摘要:
Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
摘要:
A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.
摘要:
Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
摘要:
A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.
摘要:
Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat.
摘要:
Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat.
摘要:
In a wireless multi-hop network, a transmission scheduling apparatus calculates a transmission demand of every node within the wireless multi-hop network, and allocates a time slot to each node by using the transmission demand of each node.
摘要:
A secondary battery is provided with a safety vent that can decrease the increased inner pressure of the secondary battery by being rapidly fractured when the inner pressure of the secondary battery is increased over a predetermined value. The secondary battery is constructed with a sealed outer case forming a receiving space in an inner side, an electrode assembly received in the receiving space of the outer case, a safety vent formed on one surface of the outer case, and a fracture induction part formed on the surface of the outer case and disposed at a portion of a circumference region of the safety vent. The fracture induction part is relatively thinner than the other portion of the surface of the outer case.
摘要:
In order for a source node including a vehicle multihop protocol unicast apparatus to route data to a destination node, the source node broadcasts a location request message to neighbor node and receives a location response message from the neighbor nodes in response to the location request message. Therefore, the source node routs unicast data on the basis of the location information of the destination node included in the location response message. At this time, the source node uses a location based forwarder selecting algorithm in order to select a forwarder.
摘要:
An ethylene-based copolymer for non-crosslinked water supply pipe is provided. The ethylene-based copolymer is prepared using a supported hybrid metallocene catalyst and has a dimodal or broad molecular weight distribution. The ethylene-based copolymer has a high density molecular structure in a low molecular weight and has a low density molecular structure with high content of a comonomer in a high molecular weight. The ethylene-based copolymer has a molecular weight distribution of 5-30 and the distribution of copolymerization of ethylene and C3-20 α-olefin is localized in high molecular weight chains. Accordingly, the ethylene-based copolymer has superior processability, internal pressure creep resistance at high temperatures and environmental stress crack resistance.