COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM AND RESIST UNDERLAYER FILM-FORMING METHOD, AND PATTERN-FORMING METHOD
    1.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM AND RESIST UNDERLAYER FILM-FORMING METHOD, AND PATTERN-FORMING METHOD 审中-公开
    用于形成电阻膜的组合物,电阻膜和电阻膜形成方法,以及图案形成方法

    公开(公告)号:US20150198882A9

    公开(公告)日:2015-07-16

    申请号:US14290744

    申请日:2014-05-29

    CPC classification number: G03F7/0384 B05D3/0254 C08G65/4006 G03F7/094 G03F7/11

    Abstract: A composition for forming a resist underlayer film includes a polymer having a structural unit represented by a formula (1). Ar1, Ar2, Ar3 and Ar4 each independently represent a divalent aromatic hydrocarbon group or a divalent heteroaromatic group. A part or all of hydrogen atoms included in the divalent aromatic hydrocarbon group and the divalent heteroaromatic group represented by Ar1, Ar2, Ar3 or Ar4 may be substituted. R1 represents a single bond or a divalent hydrocarbon group having 1 to 20 carbon atoms. A part or all of hydrogen atoms included in the divalent hydrocarbon group represented by R1 may be substituted. The divalent hydrocarbon group represented by R1 may have an ester group, an ether group or a carbonyl group in a structure thereof. Y represents a carbonyl group or a sulfonyl group. m is 0 or 1. n is 0 or 1.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括具有由式(1)表示的结构单元的聚合物。 Ar 1,Ar 2,Ar 3和Ar 4各自独立地表示二价芳香族烃基或二价杂芳基。 包含在二价芳族烃基中的一部分或全部氢原子和由Ar 1,Ar 2,Ar 3或Ar 4表示的二价杂芳基可以被取代。 R1表示单键或碳原子数1〜20的二价烃基。 包含在由R1表示的二价烃基中的一部分或全部氢原子可以被取代。 由R 1表示的二价烃基的结构可以具有酯基,醚基或羰基。 Y表示羰基或磺酰基。 m为0或1. n为0或1。

    PATTERN-FORMING METHOD, RESIST UNDERLAYER FILM, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
    2.
    发明申请
    PATTERN-FORMING METHOD, RESIST UNDERLAYER FILM, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 有权
    图案形成方法,电阻膜,以及用于形成电阻膜的组合物

    公开(公告)号:US20130273476A1

    公开(公告)日:2013-10-17

    申请号:US13852120

    申请日:2013-03-28

    Abstract: A pattern-forming method includes: (1) a resist underlayer film-forming step of providing a resist underlayer film on an upper face side of a substrate by coating a resist underlayer film-forming composition containing a resin having a phenolic hydroxyl group; (2) a resist pattern-forming step of forming a resist pattern on an upper face side of the resist underlayer film; (3) a pattern-forming step of dry etching at least the resist underlayer film and the substrate, with the aid of the resist pattern as a mask to form a pattern on the substrate; and (4) a resist underlayer film-removing step of removing the resist underlayer film on the substrate with a basic solution, in the order of (1) to (4).

    Abstract translation: 图案形成方法包括:(1)抗蚀剂下层膜形成步骤,通过涂布含有酚羟基的树脂的抗蚀剂下层膜形成组合物,在基材的上表面侧上形成抗蚀剂下层膜; (2)在抗蚀剂下层膜的上表面侧形成抗蚀剂图案的抗蚀剂图案形成工序; (3)借助于抗蚀剂图案作为掩模,至少对抗蚀剂下层膜和基板进行干蚀刻的图案形成步骤,以在基板上形成图案; 以及(4)以(1)〜(4)的顺序用碱性溶液除去基板上的抗蚀剂下层膜的抗蚀剂下层膜除去工序。

    RESIN COMPOSITION, RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM-FORMING METHOD AND PATTERN-FORMING METHOD
    3.
    发明申请
    RESIN COMPOSITION, RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM-FORMING METHOD AND PATTERN-FORMING METHOD 有权
    树脂组合物,电阻膜,电阻膜形成方法和图案形成方法

    公开(公告)号:US20130153535A1

    公开(公告)日:2013-06-20

    申请号:US13714406

    申请日:2012-12-14

    CPC classification number: G03F7/11 G03F7/091 H01L21/0276

    Abstract: A resin composition for forming a resist underlayer film includes a resin that includes an aromatic ring, and a crosslinking agent having a partial structure represented by a following formula (i). X represents an oxygen atom, a sulfur atom, *—COO— or —NRA—. R1 represents a hydrogen atom or a C1-30 monovalent hydrocarbon group. R2 represents a hydroxy group, a sulfanil group, a cyano group, a nitro group, a C1-30 monovalent hydrocarbon group, a C1-30 monovalent oxyhydrocarbon group or a C1-30 monovalent sulfanilhydrocarbon group. p is an integer of 1 to 3.

