Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric
    9.
    发明授权
    Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric 有权
    将MIM电容器与形成在阱区中并具有高k电介质的板集成

    公开(公告)号:US07361950B2

    公开(公告)日:2008-04-22

    申请号:US11162471

    申请日:2005-09-12

    IPC分类号: H01L27/108 H01L29/94

    CPC分类号: H01L28/40

    摘要: A MIM capacitor is formed on a semiconductor substrate having a top surface and including regions formed in the surface selected from a Shallow Trench Isolation (STI) region and a doped well having exterior surfaces coplanar with the semiconductor substrate. A capacitor lower plate is either a lower electrode formed on the STI region in the semiconductor substrate or a lower electrode formed by a doped well formed in the top surface of the semiconductor substrate that may have a silicide surface. A capacitor HiK dielectric layer is formed on or above the lower plate. A capacitor second plate is formed on the HiK dielectric layer above the capacitor lower plate. A dual capacitor structure with a top plate may be formed above the second plate with vias connected to the lower plate protected from the second plate by sidewall spacers.

    摘要翻译: 在具有顶表面并且包括形成在从浅沟槽隔离(STI)区域中选择的表面中的区域和具有与半导体衬底共面的外表面的掺杂阱的半导体衬底上形成MIM电容器。 电容器底板是形成在半导体衬底中的STI区域上的下电极或由可能具有硅化物表面的在半导体衬底的顶表面中形成的掺杂阱形成的下电极。 电容器HiK电介质层形成在下板上或上。 在电容器下板上方的HiK电介质层上形成电容器第二板。 可以在第二板的上方形成具有顶板的双电容器结构,其中通过侧壁间隔件连接到被第二板保护的下板的通孔。