公开(公告)号：US11259399B2

公开(公告)日：2022-02-22

申请号：US15901660

申请日：2018-02-21

Applicant: Intel Corporation

Inventor： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC: H01L23/367 ,  H05K1/02 ,  H01L23/498 ,  H01L23/42 ,  H01L23/373 ,  G01R1/04

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.

公开(公告)号：US20170178994A1

公开(公告)日：2017-06-22

申请号：US14975943

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Michael Hui ,  Rashelle Yee ,  Jonathan Thibado ,  Daniel P. Carter ,  Shelby Ferguson ,  Anthony P. Valpiani ,  Russell S. Aoki ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Michael Brazel ,  Tracy Clack ,  Viktor Vogman ,  Penny Woodcock ,  Kevin J. Ceurter ,  Hongfei Yan

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.

公开(公告)号：US20170186661A1

公开(公告)日：2017-06-29

申请号：US14998123

申请日：2015-12-23

Applicant: INTEL CORPORATION

Inventor： Russell S. Aoki ,  Jonathan W. Thibado ,  Jeffory L. Smalley ,  David J. Llapitan ,  Thomas A. Boyd ,  Harvey R. Kofstad ,  Dimitrios Ziakas ,  Hongfei Yan

IPC: H01L23/34 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49822 ,  H05K1/0212 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/176

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

公开(公告)号：US10318396B2

公开(公告)日：2019-06-11

申请号：US14866884

申请日：2015-09-26

Applicant: Intel Corporation

Inventor： Jiangqi He ,  Hongfei Yan ,  Chunlei Guo ,  Wei Shen

IPC: G01K7/36 ,  G01K11/26 ,  G06F11/30

Abstract: A method and device for temperature measurement of a processor is disclosed. A temperature-sensing circuit of the processor may have an associated resonance frequency, wherein the resonance frequency depends on a temperature of the temperature-sensing circuit. A temperature of the temperature-sensing circuit may be determined by determining the resonance frequency of the temperature-sensing circuit.

公开(公告)号：US10211120B2

公开(公告)日：2019-02-19

申请号：US14998123

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Jonathan W. Thibado ,  Jeffory L. Smalley ,  David J. Llapitan ,  Thomas A. Boyd ,  Harvey R. Kofstad ,  Dimitrios Ziakas ,  Hongfei Yan

IPC: H01L23/34 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

公开(公告)号：US20190045619A1

公开(公告)日：2019-02-07

申请号：US15901660

申请日：2018-02-21

Applicant: Intel Corporation

Inventor： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.