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    Press apparatus for electrode, electrode manufacturing apparatus, and electrode manufacturing method
    1.
    发明授权
    Press apparatus for electrode, electrode manufacturing apparatus, and electrode manufacturing method 有权
    压电装置，电极制造装置和电极制造方法

    公开(公告)号：US09419269B2

    公开(公告)日：2016-08-16

    申请号：US13617239

    申请日：2012-09-14

    申请人： Ikuo Uematsu ,  Masaomi Nakahata

    发明人： Ikuo Uematsu ,  Masaomi Nakahata

    IPC分类号： B30B3/00 ,  H01M4/04 ,  B30B11/16 ,  B30B3/04

    CPC分类号： H01M4/0471 ,  B30B3/005 ,  B30B3/04 ,  B30B11/165 ,  H01M4/0435 ,  Y02E60/122 ,  Y02P70/54

    摘要： According to one embodiment, a press apparatus for an electrode, includes, a press unit configured to compress an electrode sheet includes a first region formed with an electrode layer on a surface thereof and a second region on which the electrode layer is not formed, and a stretching unit includes a stretching member, which comprises a projecting surface located opposite the electrode sheet and projecting toward the electrode sheet, in a position corresponding to the second region, a retracted surface retracted from the electrode sheet relative to the projecting surface, in a position corresponding to the first region, and a relief surface retracted away from the electrode sheet, in a position corresponding to an edge portion of the electrode sheet.

    摘要翻译： 根据一个实施例，一种用于电极的压制装置包括：构造成压缩电极片的压制单元，包括在其表面上形成有电极层的第一区域和未形成电极层的第二区域，以及 拉伸单元包括拉伸构件，该拉伸构件包括与电极片相对并且朝向电极片突出的突出表面，在与第二区域相对应的位置中，相对于突出表面从电极片缩回的缩回表面， 位于与电极片的边缘部分对应的位置处，与电极片相对应的释放表面与第一区域相对应。

    Double-sided coating apparatus and double-sided coating method
    2.
    发明授权
    Double-sided coating apparatus and double-sided coating method 有权
    双面涂布装置和双面涂布方法

    公开(公告)号：US09050618B2

    公开(公告)日：2015-06-09

    申请号：US13234635

    申请日：2011-09-16

    申请人： Ikuo Uematsu ,  Masaomi Nakahata ,  Hideaki Morishima ,  Kenta Fukatsu

    发明人： Ikuo Uematsu ,  Masaomi Nakahata ,  Hideaki Morishima ,  Kenta Fukatsu

    IPC分类号： B05B7/06 ,  B05D5/00 ,  B05C1/08 ,  B05C5/02 ,  B05C9/04 ,  B05D3/12 ,  B05C11/02 ,  B05D1/26 ,  B05D3/02 ,  H01M4/04

    CPC分类号： B05C1/0843 ,  B05C5/0254 ,  B05C9/04 ,  B05C11/025 ,  B05D1/265 ,  B05D3/0254 ,  B05D3/12 ,  B05D2252/10 ,  H01M4/0402

    摘要： According to one embodiment, a double-sided coating apparatus includes a first coating head arranged on one side of a raw material to coat the one side with a coating liquid by alternately forming a coating region and a non-coating region in a direction crossing a delivery direction, a second coating head arranged on the other side of the raw material to coat the other side with the coating liquid by alternately forming the coating region and the non-coating region in the direction crossing the delivery direction, and a coating roller arranged near a position on the one side of the raw material and opposite to the second coating head across the raw material and having a large-diameter portion and a small-diameter portion with different diameters along an axial direction with the small-diameter portion opposite to the coating region and the large-diameter portion opposite to the non-coating region.

    摘要翻译： 根据一个实施方案，双面涂布装置包括：第一涂布头，其布置在原料的一侧上，用涂覆液将涂覆区域和非涂覆区域交替形成一个涂覆区域 输送方向，通过在与输送方向交叉的方向上交替地形成涂覆区域和非涂覆区域，布置在原料的另一侧的第二涂覆头，以涂覆另一侧的涂布液;以及涂布辊， 在原料一侧的位置附近并且穿过原材料与第二涂覆头相对，并且具有沿着轴向方向具有不同直径的大直径部分和小直径部分，小直径部分与小直径部分相对 涂覆区域和与非涂覆区域相对的大直径部分。

    DOUBLE-SIDED COATING APPARATUS
    3.
    发明申请
    DOUBLE-SIDED COATING APPARATUS 审中-公开
    双面涂装

    公开(公告)号：US20120204787A1

    公开(公告)日：2012-08-16

    申请号：US13370871

    申请日：2012-02-10

    申请人： Masaomi Nakahata ,  Ikuo Uematsu ,  Hideaki Morishima

    发明人： Masaomi Nakahata ,  Ikuo Uematsu ,  Hideaki Morishima

    IPC分类号： B05C11/02

    CPC分类号： B05C11/025 ,  B05C5/0254 ,  B05C9/04 ,  H01M4/0404 ,  H01M4/139

    摘要： According to one embodiment, a double-sided coating apparatus includes a transport mechanism configured to convey the substrate, a first coating head disposed on one surface side of the substrate and configured to apply the coating liquid to the coated and uncoated regions, a second coating head disposed on the other surface side of the substrate and configured to apply the coating liquid to the coated and uncoated regions, and a coating roll disposed on the one surface side of the substrate and near a position where the coating roll is opposed to the second coating head with the substrate therebetween and includes first rollers disposed on axially opposite portions, at least one second roller disposed between the first rollers, and a rotation mechanism configured to rotate the first and second rollers such that the peripheral speed of the first rollers is higher than that of the second roller.

    摘要翻译： 根据一个实施方案，双面涂布装置包括配置成输送基材的输送机构，设置在基材的一个表面侧上并构造成将涂布液施加到涂覆和未涂覆区域的第一涂料头，第二涂层 头部，其设置在基板的另一个表面侧上，并且构造成将涂布液施加到涂覆和未涂覆的区域;以及涂布辊，其设置在基板的一个表面侧上并且在涂布辊与第二个 涂覆头，其间具有基底，并且包括设置在轴向相对部分上的第一辊，设置在第一辊之间的至少一个第二辊和被配置为使第一和第二辊旋转的旋转机构，使得第一辊的圆周速度更高 而不是第二辊。

    Electronic apparatus
    6.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US08054240B2

    公开(公告)日：2011-11-08

    申请号：US11902448

    申请日：2007-09-21

    申请人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    发明人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    IPC分类号： H01Q1/24 ,  H01Q1/40

    CPC分类号： H01Q9/40 ,  H01Q9/42 ,  H01Q21/28 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/0999 ,  H05K2203/167

    摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

    摘要翻译： 电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。

    Electronic apparatus
    10.
    发明申请
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US20080150811A1

    公开(公告)日：2008-06-26

    申请号：US11902448

    申请日：2007-09-21

    申请人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    发明人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    IPC分类号： H01Q1/22

    CPC分类号： H01Q9/40 ,  H01Q9/42 ,  H01Q21/28 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/0999 ,  H05K2203/167

    摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

    摘要翻译： 电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。