公开(公告)号：US20250151363A1

公开(公告)日：2025-05-08

申请号：US19012094

申请日：2025-01-07

Applicant: Intel Corporation

Inventor： Rishabh MEHANDRU ,  Pratik A. PATEL ,  Ralph T. TROEGER ,  Szuya S. LIAO

IPC: H10D64/23 ,  H01L21/02 ,  H01L21/265 ,  H01L21/306 ,  H01L21/321 ,  H10D30/01 ,  H10D62/13 ,  H10D64/01 ,  H10D64/62 ,  H10D64/66

Abstract: Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided. The composite dielectric spacer can include, in some embodiments, a first dielectric layer and a second dielectric layer having a mutual interface. The composite dielectric spacer can separate a contact member from a conductive interconnect member, thus reducing the capacitance between such members with respect to solid assemblies that include one of first dielectric layer or the second dielectric layer. The composite dielectric spacer can permit maintaining the real estate of an interface between the conductive interconnect and a trench contact member that has an interface with a carrier-doped epitaxial layer embodying or constituting a source contact region or a drain contact region of a field effect transistor. The trench contact member can form another interface with the conductive interconnect member, providing a satisfactory contact resistance therebetween.

公开(公告)号：US20220165855A1

公开(公告)日：2022-05-26

申请号：US17667493

申请日：2022-02-08

Applicant: Intel Corporation

Inventor： Rishabh MEHANDRU ,  Pratik A. PATEL ,  Thomas T. TROEGER ,  Szuya S. LIAO

IPC: H01L29/417 ,  H01L21/02 ,  H01L21/265 ,  H01L21/306 ,  H01L21/321 ,  H01L29/08 ,  H01L29/40 ,  H01L29/45 ,  H01L29/49 ,  H01L29/66

Abstract: Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided. The composite dielectric spacer can include, in some embodiments, a first dielectric layer and a second dielectric layer having a mutual interface. The composite dielectric spacer can separate a contact member from a conductive interconnect member, thus reducing the capacitance between such members with respect to solid assemblies that include one of first dielectric layer or the second dielectric layer. The composite dielectric spacer can permit maintaining the real estate of an interface between the conductive interconnect and a trench contact member that has an interface with a carrier-doped epitaxial layer embodying or constituting a source contact region or a drain contact region of a field effect transistor. The trench contact member can form another interface with the conductive interconnect member, providing a satisfactory contact resistance therebetween.

公开(公告)号：US20200066851A1

公开(公告)日：2020-02-27

申请号：US16465489

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Rishabh MEHANDRU ,  Pratik A. PATEL ,  Thomas T. TROEGER ,  Szuya S. LIAO

IPC: H01L29/417 ,  H01L29/08 ,  H01L29/45 ,  H01L29/49 ,  H01L21/02 ,  H01L21/306 ,  H01L21/265 ,  H01L21/321 ,  H01L29/40 ,  H01L29/66

Abstract: Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided. The composite dielectric spacer can include, in some embodiments, a first dielectric layer and a second dielectric layer having a mutual interface. The composite dielectric spacer can separate a contact member from a conductive interconnect member, thus reducing the capacitance between such members with respect to solid assemblies that include one of first dielectric layer or the second dielectric layer. The composite dielectric spacer can permit maintaining the real estate of an interface between the conductive interconnect and a trench contact member that has an interface with a carrier-doped epitaxial layer embodying or constituting a source contact region or a drain contact region of a field effect transistor. The trench contact member can form another interface with the conductive interconnect member, providing a satisfactory contact resistance therebetween.

公开(公告)号：US20210050448A1

公开(公告)日：2021-02-18

申请号：US17085981

申请日：2020-10-30

Applicant: Intel Corporation

Inventor： Pratik A. PATEL ,  Mark Y. LIU ,  Jami A. WIEDEMER ,  Paul A. PACKAN

IPC: H01L29/78 ,  H01L29/66 ,  H01L21/225 ,  H01L21/324 ,  H01L29/08 ,  H01L29/24 ,  H01L29/267

Abstract: A method including forming an opening in a junction region of a fin on and extending from a substrate; introducing a doped semiconductor material in the opening; and thermal processing the doped semiconductor material. A method including forming a gate electrode on a fin extending from a substrate; forming openings in the fin adjacent opposite sides of the gate electrode; introducing a doped semiconductor material in the openings; and thermally processing the doped semiconductor material sufficient to induce the diffusion of a dopant in the doped semiconductor material. An apparatus including a gate electrode transversing a fin extending from a substrate; and semiconductor material filled openings in junction regions of the fin adjacent opposite sides of the gate electrode, wherein the semiconductor material comprises a dopant.

