PATTERN-FORMING METHOD
    4.
    发明申请
    PATTERN-FORMING METHOD 有权
    图案形成方法

    公开(公告)号:US20150191829A1

    公开(公告)日:2015-07-09

    申请号:US14591323

    申请日:2015-01-07

    Abstract: A pattern-forming method includes providing a metal-containing film directly or indirectly on a substrate. A directed self-assembling film is provided directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed. At least a part of the plurality of phases of the directed self-assembling film is removed such that a pattern of the directed self-assembling film is formed. The metal-containing film and the substrate are sequentially etched using the pattern of the directed self-assembling film as a mask.

    Abstract translation: 图案形成方法包括直接或间接地在基底上提供含金属的膜。 直接或间接地在含金属膜上提供定向自组装膜,从而形成定向自组装膜的多个相。 定向自组装膜的多个相的至少一部分被去除,从而形成定向自组装膜的图案。 使用定向自组装膜的图案作为掩模,依次蚀刻含金属膜和基板。

    METHOD FOR FORMING PATTERN
    5.
    发明申请
    METHOD FOR FORMING PATTERN 有权
    形成图案的方法

    公开(公告)号:US20130164695A1

    公开(公告)日:2013-06-27

    申请号:US13769907

    申请日:2013-02-19

    CPC classification number: G03F7/0035 G03F7/0397 G03F7/2024 G03F7/2041 G03F7/40

    Abstract: A method for forming a pattern includes providing a first positive-working radiation-sensitive resin composition on a substrate to form a first resist layer. The first positive-working radiation-sensitive resin composition includes a crosslinking agent, a polymer containing an acid-unstable group and not containing a crosslinking group, a radiation-sensitive acid generator, and a solvent. The first resist layer is exposed selectively to radiation, and developed to form a first resist pattern. The first resist pattern is made inactive to radiation, or insolubilized in an alkaline developer or in a second positive-working radiation-sensitive resin composition. The second positive-working radiation-sensitive resin composition is provided on the substrate to form a second resist layer. The second resist layer is exposed selectively to radiation, and developed to form a second resist pattern in the space area of the first resist pattern.

    Abstract translation: 形成图案的方法包括在基板上提供第一正性辐射敏感树脂组合物以形成第一抗蚀剂层。 第一正性辐射敏感性树脂组合物包含交联剂,含有酸不稳定基团并且不含交联基团的聚合物,辐射敏感性酸产生剂和溶剂。 第一抗蚀剂层选择性地暴露于辐射,并显影以形成第一抗蚀剂图案。 第一抗蚀剂图案对辐射无活性,或在碱性显影剂或第二正性辐射敏感树脂组合物中不溶化。 第二正性辐射敏感性树脂组合物设置在基板上以形成第二抗蚀剂层。 第二抗蚀剂层选择性地暴露于辐射,并显影以在第一抗蚀剂图案的空间区域中形成第二抗蚀剂图案。

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