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公开(公告)号：US11906574B2
公开(公告)日：2024-02-20
申请号：US17369180
申请日：2021-07-07
发明人： Stephen Michael Hugo , Theron Lee Lewis , Timothy Jennings , Timothy P. Younger , David J. Braun , Jennifer I. Bennett , John R. Dangler , James D. Bielick
CPC分类号： G01R31/281 , G01B7/20 , H01R12/57 , H05K1/111 , H05K3/4007 , H05K2201/068 , H05K2201/10734
摘要： Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.
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公开(公告)号：US20230009784A1
公开(公告)日：2023-01-12
申请号：US17369180
申请日：2021-07-07
发明人： Stephen Michael Hugo , Theron Lee Lewis , Timothy Jennings , Timothy P. Younger , David J. Braun , Jennifer I. Bennett , John R. Dangler , James D. Bielick
摘要： Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.
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公开(公告)号：US12100910B2
公开(公告)日：2024-09-24
申请号：US17457737
申请日：2021-12-06
发明人： Theron Lee Lewis , David J. Braun , James D. Bielick , John R. Dangler , Timothy P. Younger , Timothy Jennings , Jennifer I. Bennett , Stephen Michael Hugo
IPC分类号： H01R13/516 , H01R12/57 , H01R43/02
CPC分类号： H01R13/516 , H01R43/0256 , F16B2200/77 , H01R12/57
摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.
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公开(公告)号：US11699884B2
公开(公告)日：2023-07-11
申请号：US16939135
申请日：2020-07-27
发明人： David J. Braun , John R. Dangler , Timothy P. Younger , James D. Bielick , Stephen Michael Hugo , Theron Lee Lewis , Jennifer I. Bennett , Timothy Jennings
IPC分类号： H01R13/00 , H01R13/6595 , H05K1/02 , H05K9/00 , H01R12/70 , H05K7/20 , H01R12/58 , H01R11/18
CPC分类号： H01R13/6595 , H01R12/7064 , H05K1/0209 , H05K7/20 , H05K9/0028 , H01R11/18 , H01R12/585 , Y10S439/948
摘要： An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.
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公开(公告)号：US11445650B2
公开(公告)日：2022-09-13
申请号：US16659701
申请日：2019-10-22
发明人： Theron Lee Lewis , Jennifer I. Bennett , James D. Bielick , David J. Braun , John R. Dangler , Stephen Michael Hugo , Timothy Jennings , Timothy P. Younger
摘要： Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.
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公开(公告)号：US20220029361A1
公开(公告)日：2022-01-27
申请号：US16939135
申请日：2020-07-27
发明人： David J. Braun , John R. Dangler , Timothy P. Younger , James D. Bielick , Stephen Michael Hugo , Theron Lee Lewis , Jennifer I. Bennett , Timothy Jennings
IPC分类号： H01R13/6595 , H05K1/02 , H01R12/58 , H01R12/70 , H05K9/00
摘要： An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.
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公开(公告)号：US09714870B2
公开(公告)日：2017-07-25
申请号：US13739994
申请日：2013-01-11
CPC分类号： G01K13/00 , B23K1/0016 , B23K1/008 , B23K1/015 , G01K3/005 , H05K3/34 , H05K13/0465 , H05K13/08 , H05K13/082 , H05K13/083 , H05K2203/04 , H05K2203/162
摘要： An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.
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公开(公告)号：US20140198424A1
公开(公告)日：2014-07-17
申请号：US13739994
申请日：2013-01-11
CPC分类号： G01K13/00 , B23K1/0016 , B23K1/008 , B23K1/015 , G01K3/005 , H05K3/34 , H05K13/0465 , H05K13/08 , H05K13/082 , H05K13/083 , H05K2203/04 , H05K2203/162
摘要： An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.
摘要翻译： 根据本发明的装置可以包括放置在其上形成印刷电路板组件的印刷电路板上的一个或多个熔丝。 每个保险丝响应于超过阈值温度的环境热条件而变化。 可以在诸如焊接组装工艺的过程之后用诸如在线测试仪中的测试装置来检测变化，以确定该过程是否在期望的温度范围内执行。 保险丝可以位于印刷电路板上的不同位置，以提供局部和区别的温度测量。 可以设计一系列保险丝以在环境温度的进行顺序上改变以使记录过程温度的趋势。 可以记录温度数据并将其链接到设备上的标识符，例如产品序列号。
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公开(公告)号：US20240170903A1
公开(公告)日：2024-05-23
申请号：US18057418
申请日：2022-11-21
发明人： Theron Lee Lewis , Timothy P. Younger , David J. Braun , James D. Bielick , John R. Dangler , Stephen Michael Hugo , Timothy Jennings
IPC分类号： H01R43/20
CPC分类号： H01R43/205
摘要： A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.
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公开(公告)号：US20230178922A1
公开(公告)日：2023-06-08
申请号：US17457737
申请日：2021-12-06
发明人： Theron Lee Lewis , David J. Braun , James D. Bielick , John R. Dangler , Timothy P. Younger , Timothy Jennings , Jennifer I. Bennett , Stephen Michael Hugo
IPC分类号： H01R13/516 , H01R43/02 , F16B1/00 , H01R12/57
CPC分类号： H01R13/516 , H01R43/0256 , F16B1/0014 , H01R12/57
摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.
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