公开(公告)号：US5491304A

公开(公告)日：1996-02-13

申请号：US315017

申请日：1994-09-29

申请人： James C. Kei Lau ,  Richard P. Malmgren ,  Ronald A. DePace

发明人： James C. Kei Lau ,  Richard P. Malmgren ,  Ronald A. DePace

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/16

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  Y10T29/49208

摘要： A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.

摘要翻译： 公开了用于电耦合形成在第一和第二电子电路芯片上的接触点组的连接器。 连接器通过将电介质材料层施加到平面导电基底上而构成，将图案光刻地印刷到电介质材料上，蚀刻图案并产生延伸穿过电介质材料的多个阱以及表面上匹配的多个空腔 的基底，并且用导电电镀材料电镀图案并填充孔。 因此，电镀板形成多个导电构件，每个导电构件延伸穿过电介质材料。 然后将基底从电介质材料中取出，从而形成一个连接板，该连接器板具有穿过其中的导电构件，用于电耦合电路芯片上的第一和第二组接触点。

公开(公告)号：US5382759A

公开(公告)日：1995-01-17

申请号：US127912

申请日：1993-09-28

申请人： James C. Kei Lau ,  Richard P. Malmgren ,  Michael Roush

发明人： James C. Kei Lau ,  Richard P. Malmgren ,  Michael Roush

IPC分类号： H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H05K1/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/02

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/49894 ,  H05K3/4007 ,  H05K3/4647 ,  H05K3/4682 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/0338 ,  H05K2203/0733 ,  H05K2203/1572 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/423 ,  Y10T428/12528

摘要： An electrical interconnect and a method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the conductive circuit layer to produce conductive vias. A second transparent dielectric layer is disposed around the conductive layers. Contact tips are electrically connected to the top surface of the separate conductive layers. The interconnect may be visually aligned so that the contact tips brought into contact with target connections. In addition, the support structure may be partially removed to allow a flexible interconnect.

摘要翻译： 提供电互连和制造电互连的方法。 第一透明介电层设置在支撑结构的顶部。 导电电路层被镀在第一电介质层之上。 单独的导电层被电镀在导电电路层的顶部上以产生导电通孔。 第二透明介电层设置在导电层周围。 接触尖端电连接到单独的导电层的顶表面。 互连可以在视觉上对准，使得接触尖端与目标连接接触。 此外，可以部分地移除支撑结构以允许柔性互连。