利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

25 条记录 (耗时 0.018 秒)

    Method of sealing wafer backside for full-face electrochemical plating
    3.
    发明授权
    Method of sealing wafer backside for full-face electrochemical plating 失效
    用于全面电化学电镀的晶片背面密封方法

    公开(公告)号：US06855037B2

    公开(公告)日：2005-02-15

    申请号：US09910686

    申请日：2001-07-20

    申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

    发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

    IPC分类号： B24B37/30 ,  C25D7/12 ,  C25D17/06 ,  H01L21/00 ,  H01L21/683 ,  B24B1/00

    CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

    摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

    摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

    Polishing apparatus and method with a refreshing polishing belt and loadable housing
    5.
    发明授权
    Polishing apparatus and method with a refreshing polishing belt and loadable housing 有权
    抛光装置和方法具有清爽的抛光带和可装载的外壳

    公开(公告)号：US06468139B1

    公开(公告)日：2002-10-22

    申请号：US09684059

    申请日：2000-10-06

    申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    IPC分类号： B24B2100

    CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B37/04 ,  B24B47/04

    摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

    摘要翻译： 本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。 在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。 抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。 当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。 在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

    Apparatus of sealing wafer backside for full-face processing
    7.
    发明授权
    Apparatus of sealing wafer backside for full-face processing 失效
    密封晶片背面进行全面处理的设备

    公开(公告)号：US06988932B2

    公开(公告)日：2006-01-24

    申请号：US10788926

    申请日：2004-02-25

    申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

    发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

    IPC分类号： B24B1/00

    CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

    摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

    摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

    Apparatus and method for loading a wafer in polishing system
    8.
    发明授权
    Apparatus and method for loading a wafer in polishing system 失效
    在抛光系统中装载晶片的装置和方法

    公开(公告)号：US06932679B2

    公开(公告)日：2005-08-23

    申请号：US10295197

    申请日：2002-11-15

    申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

    CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

    摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

    摘要翻译： 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

    Carrier head for holding a wafer and allowing processing on a front face thereof to occur
    9.
    发明授权
    Carrier head for holding a wafer and allowing processing on a front face thereof to occur 有权
    用于保持晶片并允许其正面进行处理的载体头

    公开(公告)号：US06716084B2

    公开(公告)日：2004-04-06

    申请号：US10043656

    申请日：2002-01-08

    申请人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Konstantin Volodarsky

    发明人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Konstantin Volodarsky

    IPC分类号： B24B100

    CPC分类号： B24B37/30 ,  H01L21/6838

    摘要： The present invention uses some type of inflatable membrane during processing to establish a vacuum and/or provide a resilient cushion on which the backside of the wafer can rest. In one aspect, the present invention provides an outer vacuum that allow for attachment of the wafer to the carrier head during processing, and also provides an inner inflatable membrane that provides a resilient cushion on which the backside of the wafer can rest during processing. In other aspects, the present invention provides a membrane that is displaceable with a vacuum within certain cavity regions to provide for attachment of the wafer to the wafer carrier.

    摘要翻译： 本发明在处理过程中使用某种类型的可膨胀膜来建立真空和/或提供弹性垫，其中晶片的背面可以在其上放置。 在一个方面，本发明提供一种外部真空，其允许在处理期间将晶片附着到承载头，并且还提供内部可充气的膜，其提供弹性垫，在加工过程中，晶片的背面可以在其上保持。 在其他方面，本发明提供了一种膜，其可以在某些腔区域内以真空位移，以提供晶片与晶片载体的连接。

    Method of using vertically configured chamber used for multiple processes
    10.
    发明授权
    Method of using vertically configured chamber used for multiple processes 有权
    使用垂直配置的室用于多个过程的方法

    公开(公告)号：US06969456B2

    公开(公告)日：2005-11-29

    申请号：US10041029

    申请日：2001-12-28

    申请人： Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    发明人： Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    IPC分类号： C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/3063 ,  C25F3/00 ,  B08B3/04

    CPC分类号： H01L21/6719 ,  C25D7/12 ,  C25D17/001 ,  H01L21/67028 ,  Y10S134/902

    摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

    摘要翻译： 本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。 在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。 然后可以使用相同的容纳室来冲洗和清洁相同的晶片。 结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。 因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。