公开(公告)号：US11228480B2

公开(公告)日：2022-01-18

申请号：US15389961

申请日：2016-12-23

申请人： Intel Corporation

发明人： Yen Hsiang Chew ,  Kanapathy Murugayah ,  Jose Avalos

IPC分类号： H04L12/24 ,  H04L12/66 ,  H04L29/06

摘要： System and techniques for gateway assisted diagnostics and repair are described herein. A request for assistance may be received from a client device at a gateway device attached to a local area network (LAN) and a wide area network (WAN). The request for assistance may include an indication of an event experienced by the client device. The request for assistance may be forwarded to a management controller of the gateway device. Instructions may be transmitted to the client device via the LAN for resolving the event experienced by the client device.

公开(公告)号：US20210117865A1

公开(公告)日：2021-04-22

申请号：US17133724

申请日：2020-12-24

申请人： Intel Corporation

发明人： Yen Hsiang Chew

IPC分类号： G06N20/00 ,  G06N3/08 ,  H04L12/24 ,  H04L29/08

摘要： A method for training an analytics engine hosted by an edge server device is provided. The method includes determining a classification for data in an analytics engine hosted by an edge server and computing a confidence level for the classification. The confidence level is compared to a threshold. The data is sent to a cloud server if the confidence level is less than the threshold. A reclassification is received from the cloud server and the analytics engine is trained based, at least in part, on the data and the reclassification.

公开(公告)号：US20200068167A1

公开(公告)日：2020-02-27

申请号：US16665591

申请日：2019-10-28

申请人： INTEL CORPORATION

发明人： Yen Hsiang Chew ,  Boon Hee Thomas Kam ,  Esther Chee Hsiang Cheng ,  Ivan Yu Kit Ho

IPC分类号： H04N5/917 ,  H04N7/18 ,  H04N5/907 ,  H04N5/77 ,  H04N19/70 ,  H04N19/136 ,  H04N19/12 ,  H04N5/232 ,  H04N21/266 ,  H04N21/2187 ,  G08B13/196

摘要： Techniques for video analytics of captured video content are described. An apparatus may comprise a flash memory, a serial bus, and a processor circuit coupled to the flash memory and the serial bus. The processor circuit may comprise a multi-core central processing unit (CPU) and an integrated graphics processing unit (GPU). The processor circuit may receive captured video content via a local communication link, perform video analytics on the captured video content; and send data associated with the performed video analytics to a network interface, for communication to a remote device via a network communication link. Other examples are described and claimed.

公开(公告)号：US10553515B2

公开(公告)日：2020-02-04

申请号：US16086712

申请日：2016-04-28

申请人： Intel Corporation

发明人： Yen Hsiang Chew

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L23/488 ,  H01L23/00

摘要： Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.

公开(公告)号：US20190089939A1

公开(公告)日：2019-03-21

申请号：US15708020

申请日：2017-09-18

申请人： Intel Corporation

发明人： Yen Hsiang Chew

IPC分类号： H04N13/02 ,  H04N5/33 ,  G01B11/22

摘要： Described are mechanisms for depth sensor optimization based on detected distances. The mechanisms may comprise a distance measurement module, which may be operable to measure a physical distance between a 3D camera sensor and a person or object in view of the 3D camera. The mechanisms may also comprise a sensor mode selector module, which may be operable to select a best camera sensor configuration based on a measured distance from a distance-measurement module.

公开(公告)号：US20180359446A1

公开(公告)日：2018-12-13

申请号：US15960287

申请日：2018-04-23

申请人： INTEL CORPORATION

发明人： Yen Hsiang Chew ,  Boon Hee Thomas Kam ,  Esther Chee Hsiang Cheng ,  Ivan Yu Kit Ho

IPC分类号： H04N5/917 ,  H04N21/266 ,  H04N19/12 ,  H04N7/18 ,  H04N5/907 ,  H04N5/77 ,  H04N21/2187 ,  H04N19/136 ,  H04N19/70 ,  G08B13/196 ,  H04N5/232 ,  G06K9/00 ,  H04N5/247

