-
公开(公告)号:US20070138133A1
公开(公告)日:2007-06-21
申请号:US11641716
申请日:2006-12-20
CPC分类号: H01M8/1011 , H01M4/8657 , H01M4/8803 , H01M4/92 , H01M8/0239 , H01M8/0245 , H01M8/1004 , H01M8/1097 , H01M2250/30 , Y02B90/18 , Y02E60/523 , Y02P70/56
摘要: Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.
摘要翻译: 通过选自激光钻孔,蚀刻和光刻的方法,在热塑性聚合物膜中形成用于燃料电池的流路的通孔,热塑性聚合物膜的内侧表面涂覆有金属层,并且 通孔填充有燃料扩散材料和催化剂以提供阳极。 重复该过程以提供阴极。 然后,阳极和阴极彼此相对放置。 在阳极和阴极之间设置阳离子导电聚合物膜,并且阳极,阳离子导电聚合物膜和阴极被热压。
-
公开(公告)号:US20080053688A1
公开(公告)日:2008-03-06
申请号:US11896299
申请日:2007-08-30
申请人: Jun Park , Taehoon Kim , Dong Kim , Sam Her , Seung Kim
发明人: Jun Park , Taehoon Kim , Dong Kim , Sam Her , Seung Kim
CPC分类号: H05K3/4644 , H05K1/024 , H05K3/108 , H05K3/205 , H05K3/381 , H05K3/388 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0376 , H05K2203/092 , Y10T29/49155
摘要: Disclosed herein are a thin printed circuit board, in which a pair of high-functional resin substrates having a permittivity ranging from 1.5 to 4.0, on one surface of each of which a circuit pattern is formed through ion-beam surface treatment, vapor deposition and electroplating, are layered with an insulating layer interposed therebetween, and a method of manufacturing the printed circuit board. The circuit patterns are positioned inside the substrates. Thereafter, external layers are formed through ion-beam surface treatment, vapor deposition and electroplating. According to the present invention, the adhesiveness between each of the substrates and a metal layer may be improved through the ion-beam surface treatment/vapor deposition. Furthermore, since the pair of resin substrates are layered with the insulating layer interposed therebetween, the circuit patterns may be disposed inside the pair of resin substrates, so that the total thickness of the substrate may be reduced, thereby realizing highly reliable fine circuits.
摘要翻译: 这里公开了一种薄印刷电路板,其中一个表面具有介电常数范围为1.5至4.0的高功能树脂基板,每个表面上通过离子束表面处理形成电路图案,气相沉积和 电镀,其间插入有绝缘层,以及制造印刷电路板的方法。 电路图案位于基板内。 此后,通过离子束表面处理,气相沉积和电镀形成外层。 根据本发明,通过离子束表面处理/气相沉积,可以提高各基板与金属层的密合性。 此外,由于一对树脂基板被隔着绝缘层层叠,所以可以在一对树脂基板的内部设置电路图案,从而可以减小基板的总厚度,从而实现高可靠性的精细电路。
-
公开(公告)号:US20080038523A1
公开(公告)日:2008-02-14
申请号:US11878165
申请日:2007-07-20
申请人: Dong Kim , Taehoon Kim , Jong Song , Sam Her , Jun Park
发明人: Dong Kim , Taehoon Kim , Jong Song , Sam Her , Jun Park
CPC分类号: H05K3/381 , H05K1/0346 , H05K3/108 , H05K3/146 , H05K3/426 , H05K3/4644 , H05K2201/0154 , H05K2201/0959 , H05K2201/096 , H05K2203/092 , Y10S428/901 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917
摘要: Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.
摘要翻译: 这里公开了一种印刷电路板及其制造方法,其可以通过实现超薄精细电路图案来改善电性能,缩短处理时间并减小芯片封装的厚度。 印刷电路板包括绝缘材料; 形成在绝缘材料的给定位置的通孔; 通过离子束表面处理形成的铜籽晶层,并且在其中形成有通孔的绝缘材料的表面上真空沉积; 以及形成在其上形成有铜种子层的绝缘材料的给定区域上的铜图案镀层和通孔。
-
-