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    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES
    1.
    发明申请
    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES 审中-公开
    涂层基板激光加工方法与系统

    公开(公告)号：US20150136744A1

    公开(公告)日：2015-05-21

    申请号：US14607991

    申请日：2015-01-28

    Applicant: IMRA America, Inc.

    Inventor： Alan Y. Arai ,  Gyu Cheon Cho ,  Jingzhou Xu

    IPC: B23K26/40 ,  B23K26/00 ,  H01L21/67

    CPC classification number: H01L21/67092 ,  B23K26/0006 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/16 ,  B23K2103/172 ,  H01L21/2686 ,  H01L21/78 ,  H01L33/0095 ,  Y10S438/94

    Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

    Abstract translation: 公开了激光加工材料的方法和系统的实例。 用于单片化包括涂覆的基底的晶片的方法和系统可以利用激光输出具有对于晶片衬底是透明的但对涂层不透明的波长的光。 使用技术来管理激光束的注量和聚焦条件，涂层和基底材料可以分别通过消融和内部修饰进行处理。 内部修改可导致管芯分离。

    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
    3.
    发明申请
    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS 审中-公开
    基于激光的材料加工方法与系统

    公开(公告)号：US20140312469A1

    公开(公告)日：2014-10-23

    申请号：US14319845

    申请日：2014-06-30

    Applicant: IMRA America, Inc.

    Inventor： Lawrence Shah ,  Gyu Cheon Cho ,  Jingzhou Xu

    IPC: B23K26/36 ,  H01L21/268 ,  B23K26/08

    CPC classification number: H01L21/268 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/083 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

    Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

    Abstract translation: 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域，使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料， 或者两者相对于以较低的重复率可获得的量减少。 超短脉冲激光系统的实施例可以包括光纤放大器或光纤激光器。 各种实施例适合于在半导体衬底上或半导体衬底内的切割，切割，划线和形成特征中的至少一个。 工件材料可以包括金属，无机或有机电介质，或任何要用飞秒，皮秒和/或纳秒脉冲微加工的材料。

    PULSED LASER MICRO-DEPOSITION PATTERN FORMATION
    4.
    发明申请
    PULSED LASER MICRO-DEPOSITION PATTERN FORMATION 审中-公开
    脉冲激光微沉积图形成

    公开(公告)号：US20140161998A1

    公开(公告)日：2014-06-12

    申请号：US14178414

    申请日：2014-02-12

    Applicant: IMRA AMERICA, INC.

    Inventor： BING LIU ,  Zhendong Hu ,  Makoto Murakami ,  Jingzhou Xu ,  Yong Che

    IPC: C23C20/04 ,  B44F1/10

    CPC classification number: C23C20/04 ,  B41M5/262 ,  B41M5/267 ,  B44F1/10 ,  C23C14/28 ,  C23C14/3435 ,  G02B26/101 ,  Y10T428/24802 ,  Y10T428/24917

    Abstract: A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.

    Abstract translation: 公开了使用脉冲激光在透明基板上形成图案的方法。 各种实施例包括超短脉冲激光器，对激光波长透明的衬底和靶板。 激光束被引导通过透明基板并聚焦在目标表面上。 目标材料被激光烧蚀并沉积在相对的基板表面上。 通过相对于目标扫描激光束来形成例如灰度图像的图案。 激光束扫描速度和扫描线密度的变化控制材料沉积并改变沉积图案的光学性质，产生灰度的视觉效果。 在一些实施例中，可以在制造过程期间在微电子器件的一部分上形成图案。 在一些实施例中，高重复率皮秒和纳秒源被配置为产生图案。

    Methods and systems for laser processing of coated substrates
    5.
    发明授权
    Methods and systems for laser processing of coated substrates 有权
    涂层基材的激光加工方法和系统

    公开(公告)号：US08969220B2

    公开(公告)日：2015-03-03

    申请号：US13714896

    申请日：2012-12-14

    Applicant: IMRA America, Inc.

    Inventor： Alan Y. Arai ,  Gyu Cheon Cho ,  Jingzhou Xu

    IPC: H01L21/268 ,  B23K26/00 ,  H01L21/78 ,  H01L33/00

    CPC classification number: H01L21/67092 ,  B23K26/0006 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/16 ,  B23K2103/172 ,  H01L21/2686 ,  H01L21/78 ,  H01L33/0095 ,  Y10S438/94

    Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

    Abstract translation: 公开了激光加工材料的方法和系统的实例。 用于单片化包括涂覆的基底的晶片的方法和系统可以利用激光输出具有对于晶片衬底是透明的但对涂层不透明的波长的光。 使用技术来管理激光束的注量和聚焦条件，涂层和基底材料可以分别通过消融和内部修饰进行处理。 内部修改可导致管芯分离。

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