CPC分类号： H04N5/917 ,  G06K9/00711 ,  G06K9/00771 ,  G08B13/19608 ,  G08B13/19645 ,  G08B13/19663 ,  G08B13/19671 ,  H04N5/232 ,  H04N5/23206 ,  H04N5/23229 ,  H04N5/247 ,  H04N5/77 ,  H04N5/907 ,  H04N7/181 ,  H04N7/183 ,  H04N19/12 ,  H04N19/136 ,  H04N19/70 ,  H04N21/2187 ,  H04N21/26603

摘要： Examples are disclosed for video analytics of captured video content. In some examples, information may be received from a host processing system for a camera to capture video content. The camera may be a surveillance camera or a camera located with a display device. Video analytics may be performed on the captured video and the captured video content may be encoded. Data associated with the video analytics may then be sent to the host processing system. In some examples, the data as well as encoded captured video content or streaming video may be sent via communication channels included in an interconnect. Other examples are described and claimed.

公开(公告)号：US20180190617A1

公开(公告)日：2018-07-05

申请号：US15396530

申请日：2016-12-31

申请人： Intel Corporation

发明人： Yen Hsiang Chew

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/528 ,  H01L23/42 ,  H01L23/053 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/053 ,  H01L23/3677 ,  H01L23/3732 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/528 ,  H01L24/17 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/15311

摘要： Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies.

公开(公告)号：US09965697B2

公开(公告)日：2018-05-08

申请号：US14715080

申请日：2015-05-18

申请人： INTEL CORPORATION

发明人： Yen Hsiang Chew

IPC分类号： G06K9/52 ,  G06T7/73 ,  G06F3/01

CPC分类号： G06K9/52 ,  G06F3/012 ,  G06F3/013 ,  G06T7/73 ,  G06T2207/30201

摘要： An object that has attracted a viewer's interest is determined using head pose and distance information. In one example a viewer's head is detected at a camera of a computing system. A distance from the head to the camera is determined. A pose of the head is determined as a yaw angle of the head. A location is determined using the distance and the yaw angle, and an object of attention is determined using the location.

公开(公告)号：US09904321B2

公开(公告)日：2018-02-27

申请号：US14778070

申请日：2014-11-12

申请人： INTEL CORPORATION

发明人： Thorsten Meyer ,  Dirk Plenkers ,  Hans-Joachim Barth ,  Bernd Waidhas ,  Yen Hsiang Chew ,  Kooi Chi Ooi ,  Howe Yin Loo

IPC分类号： G06F1/16 ,  B29C39/02 ,  B29C39/10 ,  B29C65/48 ,  G02C5/14 ,  G02C11/00 ,  B29L31/34

CPC分类号： G06F1/163 ,  B29C39/021 ,  B29C39/10 ,  B29C65/4825 ,  B29L2031/3481 ,  G02C5/143 ,  G02C11/10

摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US09778688B2

公开(公告)日：2017-10-03

申请号：US14779300

申请日：2014-11-12

申请人： INTEL CORPORATION

发明人： Jiamiao Tang ,  Junfeng Zhao ,  Michael P. Skinner ,  Yong She ,  Jiun Hann Sir ,  Bok Eng Cheah ,  Shanggar Periaman ,  Kooi Chi Ooi ,  Yen Hsiang Chew

IPC分类号： H01L23/48 ,  G06F1/16 ,  H01L23/31 ,  A41B1/00 ,  A41D1/06 ,  A41D1/08 ,  A41F9/00 ,  A43B3/00 ,  A43B7/14 ,  A44C5/00 ,  A44C15/00 ,  F03G5/06 ,  G06F1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H02J1/14 ,  H05K1/18

CPC分类号： G06F1/163 ,  A41B1/00 ,  A41D1/002 ,  A41D1/06 ,  A41D1/08 ,  A41F9/002 ,  A43B3/001 ,  A43B3/0015 ,  A43B7/141 ,  A44C5/0015 ,  A44C15/005 ,  F03G5/06 ,  G06F1/189 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/0002 ,  H01L2924/181 ,  H02J1/14 ,  H05K1/189 ,  H05K2201/05 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.