    Abstract translation: 用于形成抗蚀剂下层膜的树脂组合物包括具有芳环的树脂和具有由下式(i)表示的部分结构的交联剂。 X表示氧原子,硫原子,* -COO-或-NRA-。 R1表示氢原子或C1-30一价烃基。 R2表示羟基,磺胺基,氰基,硝基,C1-30一价烃基,C1-30一价羟基烃基或C1-30一价硫代烃基。 p为1〜3的整数。

    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM AND RESIST UNDERLAYER FILM-FORMING METHOD, AND PATTERN-FORMING METHOD
    4.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM AND RESIST UNDERLAYER FILM-FORMING METHOD, AND PATTERN-FORMING METHOD 审中-公开
    用于形成电阻膜的组合物,电阻膜和电阻膜形成方法,以及图案形成方法

    公开(公告)号:US20140272722A1

    公开(公告)日:2014-09-18

    申请号:US14290744

    申请日:2014-05-29

    CPC classification number: G03F7/0384 B05D3/0254 C08G65/4006 G03F7/094 G03F7/11

    Abstract: A composition for forming a resist underlayer film includes a polymer having a structural unit represented by a formula (1). Ar1, Ar2, Ar3 and Ar4 each independently represent a divalent aromatic hydrocarbon group or a divalent heteroaromatic group. A part or all of hydrogen atoms included in the divalent aromatic hydrocarbon group and the divalent heteroaromatic group represented by Ar1, Ar2, Ar3 or Ar4 may be substituted. R1 represents a single bond or a divalent hydrocarbon group having 1 to 20 carbon atoms. A part or all of hydrogen atoms included in the divalent hydrocarbon group represented by R1 may be substituted. The divalent hydrocarbon group represented by R1 may have an ester group, an ether group or a carbonyl group in a structure thereof. Y represents a carbonyl group or a sulfonyl group. m is 0 or 1. n is 0 or 1.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括具有由式(1)表示的结构单元的聚合物。 Ar 1,Ar 2,Ar 3和Ar 4各自独立地表示二价芳香族烃基或二价杂芳基。 包含在二价芳族烃基中的一部分或全部氢原子和由Ar 1,Ar 2,Ar 3或Ar 4表示的二价杂芳基可以被取代。 R1表示单键或碳原子数1〜20的二价烃基。 包含在由R1表示的二价烃基中的一部分或全部氢原子可以被取代。 由R 1表示的二价烃基的结构可以具有酯基,醚基或羰基。 Y表示羰基或磺酰基。 m为0或1. n为0或1。

    RESIN COMPOSITION, RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM-FORMING METHOD AND PATTERN-FORMING METHOD
    5.
    发明申请
    RESIN COMPOSITION, RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM-FORMING METHOD AND PATTERN-FORMING METHOD 有权
    树脂组合物,电阻膜,电阻膜形成方法和图案形成方法

    公开(公告)号:US20140014620A9

    公开(公告)日:2014-01-16

    申请号:US13714406

    申请日:2012-12-14

    CPC classification number: G03F7/11 G03F7/091 H01L21/0276

    Abstract: A resin composition for forming a resist underlayer film includes a resin that includes an aromatic ring, and a crosslinking agent having a partial structure represented by a following formula (i). X represents an oxygen atom, a sulfur atom, *—COO— or —NRA—. R1 represents a hydrogen atom or a C1-30 monovalent hydrocarbon group. R2 represents a hydroxy group, a sulfanil group, a cyano group, a nitro group, a C1-30 monovalent hydrocarbon group, a C1-30 monovalent oxyhydrocarbon group or a C1-30 monovalent sulfanilhydrocarbon group. p is an integer of 1 to 3.

    Abstract translation: 用于形成抗蚀剂下层膜的树脂组合物包括具有芳环的树脂和具有由下式(i)表示的部分结构的交联剂。 X表示氧原子,硫原子,* -COO-或-NRA-。 R1表示氢原子或C1-30一价烃基。 R2表示羟基,磺胺基,氰基,硝基,C1-30一价烃基,C1-30一价羟基烃基或C1-30一价硫代烃基。 p为1〜3的整数。

    METHOD FOR FORMING PATTERN, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
    6.
    发明申请
    METHOD FOR FORMING PATTERN, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 有权
    形成图案的方法和用于形成电阻膜的组合物

    公开(公告)号:US20130084705A1

    公开(公告)日:2013-04-04

    申请号:US13630340

    申请日:2012-09-28

    Abstract: A method for forming a pattern includes providing a resist underlayer film on a substrate using a first composition for forming a resist underlayer film. The first composition includes a polymer having a structural unit represented by a following formula (1). In the formula (1), Ar1 and Ar2 each independently represent a bivalent group represented by a following formula (2). A resist coating film is provided on the resist underlayer film using a resist composition. A resist pattern is formed using the resist coating film. A predetermined pattern is formed on the substrate by sequentially dry-etching the resist underlayer film and the substrate using the resist pattern as a mask.

    Abstract translation: 形成图案的方法包括使用第一组合物形成抗蚀剂下层膜,在基片上提供抗蚀剂下层膜。 第一组合物包括具有由下式(1)表示的结构单元的聚合物。 在式(1)中,Ar 1和Ar 2各自独立地表示由下式(2)表示的二价基团。 使用抗蚀剂组合物在抗蚀剂下层膜上设置抗蚀剂涂膜。 使用抗蚀剂涂膜形成抗蚀剂图案。 通过使用抗蚀剂图案作为掩模,依次干蚀刻抗蚀剂下层膜和基板,在基板上形成预定图案。

Patent Agency Ranking