公开(公告)号：US11588364B2

公开(公告)日：2023-02-21

申请号：US17004180

申请日：2020-08-27

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/28 ,  H02K3/26

Abstract: A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.

公开(公告)号：US11710996B2

公开(公告)日：2023-07-25

申请号：US17445750

申请日：2021-08-24

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/28 ,  H05K1/11 ,  H02K3/26 ,  H02K1/06 ,  H02K3/04 ,  H02K15/04 ,  H01F5/00

CPC classification number: H02K3/28 ,  H02K1/06 ,  H02K3/04 ,  H02K3/26 ,  H02K15/0407 ,  H05K1/118 ,  H01F5/003 ,  H02K2203/03 ,  H02K2211/03 ,  H05K2201/10265

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.

公开(公告)号：US11557932B2

公开(公告)日：2023-01-17

申请号：US17407900

申请日：2021-08-20

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/26

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

公开(公告)号：US10937588B2

公开(公告)日：2021-03-02

申请号：US16019591

申请日：2018-06-27

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Shinobu Kato ,  Hitoshi Miwa ,  Hisashi Kato ,  Toshihiko Yokomaku

IPC: H01F27/28 ,  H01F5/00 ,  H01F17/00 ,  H02K3/00 ,  H02K41/03

Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.

公开(公告)号：US20190115130A1

公开(公告)日：2019-04-18

申请号：US16161562

申请日：2018-10-16

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Shinobu Kato ,  Hitoshi Miwa ,  Hisashi Kato ,  Toshihiko Yokomaku

IPC: H01F5/00 ,  H02K33/18 ,  H02K3/26 ,  H05K1/02 ,  H01F41/04 ,  H01F27/28

Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.

公开(公告)号：US11658534B2

公开(公告)日：2023-05-23

申请号：US17450856

申请日：2021-10-14

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/26

CPC classification number: H02K3/26 ,  H02K2203/03

Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.

公开(公告)号：US11264855B2

公开(公告)日：2022-03-01

申请号：US16685671

申请日：2019-11-15

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/26 ,  H02K3/28

Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.

公开(公告)号：US09661741B2

公开(公告)日：2017-05-23

申请号：US15189221

申请日：2016-06-22

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Shinobu Kato

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0213 ,  H05K1/0242 ,  H05K1/036 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/096

Abstract: A printed wiring board includes conductive layers, resin insulation layers, a through-hole conductor penetrating through one or more insulation layers and having a first-surface-side and second-surface-side lands, a first-surface-side signal line formed on one of the insulation layers and connecting the first-surface-side land and a conductive layer on the insulation layer, and a second-surface-side signal line formed on one of the insulation layers and connecting the second-surface-side land and a conductive layer on the insulation layer. The conductive layers include a first-surface-side conductive layer formed over the first-surface-side land such that the first-surface-side conductive layer has a solid pattern having an opening corresponding to the first-surface-side land and formed concentric with the first-surface-side land, and a second-surface-side conductive layer formed over the second-surface-side land such that the second-surface-side conductive layer has a solid pattern having an opening corresponding to the second-surface-side land and formed concentric with the second-surface-side land.

公开(公告)号：US09439289B2

公开(公告)日：2016-09-06

申请号：US13687016

申请日：2012-11-28

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Yukinobu Mikado ,  Toyotaka Shimabe ,  Shinobu Kato

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K1/11 ,  H01L23/00 ,  H05K3/46

CPC classification number: H05K1/186 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/116 ,  H05K1/185 ,  H05K3/10 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4697 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.

Abstract translation: 布线基板包括具有多个开口部分和分离开口部分的一个或多个边界部分的基板，分别位于基板的开口部分中的多个电子装置，形成在边界部分的表面上的导电图案，以及 形成在基板上的绝缘层和基板的边界部分上的导电图案，使得绝缘层覆盖基板的开口部分中的电子器件。

公开(公告)号：US09326377B2

公开(公告)日：2016-04-26

申请号：US13953150

申请日：2013-07-29

Applicant: IBIDEN Co., Ltd.

Inventor： Haruhiko Morita ,  Shinobu Kato ,  Yasuhiko Mano ,  Satoshi Kurokawa

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/0306 ,  H05K1/0219 ,  H05K1/024 ,  H05K3/4673 ,  H05K2201/0191

Abstract: A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer includes a first signal line interposed between the first and second interlayer insulating layers, a first ground layer formed on a surface of the first interlayer resin insulating layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal line is interposed between the first and second ground layers, the first and second interlayer insulating layers and the outermost interlayer insulating layer include resin materials, respectively, and the first and second interlayer insulating layers are different from the outermost interlayer insulating layer in material and/or thickness.

Abstract translation: 印刷电路板包括：第一累积层，包括第一和第二层间绝缘层;以及第二累积层，形成在第一堆积层上，并且包括最外层间绝缘层和形成在最外层间树脂绝缘层上的最外层导电层。 积层层包括插入在第一和第二层间绝缘层之间的第一信号线，形成在第一层间树脂绝缘层的表面上的第一接地层和形成在第二层间树脂绝缘层的表面上的第二接地层 使得第一信号线插入在第一和第二接地层之间，第一和第二层间绝缘层和最外层间绝缘层分别包括树脂材料，并且第一和第二层间绝缘层不同于最外层间绝缘层 材料层和/或厚度层。