NEGATIVE RESIST PATTERN-FORMING METHOD, AND COMPOSITION FOR UPPER LAYER FILM FORMATION
    4.
    发明申请
    NEGATIVE RESIST PATTERN-FORMING METHOD, AND COMPOSITION FOR UPPER LAYER FILM FORMATION 审中-公开
    负电阻图案形成方法和上层膜形成的组成

    公开(公告)号:US20160299432A1

    公开(公告)日:2016-10-13

    申请号:US15095774

    申请日:2016-04-11

    CPC classification number: G03F7/11 G03F7/0046 G03F7/0397 G03F7/2041 G03F7/325

    Abstract: Provided is a negative resist pattern-forming method that enables a resist pattern with fewer development defects to be formed while favorable water repellency of the surface of the upper layer film is maintained. A negative resist pattern-forming method includes the steps of: forming a resist film using a radiation-sensitive resin composition; forming an upper layer film on one face of the resist film using a composition for upper layer film formation; subjecting the resist film having the upper layer film formed thereon to liquid immersion lithography; and developing the resist film subjected to the liquid immersion lithography with a developer solution containing an organic solvent, wherein at least one of the radiation-sensitive resin composition and the composition for upper layer film formation contains a fluorine atom.

    Abstract translation: 提供一种抗蚀剂图案形成方法,其能够形成具有较少显影缺陷的抗蚀剂图案,同时保持上层膜的表面的有利的拒水性。 负型抗蚀剂图案形成方法包括以下步骤:使用辐射敏感性树脂组合物形成抗蚀剂膜; 使用上层成膜用组合物在抗蚀剂膜的一个面上形成上层膜; 对其上形成有上层膜的抗蚀剂膜进行液浸光刻; 以及使用含有有机溶剂的显影剂溶液进行液浸光刻的抗蚀剂膜,其中至少一种辐射敏感性树脂组合物和上层成膜用组合物含有氟原子。

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