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    Light emitting device array and light system
    1.
    发明授权
    Light emitting device array and light system 有权
    发光元件阵列和光源系统

    公开(公告)号：US08916778B2

    公开(公告)日：2014-12-23

    申请号：US13367988

    申请日：2012-02-07

    申请人： Sangwoo Lee ,  Jiun Kong ,  Il Seo ,  Hongboem Jin ,  Dongwook Park

    发明人： Sangwoo Lee ,  Jiun Kong ,  Il Seo ,  Hongboem Jin ,  Dongwook Park

    IPC分类号： H05K1/00 ,  H05K1/05

    CPC分类号： H05K1/053 ,  F21V29/89 ,  H01L2224/48091 ,  H05K1/05 ,  H01L2924/00014

    摘要： Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).

    摘要翻译： 实施例涉及发光器件阵列。 根据实施例的发光器件阵列可以包括印刷电路板，其包括基底层，与基底层的至少一个表面接触的第一保护层，设置在基底层上的绝缘层和导电层 设置在所述绝缘层上，以及安装在所述导电层上的发光器件封装，其中所述基极层包括铁（Fe）。

    LIGHT EMITTING DEVICE ARRAY AND LIGHT SYSTEM
    2.
    发明申请
    LIGHT EMITTING DEVICE ARRAY AND LIGHT SYSTEM 有权
    发光装置阵列和光系统

    公开(公告)号：US20130039078A1

    公开(公告)日：2013-02-14

    申请号：US13367988

    申请日：2012-02-07

    申请人： Sangwoo Lee ,  Jiun Kong ,  Il Seo ,  Hongboem Jin ,  Dongwook Park

    发明人： Sangwoo Lee ,  Jiun Kong ,  Il Seo ,  Hongboem Jin ,  Dongwook Park

    IPC分类号： F21V21/00 ,  H05K1/09

    CPC分类号： H05K1/053 ,  F21V29/89 ,  H01L2224/48091 ,  H05K1/05 ,  H01L2924/00014

    摘要： Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).

    摘要翻译： 实施例涉及发光器件阵列。 根据实施例的发光器件阵列可以包括印刷电路板，其包括基底层，与基底层的至少一个表面接触的第一保护层，设置在基底层上的绝缘层和导电层 设置在所述绝缘层上，以及安装在所述导电层上的发光器件封装，其中所述基极层包括铁（Fe）。

    Light emitting device array
    3.
    发明授权
    Light emitting device array 有权

    公开(公告)号：US08735917B2

    公开(公告)日：2014-05-27

    申请号：US13443504

    申请日：2012-04-10

    申请人： Sangwoo Lee ,  Dongwook Park ,  Hongboem Jin

    发明人： Sangwoo Lee ,  Dongwook Park ,  Hongboem Jin

    IPC分类号： H01L25/075

    摘要： Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat.