Laminated magnetic head core
    1.
    发明授权
    Laminated magnetic head core 失效
    层压磁头芯

    公开(公告)号:US5600520A

    公开(公告)日:1997-02-04

    申请号:US441947

    申请日:1995-05-16

    摘要: In a laminated magnetic head core, Fe--M--N system soft magnetic thin films (M being at least one element selected from the group consisting of Ta, Nb, Zr, and Hf) and non-magnetic insulating films are alternately laminated. Each of the soft magnetic thin films is 0.2-10 .mu.m thick. Each of the non-magnetic insulating films is 10 through 1000 nm thick. One of the soft magnetic thin films shows high magnetic permeability in a different direction from that of an adjacent soft magnetic thin film via the non-magnetic insulating film within a film surface of the soft magnetic thin film.

    摘要翻译: 在层叠磁头芯中,交替层叠Fe-M-N系软磁薄膜(M为选自Ta,Nb,Zr和Hf中的至少一种元素)和非磁性绝缘膜。 每个软磁薄膜的厚度为0.2-10μm。 每个非磁性绝缘膜的厚度为10〜1000nm。 一个软磁性薄膜通过软磁性薄膜的膜表面内的非磁性绝缘膜,在与相邻的软磁性薄膜的方向不同的方向上表现出高的磁导率。

    Method for making soft magnetic film
    2.
    发明授权
    Method for making soft magnetic film 失效
    制造软磁膜的方法

    公开(公告)号:US5403457A

    公开(公告)日:1995-04-04

    申请号:US111055

    申请日:1993-08-24

    摘要: The method of the invention provides a soft magnetic film having a high saturation magnetic flux density and an anisotropy of high magnetic permeability suitable for use in various types of magnetic heads at a high production yield by use of a sputtering apparatus provided with a sputtering electrode, which has permanent magnets arranged above a target 1 mainly of Fe or Co in such a way that lines of magnetic force 3 generated by said permanent magnets are in parallel to the surface of said target 1 and to the center line of said target 1 and have a magnetic strength pattern symmetric with respect to said center line while the lines of magnetic force to the right of said center line are of a reverse direction to those to the left of said center line.

    摘要翻译: 本发明的方法通过使用具有溅射电极的溅射装置,提供了一种具有高饱和磁通密度和高磁导率的各向异性的软磁性膜,其适用于各种类型的磁头,以高产率生产, 其具有主要以Fe或Co布置在目标1上方的永磁体,使得由所述永磁体产生的磁力线3平行于所述目标1的表面和所述目标1的中心线并且具有 相对于所述中心线对称的磁强度图案,而所述中心线右侧的磁力线与所述中心线左侧的磁力线相反。

    Sputtering apparatus
    4.
    发明授权
    Sputtering apparatus 失效
    溅射装置

    公开(公告)号:US5609739A

    公开(公告)日:1997-03-11

    申请号:US362778

    申请日:1994-12-23

    IPC分类号: C23C14/35 H01J37/34 C23C14/34

    摘要: A sputtering apparatus for performing sputtering operation by using a rectangular target made of ferromagnetic material, the apparatus includes an electrode in which one first permanent magnet is disposed on each side edge of a front surface of the target, polarities of the first magnets confronting each other with the target interposed between the first magnets are opposite to each other, one second permanent magnet is disposed on each side edge of a rear surface of the target, polarities of the second magnets confronting each other with the target interposed between the second magnets are opposite to each other, and the polarity of each second magnet disposed on the rear surface of the target is the same as that of the first magnet disposed on the front surface of the target.

    摘要翻译: 一种用于通过使用由铁磁材料制成的矩形靶进行溅射操作的溅射装置,该装置包括:电极,其中一个第一永磁体设置在靶的前表面的每个侧边缘上,第一磁体彼此面对的极性 夹在第一磁体之间的目标彼此相对,在目标的后表面的每个侧边缘上设置一个第二永磁体,并且夹在第二磁体之间的目标彼此面对的第二磁体的极性相反 并且设置在靶的后表面上的每个第二磁体的极性与设置在靶的前表面上的第一磁体的极性相同。

    Sputtering electrode
    5.
    发明授权
    Sputtering electrode 失效
    溅射电极

    公开(公告)号:US5512156A

    公开(公告)日:1996-04-30

    申请号:US265019

    申请日:1994-06-24

    IPC分类号: C23C14/35 H01J37/34

    摘要: A magnetron sputtering electrode assembly which is used in a sputtering system having a rectangular flat-plate target, includes permanent magnets arranged along the longitudinal edges of the target to pass lines of magnetic forces in parallel to the surface of the rectangular flat-plate target, and a driving device for reversing polarity of the magnets to change by 180 degrees the direction of the lines of magnetic force caused by the permanent magnets passing in parallel to the surface of the rectangular flat-plate target.