公开(公告)号：US20210036143A1

公开(公告)日：2021-02-04

申请号：US16306890

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Sauya S. LIAO ,  Pratik A. PATEL

IPC: H01L29/78 ,  H01L29/66 ,  H01L29/417 ,  H01L27/092

Abstract: A FET including a hybrid gate spacer separating a gate electrode from at least one of a source, a drain, or source/drain contact metallization. The hybrid spacer may include a low-k dielectric material for a reduction in parasitic capacitance. The hybrid spacer may further include one or more other dielectric materials of greater relative permittivity that may protect one or more surfaces of the low-k dielectric material from damage by subsequent transistor fabrication operations. The hybrid spacer may include a low-k dielectric material separating a lower portion of a gate electrode sidewall from the source/drain terminal, and a dielectric spacer cap separating to an upper portion of the gate electrode sidewall from the source/drain terminal. The hybrid spacer may have a lower total capacitance than conventional spacers while still remaining robust to downstream fabrication processes. Other embodiments may be described and/or claimed.

公开(公告)号：US20190245088A1

公开(公告)日：2019-08-08

申请号：US16386197

申请日：2019-04-16

Applicant: Intel Corporation

Inventor： Pratik A. PATEL ,  Mark Y. LIU ,  Jami A. WIEDEMER ,  Paul A. PACKAN

IPC: H01L29/78 ,  H01L29/66 ,  H01L21/225 ,  H01L21/324 ,  H01L29/08 ,  H01L29/267 ,  H01L29/24

CPC classification number: H01L29/7848 ,  H01L21/2253 ,  H01L21/324 ,  H01L29/0847 ,  H01L29/24 ,  H01L29/267 ,  H01L29/66492 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/66803 ,  H01L29/785 ,  H01L29/7851

Abstract: A method including forming an opening in a junction region of a fin on and extending from a substrate; introducing a doped semiconductor material in the opening; and thermal processing the doped semiconductor material. A method including forming a gate electrode on a fin extending from a substrate; forming openings in the fin adjacent opposite sides of the gate electrode; introducing a doped semiconductor material in the openings; and thermally processing the doped semiconductor material sufficient to induce the diffusion of a dopant in the doped semiconductor material. An apparatus including a gate electrode transversing a fin extending from a substrate; and semiconductor material filled openings in junction regions of the fin adjacent opposite sides of the gate electrode, wherein the semiconductor material comprises a dopant.

公开(公告)号：US20240038857A1

公开(公告)日：2024-02-01

申请号：US18378472

申请日：2023-10-10

Applicant: Intel Corporation

Inventor： Rishabh MEHANDRU ,  Pratik A. PATEL ,  Ralph T. TROEGER ,  Szuya S. LIAO

IPC: H01L29/417 ,  H01L21/02 ,  H01L21/265 ,  H01L21/306 ,  H01L21/321 ,  H01L29/08 ,  H01L29/40 ,  H01L29/45 ,  H01L29/49 ,  H01L29/66

CPC classification number: H01L29/4175 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/26513 ,  H01L21/30604 ,  H01L21/32115 ,  H01L29/0847 ,  H01L29/401 ,  H01L29/45 ,  H01L29/4991 ,  H01L29/665 ,  H01L29/6656

Abstract: Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided. The composite dielectric spacer can include, in some embodiments, a first dielectric layer and a second dielectric layer having a mutual interface. The composite dielectric spacer can separate a contact member from a conductive interconnect member, thus reducing the capacitance between such members with respect to solid assemblies that include one of first dielectric layer or the second dielectric layer. The composite dielectric spacer can permit maintaining the real estate of an interface between the conductive interconnect and a trench contact member that has an interface with a carrier-doped epitaxial layer embodying or constituting a source contact region or a drain contact region of a field effect transistor. The trench contact member can form another interface with the conductive interconnect member, providing a satisfactory contact resistance therebetween.

