-
公开(公告)号:US3489622A
公开(公告)日:1970-01-13
申请号:US3489622D
申请日:1967-05-18
Applicant: IBM
Inventor: BARSON FRED , DHAKA VIR A
CPC classification number: H01L21/00 , H01L23/291 , H01L2924/0002 , Y10S148/043 , Y10S148/145 , H01L2924/00
-
2.
公开(公告)号:US3667115A
公开(公告)日:1972-06-06
申请号:US82387669
申请日:1969-05-12
Applicant: IBM
Inventor: BARSON FRED , LEHMAN HERBERT S
IPC: H01L21/8236 , H01L23/29 , H01L27/00 , H01L27/07 , H01L29/00 , H01L29/78 , B01J17/00 , H01G13/00
CPC classification number: H01L29/7816 , H01L21/8236 , H01L23/291 , H01L27/00 , H01L27/0716 , H01L29/7838 , H01L2924/0002 , Y10S148/053 , Y10S148/145 , Y10S148/167 , Y10S438/92 , Y10S438/98 , H01L2924/00
Abstract: A method for forming a semiconductor device having a substantially cup-shaped region of one conductivity type between two regions of opposite conductivity type to preferably form a field effect transistor device. The region may be formed through one opening in an insulating layer located upon the surface of the device. Two successive diffusion operations of opposite conductivity types made through this same opening in the insulating layer forms the cup-shaped region to the desired thickness.
Abstract translation: 一种用于形成半导体器件的方法,该半导体器件具有在相反导电类型的两个区域之间具有一种导电类型的大致杯状区域,以优选形成场效应晶体管器件。 该区域可以通过位于设备表面上的绝缘层中的一个开口形成。 在绝缘层中通过相同的开口形成的相反导电类型的两个连续的扩散操作形成了杯形区域至所需的厚度。
-
3.Combined transistor and testing structures and fabrication thereof 失效
Title translation: 组合晶体管及其测试结构及其制造公开(公告)号:US3465427A
公开(公告)日:1969-09-09
申请号:US64421267
申请日:1967-06-07
Applicant: IBM
Inventor: BARSON FRED , MUTTER WALTER E
IPC: G01R31/28 , H01L21/8222 , H01L23/544 , B01J17/00 , H01L7/00
CPC classification number: H01L22/34 , G01R31/2884 , H01L21/8222 , H01L2924/3011
-
4.Method for etching an opening in an insulating layer without forming pinholes therein 失效
Title translation: 在不形成PINHOLES的情况下在绝缘层中蚀刻开放的方法公开(公告)号:US3518084A
公开(公告)日:1970-06-30
申请号:US3518084D
申请日:1967-01-09
Applicant: IBM
Inventor: BARSON FRED , KUEHN RICHARD T , PALMER MYRON D
IPC: H01L21/00 , H01L21/033 , H01L23/29 , H01L23/485 , G03C5/00 , G03C5/06
CPC classification number: H01L23/291 , H01L21/00 , H01L21/033 , H01L23/29 , H01L23/485 , H01L2924/0002 , H01L2924/00
-
5.
公开(公告)号:US3477123A
公开(公告)日:1969-11-11
申请号:US3477123D
申请日:1965-12-21
Applicant: IBM
Inventor: BARSON FRED , KUIPER LUBERTUS L
CPC classification number: H01L21/00 , H01L23/291 , H01L2924/0002 , Y10S148/043 , Y10S148/106 , Y10S148/145 , H01L2924/00
-
公开(公告)号:US3461360A
公开(公告)日:1969-08-12
申请号:US3461360D
申请日:1965-06-30
Applicant: IBM
Inventor: BARSON FRED , LEHMAN HERBERT S
IPC: H01L21/316 , H01L27/00 , H01L27/088 , H01L29/00 , H01L29/78 , H01L11/00
CPC classification number: H01L29/7816 , H01L21/02238 , H01L21/02255 , H01L21/31662 , H01L27/00 , H01L27/0883 , H01L29/1095 , H01L29/4238 , H01L29/7838 , Y10S148/145
-
-
-
-
-