase of the phase-locked loop.

Abstract translation: 目前，电子产品设计的目的是为了节约能源，因为降低能耗和碳输出的趋势。 以太网技术也专门用于节约能源; Broadcom发布的以太网发布的IEEE P802.3az标准（Energy Efficient Ethernet，EEE）就是一个例子。 当网络通信停止时，本公开将关闭锁相环，有效地节省了EEE标准下网络芯片的能耗。 在网络重新连接的情况下，本公开通过调节电流源的电流和低通滤波器的参数来开启锁相环以开始网络通信，以增加用于低通的参考电压产生的充电速度 过滤。 该公开然后缩短启动时间以快速输出锁相环的标准输出频率和相位。

公开(公告)号：US20130309621A1

公开(公告)日：2013-11-21

申请号：US13475790

申请日：2012-05-18

Applicant: Hui-Min HUANG ,  Chih-Wei LIN ,  Wen-Hsiung LU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Hui-Min HUANG ,  Chih-Wei LIN ,  Wen-Hsiung LU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L21/687 ,  F27D19/00 ,  F27D5/00

CPC classification number: H01L21/67288 ,  H01L21/6838

Abstract: A method for adjusting the warpage of a wafer, includes providing a wafer having a center portion and edge portions and providing a holding table having a holding area thereon for holding the wafer. The wafer is placed onto the holding table with the center portion higher than the edge portions and thereafter pressed onto the holding area such that the wafer is attracted to and held onto the holding table by self-suction force. The wafer is heated at a predetermined temperature and for a predetermined time in accordance with an amount of warpage of the wafer in order to achieve a substantially flat wafer or a predetermined wafer level.

Abstract translation: 一种用于调整晶片翘曲的方法，包括提供具有中心部分和边缘部分的晶片，并提供其上具有用于保持晶片的保持区域的保持台。 将晶片放置在保持台上，其中心部分高​​于边缘部分，然后按压到保持区域上，使得晶片通过自吸力被吸引并保持在保持台上。 根据晶片的翘曲量将晶片在预定温度下加热预定时间，以便实现基本上平坦的晶片或预定的晶片级。

公开(公告)号：US20140001652A1

公开(公告)日：2014-01-02

申请号：US13539136

申请日：2012-06-29

Applicant: Meng-Tse CHEN ,  Yu-Chih LIU ,  Hui-Min HUANG ,  Wei-Hung LIN ,  Jing Ruei LU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Meng-Tse CHEN ,  Yu-Chih LIU ,  Hui-Min HUANG ,  Wei-Hung LIN ,  Jing Ruei LU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H01L25/0652 ,  H01L21/561 ,  H01L21/563 ,  H01L23/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/15311

Abstract: A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.

Abstract translation: 提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。 第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。 第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。 第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。