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公开(公告)号:US20240023459A1
公开(公告)日:2024-01-18
申请号:US18351308
申请日:2023-07-12
发明人: Van Dai Nguyen , Eline Raymenants , Sebastien Couet , Maxwel Gama Monteiro Junior , Bob Vermeulen
CPC分类号: H10N50/10 , H10N50/01 , H10N50/85 , H10B61/00 , G11C11/161
摘要: A magnetic device may include at least two MTJ pillars, each MTJ pillar comprising a stack of a heavy metal layer portion, a second free magnetic layer portion, a spacer portion, a first free magnetic layer portion, a tunnel barrier layer portion, and a fixed magnetic layer portion, wherein at least the heavy metal layer portions, the second free magnetic layer portions and the spacer portions extend between the MTJ pillars through respectively an interconnecting heavy metal layer portion, an interconnecting second free magnetic layer portion and an interconnecting spacer portion, and wherein the interconnecting second free magnetic layer portion has an in-plane magnetization and the second free magnetic layer portions have an out-of-plane magnetization.
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公开(公告)号:US11587708B2
公开(公告)日:2023-02-21
申请号:US17038470
申请日:2020-09-30
IPC分类号: G11C11/16 , H01F10/32 , G01R33/09 , H01L27/22 , H01L43/02 , H01L43/08 , H01L43/10 , H01L43/12
摘要: In one aspect, the disclosed technology relates to a magnetic device, which may be a magnetic memory and/or logic device. The magnetic device can comprise a seed layer; a first free magnetic layer provided on the seed layer; an interlayer provided on the first free magnetic layer; a second free magnetic layer provided on the interlayer; a tunnel barrier provided on the second free magnetic layer; and a fixed magnetic layer. The first free magnetic layer and the second free magnetic layer can be ferromagnetically coupled across the interlayer through exchange interaction.
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公开(公告)号:US20210104344A1
公开(公告)日:2021-04-08
申请号:US17038470
申请日:2020-09-30
IPC分类号: H01F10/32 , G11C11/16 , H01L43/10 , H01L43/02 , H01L43/12 , H01L43/08 , H01L27/22 , G01R33/09
摘要: In one aspect, the disclosed technology relates to a magnetic device, which may be a magnetic memory and/or logic device. The magnetic device can comprise a seed layer; a first free magnetic layer provided on the seed layer; an interlayer provided on the first free magnetic layer; a second free magnetic layer provided on the interlayer; a tunnel barrier provided on the second free magnetic layer; and a fixed magnetic layer. The first free magnetic layer and the second free magnetic layer can be ferromagnetically coupled across the interlayer through exchange interaction.
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公开(公告)号:US12096700B2
公开(公告)日:2024-09-17
申请号:US16909718
申请日:2020-06-23
申请人: IMEC vzw
发明人: Sebastien Couet , Van Dai Nguyen
摘要: The disclosed technology relates generally to magnetic devices, and more particularly to magnetic memory and/or logic devices. In an aspect, a spintronic device comprises a tunnel barrier, a storage layer provided on the tunnel barrier, and a seed layer provided on the storage layer. The storage layer includes a first magnetic layer having a first crystallographic orientation provided on the tunnel barrier, a spacer layer provided on the first magnetic layer, a second magnetic layer having a second crystallographic orientation provided on the spacer layer and exchange coupled to the first magnetic layer, an antiferromagnetic coupling layer provided on the second magnetic layer, and a third magnetic layer having the second crystallographic orientation provided on the antiferromagnetic coupling layer and antiferromagnetically coupled to the second magnetic layer.
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公开(公告)号:US10325710B2
公开(公告)日:2019-06-18
申请号:US15860478
申请日:2018-01-02
申请人: IMEC VZW
发明人: Johan Swerts , Sebastien Couet
IPC分类号: G11B5/39 , H01F10/30 , H01F10/13 , H01F10/32 , H01F41/30 , H01F41/32 , B82Y10/00 , B82Y25/00 , H01L27/22
摘要: The disclosed technology generally relates to a magnetoresistive device and more particularly to a magnetoresistive device comprising chromium. According to an aspect, a method of forming a magnetoresistive device comprises forming a magnetic tunnel junction (MTJ) structure over a substrate. The MTJ structure includes, in a bottom-up direction away from the substrate, a free layer, a tunnel barrier layer and a reference layer. The method additionally includes forming a pinning layer over the MTJ structure, wherein the pinning layer pins a magnetization direction of the reference layer. The method additionally includes forming capping layer comprising chromium (Cr) over the pinning layer. The method further includes annealing the capping layer under a condition sufficient to cause diffusion of Cr from the capping layer into at least the pinning layer. According to another aspect, a magnetoresistive device is formed according to the method.
