公开(公告)号：US06855037B2

公开(公告)日：2005-02-15

申请号：US09910686

申请日：2001-07-20

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC分类号： B24B37/30 ,  C25D7/12 ,  C25D17/06 ,  H01L21/00 ,  H01L21/683 ,  B24B1/00

CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

公开(公告)号：US06988932B2

公开(公告)日：2006-01-24

申请号：US10788926

申请日：2004-02-25

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

公开(公告)号：US06604988B2

公开(公告)日：2003-08-12

申请号：US10252149

申请日：2002-09-20

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06468139B1

公开(公告)日：2002-10-22

申请号：US09684059

申请日：2000-10-06

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B37/04 ,  B24B47/04

摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

摘要翻译： 本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。 在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。 抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。 当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。 在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

公开(公告)号：US06464571B2

公开(公告)日：2002-10-15

申请号：US09880730

申请日：2001-06-12

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06939206B2

公开(公告)日：2005-09-06

申请号：US10159295

申请日：2002-05-31

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent M. Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent M. Basol ,  Konstantin Volodarsky

IPC分类号： B24B37/30 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/683 ,  B24B1/00

CPC分类号： H01L21/67126 ,  B24B37/30 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.

摘要翻译： 本发明提供了一种晶片载体，其包括提供密封的多个同心密封构件，其中外部密封独立地可移动以允许在晶片仍然附接到晶片载体的同时清洁晶片的外围背面，以及 多个真空开口，其在与所述晶片的所述背面周边相对应的位置处重新设置成与所述内部密封件的内侧相邻。

公开(公告)号：US20050079713A1

公开(公告)日：2005-04-14

申请号：US10920028

申请日：2004-08-16

申请人： Jalal Ashjaee ,  Rimma Volodarsky ,  Cyprian Uzoh ,  Bulent Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Rimma Volodarsky ,  Cyprian Uzoh ,  Bulent Basol ,  Homayoun Talieh

IPC分类号： H01L21/00 ,  H01L21/288 ,  H01L21/3213 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6708 ,  H01L21/2885 ,  H01L21/32134

摘要： The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers

摘要翻译： 本发明提供了至少一个喷嘴，其在其边缘处用蚀刻剂喷射旋转的工件。 所述至少一个喷嘴位于垂直构造的处理子系统的上腔室中，所述处理子系统还包括用于在上腔室和下室中进行电镀，清洁和干燥的机构

公开(公告)号：US20050034994A1

公开(公告)日：2005-02-17

申请号：US10947628

申请日：2004-09-21

申请人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent Basol ,  Homayoun Talieh ,  Cyprian Uzoh

发明人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent Basol ,  Homayoun Talieh ,  Cyprian Uzoh

IPC分类号： C25D7/12 ,  C25F7/00 ,  C25D5/00 ,  B23H3/00

CPC分类号： C25F7/00 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885

摘要： Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

公开(公告)号：US06932679B2

公开(公告)日：2005-08-23

申请号：US10295197

申请日：2002-11-15

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

摘要翻译： 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

公开(公告)号：US20070004316A1

公开(公告)日：2007-01-04

申请号：US11452609

申请日：2006-06-13

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

IPC分类号： B24B51/00 ,  B24B7/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

摘要翻译： 提供了用于化学机械加工，清洁和干燥半导体工件的集成工艺工具。 集成工艺工具包括CMP模块和清洁和干燥模块。 在处理之后，使用可动壳体将工件从CMP模块传送到清洁和干燥模块。 在清洁和干燥模块中，使用清洁机构来清洁工件，同时工件被可移动壳体的支撑结构旋转并保持。 清洁和干燥模块的干燥机构从可移动的壳体上拾取工件并使其干燥。 在整个CMP过程中，清洁和干燥，晶片的经处理表面面朝下。