公开(公告)号：US11770979B2

公开(公告)日：2023-09-26

申请号：US16024427

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Daniel Ouellette ,  Justin Brockman ,  Tofizur Rahman ,  Angeline Smith ,  Andrew Smith ,  Christopher Wiegand ,  Oleg Golonzka

IPC: H01F10/32 ,  G11C11/16 ,  H10N50/01 ,  H10N50/80 ,  H10B61/00 ,  H10N50/85

CPC classification number: H10N50/80 ,  H01F10/3286 ,  H10B61/22 ,  G11C11/161 ,  H01F10/3272 ,  H10N50/01 ,  H10N50/85

Abstract: A memory device includes a bottom electrode, a conductive layer such as an alloy including ruthenium and tungsten above the bottom electrode and a perpendicular magnetic tunnel junction (pMTJ) on the conductive layer. In an embodiment, the pMTJ includes a fixed magnet, a tunnel barrier above the fixed magnet and a free magnet on the tunnel barrier. The memory device further includes a synthetic antiferromagnetic (SAF) structure that is ferromagnetically coupled with the fixed magnet to pin a magnetization of the fixed magnet. The conductive layer has a crystal texture which promotes high quality FCC crystal texture in the SAF structure and improves perpendicular magnetic anisotropy of the fixed magnet.

公开(公告)号：US11508903B2

公开(公告)日：2022-11-22

申请号：US16022094

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Angeline Smith ,  Ian Young ,  Kaan Oguz ,  Sasikanth Manipatruni ,  Christopher Wiegand ,  Kevin O'Brien ,  Tofizur Rahman ,  Noriyuki Sato ,  Benjamin Buford ,  Tanay Gosavi

IPC: H01L43/02 ,  H01L27/22 ,  H01L43/10

Abstract: An insertion layer for perpendicular spin orbit torque (SOT) memory devices between the SOT electrode and the free magnetic layer, memory devices and computing platforms employing such insertion layers, and methods for forming them are discussed. The insertion layer is predominantly tungsten and improves thermal stability and perpendicular magnetic anisotropy in the free magnetic layer.

公开(公告)号：US20200313084A1

公开(公告)日：2020-10-01

申请号：US16367136

申请日：2019-03-27

Applicant: Intel Corporation

Inventor： Daniel Ouellette ,  Christopher Wiegand ,  Justin Brockman ,  Tofizur Rahman ,  Oleg Golonzka ,  Angeline Smith ,  Andrew Smith ,  James Pellegren ,  Michael Robinson ,  Huiying Liu

IPC: H01L43/12 ,  H01L27/22

Abstract: A memory device includes a first electrode, a conductive layer including iridium above the first electrode and a magnetic junction directly on the conductive layer. The magnetic junction further includes a pinning structure above the conductive layer, a fixed magnet above the pinning structure, a tunnel barrier on the fixed magnet, a free magnet on the tunnel barrier layer and a second electrode above the free magnet. The conductive layer including iridium and the pinning structure including iridium provide switching efficiency.

公开(公告)号：US20200313074A1

公开(公告)日：2020-10-01

申请号：US16367122

申请日：2019-03-27

Applicant: Intel Corporation

Inventor： Angeline Smith ,  Daniel Ouellette ,  Christopher Wiegand ,  Justin Brockman ,  Tofizur Rahman ,  Oleg Golonzka ,  Andrew Smith ,  James Pellegren

IPC: H01L43/02 ,  H01L43/10 ,  H01L43/12 ,  G11C11/16 ,  H01L27/22

Abstract: A memory device includes a first electrode, a second electrode and a magnetic junction between the first and the second electrode. The magnetic junction includes a first magnetic structure that includes a first magnet including an alloy of cobalt and tungsten, and a second magnet above the first magnet. The first and the second magnets are separated by a non-magnetic spacer layer. The magnetic junction further includes a layer including a metal and oxygen on the first magnetic structure. The tunnel barrier layer has an crystal texture. The magnetic junction further includes a third magnet on the tunnel barrier layer. The third magnet has a magnetization which can change in response to torque from a current tunneling through the tunnel barrier layer.

公开(公告)号：US20200006634A1

公开(公告)日：2020-01-02

申请号：US16024522

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Justin Brockman ,  Conor Puls ,  Stephen Wu ,  Christopher Wiegand ,  Tofizur Rahman ,  Daniel Ouellette ,  Angeline Smith ,  Andrew Smith ,  Pedro Quintero ,  Juan Alzate-Vinasco ,  Oleg Golonzka

IPC: H01L43/02 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12 ,  H01L21/768 ,  G11C11/16 ,  H01L27/22 ,  H01L23/528

Abstract: A memory device method of fabrication that includes a first electrode having a first conductive layer including titanium and nitrogen and a second conductive layer on the first conductive layer that includes tantalum and nitrogen. The memory device further includes a magnetic tunnel junction (MTJ) on the first electrode. In some embodiments, at least a portion of the first conductive layer proximal to an interface with the second conductive layer includes oxygen.

