Abstract:
Provided is a method of fabricating a semiconductor device. The method includes forming a first layer, a second layer, an ion implantation layer between the first and second layers, and an anti-oxidation layer on the second layer, and performing a heat treating process to form an insulating layer between the first and second layers while preventing loss of the second layer using the anti-oxidation layer.
Abstract:
Provided is a method of fabricating a semiconductor device. The method includes forming a first layer, a second layer, an ion implantation layer between the first and second layers, and an anti-oxidation layer on the second layer, and performing a heat treating process to form an insulating layer between the first and second layers while preventing loss of the second layer using the anti-oxidation layer.
Abstract:
Provided is a method of forming optical waveguide. The method includes forming a trench on a semiconductor substrate to define an active portion, and partially oxidizing the active portion. An non-oxidized portion of the active portion is included in a core through which an optical signal passes, and an oxidized portion of the active portion is included in a cladding.
Abstract:
Provided is a method of forming optical waveguide. The method includes forming a trench on a semiconductor substrate to define an active portion, and partially oxidizing the active portion. An non-oxidized portion of the active portion is included in a core through which an optical signal passes, and an oxidized portion of the active portion is included in a cladding.
Abstract:
Provided is a semiconductor and a method for forming the same. The method includes forming a buried insulating layer locally in a substrate. The substrate is etched to form an opening exposing the buried insulating layer, and a silicon pattern spaced in at least one direction from the substrate is formed on the buried insulating layer. A first insulating layer is formed to enclose the silicon pattern.
Abstract:
Provided is a semiconductor and a method for forming the same. The method includes forming a buried insulating layer locally in a substrate. The substrate is etched to form an opening exposing the buried insulating layer, and a silicon pattern spaced in at least one direction from the substrate is formed on the buried insulating layer. A first insulating layer is formed to enclose the silicon pattern.
Abstract:
Provided is a semiconductor and a method for forming the same. The method includes forming a buried insulating layer locally in a substrate. The substrate is etched to form an opening exposing the buried insulating layer, and a silicon pattern spaced in at least one direction from the substrate is formed on the buried insulating layer. A first insulating layer is formed to enclose the silicon pattern.
Abstract:
Provided is a photodetector converting an optical signal into an electrical signal. The photodetector includes: a plurality of semiconductor layers sequentially stacked on a substrate; a plurality of photoelectric conversion units formed in the semiconductor layers, respectively, and having different spectral sensitivities from each other; and buffer layers interposed between the adjacent semiconductor layers, respectively. Each of the buffer layers alleviates stress between the adjacent semiconductor layers.
Abstract:
Provided is a focusing waveguide grating coupler using a leaky mode which can form single output beam while relieving the dependency on manufacturing processes. The focusing waveguide grating coupler of the present research includes: a substrate having a first refraction index n1; a first core layer having a second refraction index n2, the first core layer being formed on the substrate; a second core layer having a third refraction index n3, the second core layer being formed on the first core layer apart from the first core layer with a space d in between; a first cladding layer having a fourth refraction index n4, the first cladding layer being formed on the second core layer; a second cladding layer having a fifth refraction index n5, the second cladding layer being formed on the first cladding layer and inserted between the first core layer and the second core layer; and a Fresnel lens positioned on the second cladding layer, wherein the refractive indexes satisfy conditions of n5>(n2, n3)>n1 and n5>n4; and light inputted through the first and second core layers to the Fresnel lens as radiated leaky beam by a leaky mode formed according to the conditions, and the leaky beam forms an optical focus by performing single directional coupling.