    摘要翻译: 在具有矩形平板靶的溅射系统中使用的磁控溅射电极组件包括沿着靶的纵向边缘布置的永磁体,以平行于矩形平板靶的表面传递磁力线, 以及驱动装置,用于使磁铁的极性反转,使永磁体平行于矩形平板靶的表面产生的磁力线的方向变化180度。

    Sputtering apparatus and method
    6.
    发明授权
    Sputtering apparatus and method 失效
    溅射装置和方法

    公开(公告)号:US5626727A

    公开(公告)日:1997-05-06

    申请号:US504516

    申请日:1995-07-20

    CPC分类号: H01J37/347 H01J37/3405

    摘要: A sputtering apparatus uses a plurality of rectangular targets to form a thin film on a substrate, and includes a plurality of magnets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the targets are opposite, and polarities of the magnets confronting each other across the targets are opposite. The surfaces of at least two targets are inclined to a surface of the substrate at an angle not smaller than 30.degree. and not larger than 60.degree..

    摘要翻译: 溅射装置使用多个矩形目标在基板上形成薄膜,并且包括沿着目标的两个侧边缘设置的多个磁体,使得沿着靶的侧边缘的相邻磁体的极性为 相反的,并且彼此面对的磁体的极性相反。 至少两个靶的表面以不小于30°并且不大于60°的角度倾斜到基底的表面。

    Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition
    8.
    发明授权
    Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition 失效
    通过物理气相沉积沉积法和通过物理气相沉积沉积处理的目标物

    公开(公告)号:US08419911B2

    公开(公告)日:2013-04-16

    申请号:US11339506

    申请日:2006-01-26

    IPC分类号: C23C14/06

    CPC分类号: C23C14/3414 H01J37/3423

    摘要: A deposition apparatus includes a processing chamber internally having a reduced-pressure space for deposition process to be carried out therein, a base material holding member for holding a base material to be subjected to the deposition process, a target support member for supporting a target thereon, and a power supply unit for applying electric power to the target support member to generate a plasma in the reduced-pressure space. In the deposition apparatus, deposition process is carried out by using the target, which has a recess portion in its surface and in which a powder target formed of a powder material is placed in an inner surface of the recess portion. Thus, the in-plane uniformity of deposition rate is improved and a stable film deposition is fulfilled.

    摘要翻译: 沉积装置包括内部具有用于在其中进行沉积处理的减压空间的处理室,用于保持要进行沉积处理的基底材料的基材保持构件,用于支撑靶材的靶支撑构件 以及用于向目标支撑构件施加电力以在减压空间中产生等离子体的电源单元。 在沉积装置中,通过使用在其表面上具有凹部的靶,并且由粉末材料形成的粉末靶放置在凹部的内表面中来进行沉积工艺。 因此,提高了沉积速率的面内均匀性,并且实现了稳定的膜沉积。

    Partial pressure measuring method and partial pressure measuring apparatus
    9.
    发明授权
    Partial pressure measuring method and partial pressure measuring apparatus 有权
    部分压力测量方法和分压测量仪器

    公开(公告)号:US07814796B2

    公开(公告)日:2010-10-19

    申请号:US12103763

    申请日:2008-04-16

    IPC分类号: G01L9/00

    摘要: Provided is a partial pressure measuring method and a partial pressure measuring apparatus by which a partial pressure distribution is easily measured in a vacuum chamber. The partial pressure measuring method and the partial pressure measuring apparatus includes: moving a local plasma source dedicated to partial pressure measuring provided in the vacuum chamber, to a location at which the measuring is to be performed; and measuring a partial pressure distribution in the vacuum chamber, by receiving emission of plasma generated by the local plasma source through a window which is formed in a wall part of the vacuum chamber and through which the emission passes, and thereby performing emission spectral analysis on intensity of the emission.

    摘要翻译: 提供了一种分压测量方法和分压测量装置,通过该分压测量方法在真空室中容易地测量分压。 分压测量方法和分压测量装置包括:将专用于设置在真空室中的分压测量的局部等离子体源移动到要进行测量的位置; 并且通过接收由局部等离子体源产生的等离子体通过形成在真空室的壁部分中的窗口并发射通过的窗口来测量真空室中的分压分布,从而对 发射强度。

    Semiconductor device and method for manufacturing semiconductor device
    10.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device 有权
    半导体装置及半导体装置的制造方法

    公开(公告)号:US08471367B2

    公开(公告)日:2013-06-25

    申请号:US13377940

    申请日:2010-11-01

    摘要: A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer (H) and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.

    摘要翻译: 半导体器件包括第一氧化物膜上的第二氧化物膜和焊盘电极,所述第一氧化物膜形成在半导体衬底的前表面上,接触电极和形成在第二氧化物膜中并连接到焊盘电极的第一势垒层, 在所述接触电极和通孔电极层之间形成并连接到所述接触电极和所述第一阻挡层的硅化物部分,从所述半导体衬底的背面延伸到达所述硅化物部分和所述第二氧化物膜的通孔, 形成在所述通孔的侧壁上和所述半导体衬底的背面上的第三氧化物膜,以及形成在所述通孔内部和所述半导体衬底的背面上的第二阻挡层(H)和再布线层,并且连接 到硅化物部分。