公开(公告)号：US11594270B2

公开(公告)日：2023-02-28

申请号：US16141827

申请日：2018-09-25

Applicant: Intel Corporation

Inventor： Tanay Gosavi ,  Sasikanth Manipatruni ,  Chia-Ching Lin ,  Dmitri Nikonov ,  Christopher Wiegand ,  Ian Young

IPC: G11C11/16 ,  G11C11/18 ,  H01L29/66

Abstract: An apparatus is provided which comprises: a magnetic junction having a magnet with perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device. In some embodiments, the apparatus comprises an interconnect partially adjacent to the structure of the magnetic junction, wherein the interconnect comprises a spin orbit material, wherein the interconnect has a pocket comprising non-spin orbit material, wherein the pocket is adjacent to the magnet of the magnetic junction. In some embodiments, the non-spin orbit material comprises metal which includes one or more of: Cu, Al, Ag, or Au.

公开(公告)号：US11476408B2

公开(公告)日：2022-10-18

申请号：US16144978

申请日：2018-09-27

Applicant: Intel Corporation

Inventor： Angeline Smith ,  Sasikanth Manipatruni ,  Christopher Wiegand ,  Tofizur Rahman ,  Noriyuki Sato ,  Benjamin Buford

IPC: H01L43/02 ,  H01L43/12 ,  H01L43/08 ,  H01L27/22 ,  H01L43/10 ,  G11C11/16

Abstract: A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit coupling material and a perpendicular magnetic tunnel junction (pMTJ) device on a portion of the electrode. The pMTJ device includes a free magnet, a fixed magnet and a tunnel barrier layer in between, where at least one of the fixed magnet or the free magnet includes two magnetic layers and a spacer layer comprising tungsten in between.

公开(公告)号：US11380838B2

公开(公告)日：2022-07-05

申请号：US16024522

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Justin Brockman ,  Conor Puls ,  Stephen Wu ,  Christopher Wiegand ,  Tofizur Rahman ,  Daniel Ouellette ,  Angeline Smith ,  Andrew Smith ,  Pedro Quintero ,  Juan Alzate-Vinasco ,  Oleg Golonzka

IPC: H01L43/02 ,  G11C11/16 ,  H01L21/768 ,  H01L23/528 ,  H01L27/22 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12

Abstract: A memory device method of fabrication that includes a first electrode having a first conductive layer including titanium and nitrogen and a second conductive layer on the first conductive layer that includes tantalum and nitrogen. The memory device further includes a magnetic tunnel junction (MTJ) on the first electrode. In some embodiments, at least a portion of the first conductive layer proximal to an interface with the second conductive layer includes oxygen.

公开(公告)号：US20200006631A1

公开(公告)日：2020-01-02

申请号：US16024411

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Noriyuki Sato ,  Tanay Gosavi ,  Justin Brockman ,  Sasikanth Manipatruni ,  Kaan Oguz ,  Kevin O'Brien ,  Christopher Wiegand ,  Angeline Smith ,  Tofizur Rahman ,  Ian Young

IPC: H01L43/02 ,  G11C11/16 ,  H01L43/10 ,  H01L43/12

Abstract: A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit coupling material and a magnetic tunnel junction (MTJ) device on a portion of the electrode. The electrode has a first SOC layer and a second SOC layer on a portion of the first SOC layer, where at least a portion of the first SOC layer at an interface with the second SOC layer includes oxygen.

公开(公告)号：US20200006626A1

公开(公告)日：2020-01-02

申请号：US16022094

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Angeline Smith ,  Ian Young ,  Kaan Oguz ,  Sasikanth Manipatruni ,  Christopher Wiegand ,  Kevin O'Brien ,  Tofizur Rahman ,  Noriyuki Sato ,  Benjamin Buford ,  Tanay Gosavi

IPC: H01L43/02 ,  H01L43/10 ,  H01L27/22

Abstract: An insertion layer for perpendicular spin orbit torque (SOT) memory devices between the SOT electrode and the free magnetic layer, memory devices and computing platforms employing such insertion layers, and methods for forming them are discussed. The insertion layer is predominantly tungsten and improves thermal stability and perpendicular magnetic anisotropy in the free magnetic layer.