摘要:
The present invention provides a non-contact photoplethysmographic (PPG) pulse measurement device, and oxygen saturation and blood pressure measurement devices using the PPG pulse measurement device. The PPG pulse measurement device includes a sensing unit including at least two light emitting units for emitting light into a human body without making direct contact with skin, and a light receiving unit for sensing reflected light. A signal separation unit separates output of the sensing unit into a ripple component and a ripple-free component. A microprocessor unit monitors the ripple-free component and compares the ripple-free component with a DC signal value. A luminance adjustment unit adjusts luminance of the light emitting units. A filter and amplification unit eliminates noise from the ripple component. An A/D conversion unit converts output of the filter and amplification unit into a digital signal. A signal transmission unit transmits output of the A/D conversion unit.
摘要:
A scale-type nonconstrained health condition evaluating apparatus includes a load cell sensor for sensing a ballistocardiogram signal and a weight signal from a measured person, an electrocardiogram sensor for sensing an electrocardiogram signal from the measured person, and a signal processor for calculating at least one of the heart rate, normalized stroke volume force, blood pressure and equilibrium sense abnormality of the measured person from the ballistocardiogram, weight and electrocardiogram signals sensed by the load cell sensor and the electrocardiogram sensor.
摘要:
A lead frame and a light emitting device package using the same are disclosed. More particularly, a lead frame and a light emitting device package using the lead frame which can be easily manufactured and employ a multi-chip structure. The light emitting device package includes a first frame including a heat sink, a second frame coupled to an upper side of the first frame, the second frame including at least one pair of leads and a mount formed with a hole, and a molded structure for coupling the first and second frames to each other.
摘要:
Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a dicyclopentadiene epoxy resin represented by Formula 1; and (c) an alkylphenol aldehyde novolak curing agent represented by Formula 2, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a brominated epoxy resin. Also, a composite substrate and a copper laminate using the same are disclosed.
摘要:
The disclosure relates to a method for manufacturing a semiconductor device by performing a planarization process including a first CMP process using a slurry including 0.05˜0.5 wt % CeO2 or MnO2 as an abrasive and a second CMP process using a slurry including SiO2 as the other abrasive regardless of order of the processes. The CMP process is performed using the first slurry having a high polishing speed in the middle of the wafer and the second slurry having a high polishing speed at the edge of the wafer, thereby decreasing the processing cost and securing the process margin to secure yield and reliability of devices