Scale-type nonconstrained health condition evaluating apparatus and method
    2.
    发明授权
    Scale-type nonconstrained health condition evaluating apparatus and method 有权
    规模型无约束健康状况评估装置及方法

    公开(公告)号:US08983854B2

    公开(公告)日:2015-03-17

    申请号:US12425955

    申请日:2009-04-17

    摘要: A scale-type nonconstrained health condition evaluating apparatus includes a load cell sensor for sensing a ballistocardiogram signal and a weight signal from a measured person, an electrocardiogram sensor for sensing an electrocardiogram signal from the measured person, and a signal processor for calculating at least one of the heart rate, normalized stroke volume force, blood pressure and equilibrium sense abnormality of the measured person from the ballistocardiogram, weight and electrocardiogram signals sensed by the load cell sensor and the electrocardiogram sensor.

    摘要翻译: 比例型非约束健康状态评估装置包括用于感测来自测量人员的心搏图信号和重量信号的测力传感器,用于感测来自测量人员的心电图信号的心电图传感器,以及用于计算至少一个 的心率,来自测心者的心律的测量人员的血压,血压和平衡感觉异常,由称重传感器和心电图传感器感测到的体重和心电图信号。

    Non-contact photoplethysmographic pulse measurement device and oxygen saturation and blood pressure measurement devices using the same
    3.
    发明授权
    Non-contact photoplethysmographic pulse measurement device and oxygen saturation and blood pressure measurement devices using the same 有权
    非接触式光电体积描记术脉搏测量装置和血氧饱和度测量装置使用相同

    公开(公告)号:US09031629B2

    公开(公告)日:2015-05-12

    申请号:US12408295

    申请日:2009-03-20

    摘要: The present invention provides a non-contact photoplethysmographic (PPG) pulse measurement device, and oxygen saturation and blood pressure measurement devices using the PPG pulse measurement device. The PPG pulse measurement device includes a sensing unit including at least two light emitting units for emitting light into a human body without making direct contact with skin, and a light receiving unit for sensing reflected light. A signal separation unit separates output of the sensing unit into a ripple component and a ripple-free component. A microprocessor unit monitors the ripple-free component and compares the ripple-free component with a DC signal value. A luminance adjustment unit adjusts luminance of the light emitting units. A filter and amplification unit eliminates noise from the ripple component. An A/D conversion unit converts output of the filter and amplification unit into a digital signal. A signal transmission unit transmits output of the A/D conversion unit.

    摘要翻译: 本发明提供了使用PPG脉冲测量装置的非接触式光电容积描记术(PPG)脉冲测量装置,以及氧饱和度和血压测量装置。 PPG脉冲测量装置包括:感测单元,包括用于将光发射到人体中而不与皮肤直接接触的至少两个发光单元;以及用于感测反射光的光接收单元。 信号分离单元将感测单元的输出分离成波纹分量和无波纹分量。 微处理器单元监视无纹波分量,并将无纹波分量与直流信号值进行比较。 亮度调节单元调节发光单元的亮度。 滤波器和放大单元消除纹波分量的噪声。 A / D转换单元将滤波器和放大单元的输出转换为数字信号。 信号发送单元发送A / D转换单元的输出。

    Lead frame and light emitting device package using the same
    4.
    发明授权
    Lead frame and light emitting device package using the same 有权
    引线框架和发光器件封装使用相同

    公开(公告)号:US07855391B2

    公开(公告)日:2010-12-21

    申请号:US11701460

    申请日:2007-02-02

    IPC分类号: H01L33/00

    摘要: A lead frame and a light emitting device package using the same are disclosed. More particularly, a lead frame and a light emitting device package using the lead frame which can be easily manufactured and employ a multi-chip structure. The light emitting device package includes a first frame including a heat sink, a second frame coupled to an upper side of the first frame, the second frame including at least one pair of leads and a mount formed with a hole, and a molded structure for coupling the first and second frames to each other.

    摘要翻译: 公开了一种引线框和使用该引线框的发光器件封装。 更具体地,引线框架和使用引线框架的发光器件封装,其可以容易地制造并采用多芯片结构。 发光器件封装包括第一框架,其包括散热器,耦合到第一框架的上侧的第二框架,第二框架包括至少一对引线和形成有孔的安装件,以及用于 将第一和第二框架彼此联接。

    Method for manufacturing semiconductor device
    5.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07186655B2

    公开(公告)日:2007-03-06

    申请号:US11006187

    申请日:2004-12-07

    IPC分类号: H01L21/302

    摘要: The disclosure relates to a method for manufacturing a semiconductor device by performing a planarization process including a first CMP process using a slurry including 0.05˜0.5 wt % CeO2 or MnO2 as an abrasive and a second CMP process using a slurry including SiO2 as the other abrasive regardless of order of the processes. The CMP process is performed using the first slurry having a high polishing speed in the middle of the wafer and the second slurry having a high polishing speed at the edge of the wafer, thereby decreasing the processing cost and securing the process margin to secure yield and reliability of devices

    摘要翻译: 本公开涉及一种通过执行包括使用包含0.05〜0.5重量%的CeO 2或MnO 2作为研磨剂的浆料的第一CMP工艺的平坦化工艺和使用包含SiO 2作为其它研磨剂的浆料的第二CMP工艺来制造半导体器件的方法 不管进程的顺序。 使用在晶片中间具有高抛光速度的第一浆料和在晶片边缘具有高抛光速度的第二浆料进行CMP处理,从而降低加工成本并确保加工余量以确保产量和 设备的可靠性