公开(公告)号：US20220285898A1

公开(公告)日：2022-09-08

申请号：US17751080

申请日：2022-05-23

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US09921694B2

公开(公告)日：2018-03-20

申请号：US14778142

申请日：2014-12-16

Applicant: Intel Corporation

Inventor： Sven Albers ,  Klaus Reingruber ,  Teodora Ossiander ,  Andreas Wolter ,  Sonja Koller ,  Georg Seidemann ,  Jan Proschwitz ,  Hans-Joachim Barth ,  Bastiaan Elshof

IPC: G09G5/00 ,  G06F3/044 ,  H04B1/3827 ,  G01L1/24 ,  G06F1/16 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F3/0354

CPC classification number: G06F3/044 ,  G01L1/24 ,  G06F1/163 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F2203/04102 ,  G06F2203/04109 ,  H04B1/385

Abstract: Some forms relate to wearable computing devices that include a “touch pad” like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

公开(公告)号：US09373588B2

公开(公告)日：2016-06-21

申请号：US14034854

申请日：2013-09-24

Applicant: Intel Corporation

Inventor： Reinhard Mahnkopf ,  Wolfgang Molzer ,  Bernd Memmler ,  Edmund Goetz ,  Hans-Joachim Barth ,  Sven Albers ,  Thorsten Meyer

IPC: H01L29/40 ,  H01L23/538 ,  H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5389 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/03 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2224/16148 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract translation: 本说明书的实施例包括嵌入在微电子衬底中的堆叠微电子骰子及其制造方法。 在一个实施例中，至少一个第一微电子管芯连接到第二微电子管芯，其中在第二微电子管芯和至少一个第一微电子管芯之间提供底部填充材料。 然后通过将第一微电子管芯和第二微电子管芯层压在衬底材料中来形成微电子衬底。

公开(公告)号：US20160056384A1

公开(公告)日：2016-02-25

申请号：US14931764

申请日：2015-11-03

Applicant: INTEL CORPORATION

Inventor： Hans-Joachim Barth

IPC: H01L51/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L51/0048 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/768 ,  H01L21/76805 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49872 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/53276 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L29/1606 ,  H01L2221/1094 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及集成电路组件中的混合碳 - 金属互连结构的技术和配置。 在一个实施例中，一种装置包括衬底，设置在衬底上并被配置为用作石墨烯层和石墨烯层的生长起始层的金属互连层，其中，石墨烯层直接形成在金属互连层上， 金属互连层和石墨烯层被配置为路由电信号。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20210044065A1

公开(公告)日：2021-02-11

申请号：US17077540

申请日：2020-10-22

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US20180157289A1

公开(公告)日：2018-06-07

申请号：US15870819

申请日：2018-01-12

Applicant: INTEL CORPORATION

Inventor： Thorsten Meyer ,  Dirk Plenkers ,  Hans-Joachim Barth ,  Bernd Waidhas ,  Yen Hsiang Chew ,  Kooi Chi Ooi ,  Howe Yin Loo

IPC: G06F1/16 ,  G02C11/00 ,  G02C5/14 ,  B29C39/02 ,  B29C65/48 ,  B29C39/10 ,  B29L31/34

CPC classification number: G06F1/163 ,  B29C39/021 ,  B29C39/10 ,  B29C65/4825 ,  B29L2031/3481 ,  G02C5/143 ,  G02C11/10

Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the users skin in the portion of the users body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the users body, the second electrode is arranged to not contact the users skin in the portion of the users body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US09564400B2

公开(公告)日：2017-02-07

申请号：US15009731

申请日：2016-01-28

Applicant: Intel Corporation

Inventor： Reinhard Mahnkopf ,  Wolfgang Molzer ,  Bernd Memmler ,  Edmund Goetz ,  Hans-Joachim Barth ,  Sven Albers ,  Thorsten Meyer

IPC: H01L21/44 ,  H01L23/538 ,  H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5389 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/03 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2224/16148 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract translation: 本说明书的实施例包括嵌入在微电子衬底中的堆叠微电子骰子及其制造方法。 在一个实施例中，至少一个第一微电子管芯连接到第二微电子管芯，其中在第二微电子管芯和至少一个第一微电子管芯之间提供底部填充材料。 然后通过将第一微电子管芯和第二微电子管芯层压在衬底材料中来形成微电子衬底。

公开(公告)号：US20160224148A1

公开(公告)日：2016-08-04

申请号：US14778142

申请日：2014-12-16

Applicant: Intel Corporation

Inventor： Sven ALBERS ,  Klaus Reingruber ,  Teodora Ossiander ,  Andreas Wolter ,  Sonja Koller ,  Georg Seidemann ,  Jan Proschwitz ,  Hans-Joachim Barth ,  Bastiaan Elshof

IPC: G06F3/044 ,  H04B1/3827

CPC classification number: G06F3/044 ,  G01L1/24 ,  G06F1/163 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F2203/04102 ,  G06F2203/04109 ,  H04B1/385

Abstract: Some forms relate to wearable computing devices that include a “touch pad” like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

Abstract translation: 一些形式涉及包括诸如接口的“触摸板”的可穿戴计算设备。 在一些形式中，可穿戴式计算设备的示例可以与（或附着）纺织品（即服装）集成。 在其他形式中，可穿戴式计算设备的示例可以直接附接到使用任何示例性可穿戴计算设备的某人的皮肤（即类似于绷带）。 示例性可穿戴计算设备包括柔性触摸板，其可以允许可穿戴计算设备的用户更容易地操作可穿戴式计算设备。 本文所述的示例性可穿戴计算设备可以包括各种电子设备。 一些示例包括电源和/或其他类型的电子设备中的通信设备。

公开(公告)号：US11342720B2

公开(公告)日：2022-05-24

申请号：US17077540

申请日：2020-10-22

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US10886680B2

公开(公告)日：2021-01-05

申请号：US16259640

申请日：2019-01-28

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.