公开(公告)号：US20230253499A1

公开(公告)日：2023-08-10

申请号：US18134418

申请日：2023-04-13

Applicant: Intel Corporation

Inventor： Pratik A. PATEL ,  Mark Y. LIU ,  Jami A. WIEDEMER ,  Paul A. PACKAN

IPC: H01L29/78 ,  H01L29/66 ,  H01L21/225 ,  H01L21/324 ,  H01L29/08 ,  H01L29/24 ,  H01L29/267

CPC classification number: H01L29/7848 ,  H01L29/66795 ,  H01L29/66803 ,  H01L29/785 ,  H01L29/66492 ,  H01L21/2253 ,  H01L21/324 ,  H01L29/0847 ,  H01L29/24 ,  H01L29/267 ,  H01L29/66636 ,  H01L29/7851

Abstract: A method including forming an opening in a junction region of a fin on and extending from a substrate; introducing a doped semiconductor material in the opening; and thermal processing the doped semiconductor material. A method including forming a gate electrode on a fin extending from a substrate; forming openings in the fin adjacent opposite sides of the gate electrode; introducing a doped semiconductor material in the openings; and thermally processing the doped semiconductor material sufficient to induce the diffusion of a dopant in the doped semiconductor material. An apparatus including a gate electrode transversing a fin extending from a substrate; and semiconductor material filled openings in junction regions of the fin adjacent opposite sides of the gate electrode, wherein the semiconductor material comprises a dopant.

公开(公告)号：US20210050423A1

公开(公告)日：2021-02-18

申请号：US17085857

申请日：2020-10-30

Applicant: Intel Corporation

Inventor： Rishabh MEHANDRU ,  Pratik A. PATEL ,  Thomas T. TROEGER ,  Szuya S. LIAO

IPC: H01L29/417 ,  H01L21/02 ,  H01L21/265 ,  H01L21/306 ,  H01L21/321 ,  H01L29/08 ,  H01L29/40 ,  H01L29/45 ,  H01L29/49 ,  H01L29/66

Abstract: Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided. The composite dielectric spacer can include, in some embodiments, a first dielectric layer and a second dielectric layer having a mutual interface. The composite dielectric spacer can separate a contact member from a conductive interconnect member, thus reducing the capacitance between such members with respect to solid assemblies that include one of first dielectric layer or the second dielectric layer. The composite dielectric spacer can permit maintaining the real estate of an interface between the conductive interconnect and a trench contact member that has an interface with a carrier-doped epitaxial layer embodying or constituting a source contact region or a drain contact region of a field effect transistor. The trench contact member can form another interface with the conductive interconnect member, providing a satisfactory contact resistance therebetween.

公开(公告)号：US20160380102A1

公开(公告)日：2016-12-29

申请号：US15038969

申请日：2013-12-27

Applicant: Pratik PATEL ,  Jami A. WIEDEMER ,  Paul A. PACKAN ,  INTEL CORPORATION

Inventor： Pratik A. PATEL ,  Mark Y. LIU ,  Jami A. WIEDEMER ,  Paul A. PACKAN

IPC: H01L29/78 ,  H01L29/24 ,  H01L21/225 ,  H01L29/66 ,  H01L21/324 ,  H01L29/08 ,  H01L29/267

CPC classification number: H01L29/7848 ,  H01L21/2253 ,  H01L21/324 ,  H01L29/0847 ,  H01L29/24 ,  H01L29/267 ,  H01L29/66492 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/66803 ,  H01L29/785 ,  H01L29/7851

Abstract: A method including forming an opening in a junction region of a fin on and extending from a substrate; introducing a doped semiconductor material in the opening; and thermal processing the doped semiconductor material. A method including forming a gate electrode on a fin extending from a substrate; forming openings in the fin adjacent opposite sides of the gate electrode; introducing a doped semiconductor material in the openings; and thermally processing the doped semiconductor material sufficient to induce the diffusion of a dopant in the doped semiconductor material. An apparatus including a gate electrode transversing a fin extending from a substrate; and semiconductor material filled openings in junction regions of the fin adjacent opposite sides of the gate electrode, wherein the semiconductor material comprises a dopant.

Abstract translation: 一种方法，包括在鳍片的接合区域中形成开口并在基底上延伸的方法; 在开口中引入掺杂的半导体材料; 并对掺杂的半导体材料进行热处理。 一种方法，包括在从衬底延伸的翅片上形成栅电极; 在所述鳍片的邻近所述栅电极的相对侧上形成开口; 在开口中引入掺杂的半导体材料; 并且热处理足以引起掺杂半导体材料中的掺杂剂扩散的掺杂​​半导体材料。 一种装置，包括横跨从基板延伸的翅片的栅电极; 以及半导体材料填充的开口，在栅电极的相邻相邻两侧的接合区域中，其中半导体材料包括掺杂剂。