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公开(公告)号:US20210126190A1
公开(公告)日:2021-04-29
申请号:US17079264
申请日:2020-10-23
申请人: IMEC vzw
发明人: Sebastien Couet , Siddharth Rao , Robert Carpenter
摘要: The disclosed technology relates generally to a magnetic device and more particularly to a spintronic device comprising a tunnel barrier, a hybrid storage layer on the tunnel barrier and a metal layer on the hybrid storage layer. The hybrid storage layer comprises a first magnetic layer, a spacer layer on the first magnetic layer and at least one further magnetic layer on the spacer layer and exchange coupled to the first magnetic layer via the spacer layer.
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公开(公告)号:US10749106B2
公开(公告)日:2020-08-18
申请号:US15801213
申请日:2017-11-01
申请人: IMEC VZW
摘要: The disclosed technology generally relates to semiconductor devices and more particularly to semiconductor devices comprising a magnetic tunnel junction (MTJ). In an aspect, a method of forming a magnetoresistive random access memory (MRAM) includes forming a layer stack above a substrate, where the layer stack includes a ferromagnetic reference layer, a tunnel barrier layer and a ferromagnetic free layer and a spin-orbit-torque (SOT)-generating layer. The method additionally includes, subsequent to forming the layer stack, patterning the layer stack to form a MTJ pillar.
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公开(公告)号:US20180190419A1
公开(公告)日:2018-07-05
申请号:US15860478
申请日:2018-01-02
申请人: IMEC VZW
发明人: Johan Swerts , Sebastien Couet
CPC分类号: H01F10/30 , B82Y10/00 , B82Y25/00 , G11B5/3909 , H01F10/138 , H01F10/3254 , H01F41/302 , H01L27/222
摘要: The disclosed technology generally relates to a magnetoresistive device and more particularly to a magnetoresistive device comprising chromium. According to an aspect, a method of forming a magnetoresistive device comprises forming a magnetic tunnel junction (MTJ) structure over a substrate. The MTJ structure includes, in a bottom-up direction away from the substrate, a free layer, a tunnel barrier layer and a reference layer. The method additionally includes forming a pinning layer over the MTJ structure, wherein the pinning layer pins a magnetization direction of the reference layer. The method additionally includes forming capping layer comprising chromium (Cr) over the pinning layer. The method further includes annealing the capping layer under a condition sufficient to cause diffusion of Cr from the capping layer into at least the pinning layer. According to another aspect, a magnetoresistive device is formed according to the method.
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公开(公告)号:US11737371B2
公开(公告)日:2023-08-22
申请号:US17079264
申请日:2020-10-23
申请人: IMEC vzw
发明人: Sebastien Couet , Siddharth Rao , Robert Carpenter
摘要: The disclosed technology relates generally to a magnetic device and more particularly to a spintronic device comprising a tunnel barrier, a hybrid storage layer on the tunnel barrier and a metal layer on the hybrid storage layer. The hybrid storage layer comprises a first magnetic layer, a spacer layer on the first magnetic layer and at least one further magnetic layer on the spacer layer and exchange coupled to the first magnetic layer via the spacer layer.
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公开(公告)号:US20230165159A1
公开(公告)日:2023-05-25
申请号:US18058010
申请日:2022-11-22
申请人: IMEC VZW
CPC分类号: H01L43/08 , G11C11/161 , H01L43/02
摘要: The disclosure relates to spin orbit torque (SOT) magnetic random access (MRAM) devices. A magnetic structure for a SOT-MRAM device and a method for fabricating the magnetic structure are presented. The magnetic structure comprises a SOT layer and a magnetic tunnel junction (MTJ) structure arranged on the SOT layer. The SOT layer comprises a material combination of a bismuth-based material and a metal having a melting point of at least 1000° C. As a result, the SOT is thermally stable and also shows a large spin Hall angle (SHA).
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