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公开(公告)号：US08181302B2
公开(公告)日：2012-05-22
申请号：US12564254
申请日：2009-09-22
申请人： Hung Chih Chen , Hui Chen , Dan Zhang
发明人： Hung Chih Chen , Hui Chen , Dan Zhang
IPC分类号： A46B13/00
CPC分类号： A46B13/02 , A46B9/005 , A46B2200/3073 , A61C1/085
摘要： A method and apparatus for providing uniform pressure, friction and/or contact between a substrate and a cylindrical roller in a brush-type cleaning system is described. The apparatus includes an alignment member adapted to allow pivotal movement of the cylindrical roller based on the topography of a substrate and/or the outer surface of the cylindrical roller. The method includes positioning a substrate between two cylindrical rollers, moving each of the two cylindrical rollers to a position where at least a portion of an outer surface of each of the cylindrical rollers are in contact with the major surfaces of the substrate, and rotating one or both of the substrate and the two cylindrical rollers relative to each other while allowing a longitudinal axis of one or both of the two cylindrical rollers to pivot relative to a plane defined by one of the major surfaces of the substrate.
摘要翻译： 描述了一种用于在刷式清洁系统中在衬底和圆柱形辊之间提供均匀的压力，摩擦和/或接触的方法和装置。 该装置包括一个对准构件，该对准构件适于基于衬底的形状和/或圆柱形辊的外表面允许圆柱形辊的枢转运动。 该方法包括将基板定位在两个圆柱形辊之间，将两个圆柱滚子中的每一个移动到每个圆柱滚子的外表面的至少一部分与基板的主表面接触的位置，并且旋转一个 或两个圆柱形滚子中的两个相对于彼此同时允许两个圆柱滚子中的一个或两个的纵向轴线相对于由基板的主要表面之一限定的平面枢转。
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公开(公告)号：US20150050105A1
公开(公告)日：2015-02-19
申请号：US13882135
申请日：2012-07-25
申请人： Dan Zhang , Hui Chen , Jim K. Atkinson , Hung Chih Chen , Allen L. D'Ambra
发明人： Dan Zhang , Hui Chen , Jim K. Atkinson , Hung Chih Chen , Allen L. D'Ambra
IPC分类号： H01L21/67 , H01L21/677 , B25J11/00 , H01L21/673 , F26B25/00 , F26B25/14
CPC分类号： H01L21/67034 , B25J11/0095 , F26B25/001 , F26B25/14 , H01L21/67057 , H01L21/67326 , H01L21/67748 , H01L21/67751
摘要： Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.
摘要翻译： 本文描述的实施例通常涉及用于在化学机械抛光（CMP）工艺期间清洁衬底的蒸汽干燥器模块。 在一个实施例中，提供了一种用于处理衬底的模块。 模块包括具有外表面和限定处理体积的内表面的侧壁的槽，用于在处理体积内转移衬底的衬底支撑结构，衬底支撑结构具有至少部分地设置在处理中的第一部分 体积和在处理体积外的第二部分，以及一个或多个致动器，其设置在罐的侧壁中的一个的外表面上并且联接在支撑结构的外表面和第二部分之间，一个或多个 致动器可操作以相对于罐移动支撑结构。
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公开(公告)号：US08250695B2
公开(公告)日：2012-08-28
申请号：US12573500
申请日：2009-10-05
申请人： Lakshmanan Karuppiah , Dan Zhang , Simon Yavelberg , Jim K. Atkinson , Hung Chih Chen , Noel Manto , Jonathan Domin
发明人： Lakshmanan Karuppiah , Dan Zhang , Simon Yavelberg , Jim K. Atkinson , Hung Chih Chen , Noel Manto , Jonathan Domin
IPC分类号： A47L25/00
CPC分类号： B08B1/04
摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.
摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。
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公开(公告)号：US20110079245A1
公开(公告)日：2011-04-07
申请号：US12573500
申请日：2009-10-05
申请人： Lakshmanan Karuppiah , Dan Zhang , Simon Yavelberg , Jim K. Atkinson , Hung Chih Chen , Noel Manto , Jonathan Domin
发明人： Lakshmanan Karuppiah , Dan Zhang , Simon Yavelberg , Jim K. Atkinson , Hung Chih Chen , Noel Manto , Jonathan Domin
CPC分类号： B08B1/04
摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.
摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。
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公开(公告)号：US07044832B2
公开(公告)日：2006-05-16
申请号：US10988647
申请日：2004-11-15
申请人： Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David J. Lischka , Hung Chih Chen
发明人： Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David J. Lischka , Hung Chih Chen
IPC分类号： B24B49/00
CPC分类号： B24B37/345
摘要： Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.
摘要翻译： 提供了用于转移衬底的负载杯的实施例。 负载杯包括具有基板支撑件和去夹紧喷嘴的基座组件。 在将基板从抛光头转移到基板支撑件的过程中，去夹紧喷嘴定位成使流体在基板的抛光头和背面之间流动。
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公开(公告)号：US20130203321A1
公开(公告)日：2013-08-08
申请号：US13749554
申请日：2013-01-24
IPC分类号： B24B37/005 , B24B37/32 , B24B37/34
CPC分类号： B24B37/005 , B24B37/32 , B24B37/345
摘要： A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
摘要翻译： 用于在处理系统中传送衬底的装载杯装置包括具有衬底支撑件，致动器和控制器的基座组件。 致动器构造成将基座组件移动到与承载头的保持环接触的装载位置，并且基于由基座组件行进的距离产生保持环厚度信号。 控制器被配置为从致动器接收保持环厚度信号。
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公开(公告)号：US08460067B2
公开(公告)日：2013-06-11
申请号：US12720893
申请日：2010-03-10
IPC分类号： B24B5/00
摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
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公开(公告)号：US08376813B2
公开(公告)日：2013-02-19
申请号：US12703591
申请日：2010-02-10
IPC分类号： B24B47/26
摘要： A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
摘要翻译： 一种用于化学机械抛光的载体头，其具有基部，连接到基部的安装组件具有用于接触基底的表面和固定到基部的保持环。 保持环可以包括全氟烷氧基，聚醚酮酮，聚苯并咪唑，半结晶热塑性聚酯或由聚对苯二甲酰对苯二胺生产的长分子链分子。
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公开(公告)号：US08221193B2
公开(公告)日：2012-07-17
申请号：US12187675
申请日：2008-08-07
申请人： Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
发明人： Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
CPC分类号： B24B37/042 , B24B49/02 , B24B53/017
摘要： A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.
摘要翻译： 化学机械抛光装置包括测量系统，其在半导体晶片被处理时检测抛光垫的厚度，并且抛光垫的厚度减小。 化学机械抛光装置包括控制器，当检测到比抛光垫的相邻区域更高或更低的区域时，调节调节盘的材料去除速率。
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10.发明申请SUBSTRATE HOLDER TO REDUCE SUBSTRATE EDGE STRESS DURING CHEMICAL MECHANICAL POLISHING 审中-公开在化学机械抛光期间减少基板边缘应力的基板支架公开(公告)号：US20120021673A1
公开(公告)日：2012-01-26
申请号：US12840195
申请日：2010-07-20
CPC分类号： B24B37/32
摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.
摘要翻译： 本发明的实施方案通常涉及用于化学机械抛光衬底的方法。 所述方法通常包括将要抛光的第一衬底耦合到虚设衬底，以及去除第一衬底的背面的一部分以减小第一衬底的厚度。 第一基板和虚设基板被定位在包括可充气膜和支撑环的载体头组件中。 将第一基板放置成与抛光垫接触以减小第一基板的背面的表面粗糙度。 支撑环限制可膨胀膜的横向移动，以防止第一基底接触载体头部组件的内表面。 支撑环的尺寸设置成允许可充气膜在承载头组件内的垂直运动。
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