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    High tenacity phenolic resin fibers
    3.
    发明授权
    High tenacity phenolic resin fibers 失效
    高强度酚醛树脂纤维

    公开(公告)号：US4207408A

    公开(公告)日：1980-06-10

    申请号：US908481

    申请日：1978-05-22

    申请人： James Economy ,  Francis J. Frechette ,  Luis C. Wohrer

    发明人： James Economy ,  Francis J. Frechette ,  Luis C. Wohrer

    IPC分类号： D01F6/76 ,  C08G8/10 ,  C08G8/28

    CPC分类号： D01F6/76

    摘要： Infusible cured phenolic resin fibers of the present invention have a birefringence of at least 2.times.10.sup.-3 with the x-ray diffraction pattern of the fibers showing an amorphous halo. The tenacity of infusible cured phenolic resin fibers is significantly increased by subjecting the fibers to sufficient longitudinal tension as to cause at least about 30% elongation of the fibers. The Young's modulus of elasticity of the fibers is also significantly increased thereby. Preferably the resulting stretched infusible cured phenolic resin fibers have a tenacity of at least about 4 g./den.

    摘要翻译： 本发明的可燃固化酚醛树脂纤维的双折射率至少为2×10 -3，其中纤维的X射线衍射图显示无定形卤素。 通过使纤维具有足够的纵向张力使纤维伸长至少约30％，可溶性酚醛树脂纤维的韧性显着增加。 纤维的杨氏弹性模量也显着增加。 优选地，所得到的拉伸的可熔融固化的酚醛树脂纤维具有至少约4g./den的强度。

    Method for reducing crystalline orientation of para-oxybenzoyl polyesters
    4.
    发明授权
    Method for reducing crystalline orientation of para-oxybenzoyl polyesters 失效
    降低对羟基苯甲酰聚酯的结晶取向的方法

    公开(公告)号：US3974250A

    公开(公告)日：1976-08-10

    申请号：US394023

    申请日：1973-09-04

    申请人： Steve G. Cottis ,  James Economy ,  Roger S. Storm ,  Luis C. Wohrer

    发明人： Steve G. Cottis ,  James Economy ,  Roger S. Storm ,  Luis C. Wohrer

    IPC分类号： B29B15/00 ,  B29B9/00 ,  B29B13/00 ,  B29B13/02 ,  B29B13/04 ,  C08G63/00 ,  C08G63/06 ,  C08J3/00 ,  C08J5/00 ,  B29B3/00

    CPC分类号： C08J3/00 ,  B29B13/00 ,  B29B13/02 ,  C08J5/00 ,  C08J2367/04

    摘要： Polyesters of para-oxybenzoyl are infusible and very resistant to acids and solvents, thus limiting the means by which such polymers can be fabricated. Such a polyester is made more amorphous, thus improving compression moldability, by subjecting it to a high temperature treatment, followed by a rapid quench. The resulting polymer has reduced crystalline orientation, as evidenced by X-ray diffraction patterns, and molded articles thereof have improved flexural strength, without adversely affecting the modulus. The thermal treatment is carried out on the polymer by heating at a temperature of at least 300.degree.C, and up to just below the decomposition temperature of the polymer, followed by quenching of the hot polymer.

    摘要翻译： 对羟基苯甲酰基的聚酯是不可渗透的，并且对酸和溶剂非常耐受，因此限制了可以制造这种聚合物的方法。 这样的聚酯制得更加无定形，从而通过对其进行高温处理，然后快速淬火来提高压模成型性。 如X射线衍射图所示，所得聚合物具有降低的晶体取向，并且其模塑制品具有改善的弯曲强度，而不会对模量产生不利影响。 通过在至少300℃的温度下加热至高于聚合物的分解温度，然后淬灭热聚合物，对聚合物进行热处理。

    Process for spinning high modulus oxybenzoyl copolyester fibers
    5.
    发明授权
    Process for spinning high modulus oxybenzoyl copolyester fibers 失效
    高模量羟基苯甲酰基共聚酯纤维纺丝方法

    公开(公告)号：US3975487A

    公开(公告)日：1976-08-17

    申请号：US389823

    申请日：1973-08-20

    申请人： Steve G. Cottis ,  James Economy ,  Luis C. Wohrer

    发明人： Steve G. Cottis ,  James Economy ,  Luis C. Wohrer

    IPC分类号： C08G63/00 ,  C08G63/60 ,  D01F6/62 ,  D01F6/84 ,  D01D5/12

    CPC分类号： C08G63/605 ,  D01F6/84

    摘要： High modulus oxybenzoyl copolyester fibers are produced by heating to an elevated temperature and stretching oxybenzoyl copolyesters fibers having molecular weights in the range of from 2,000 to 200,000 and melting points of at least 250.degree.C and comprising recurring moieties of Formulas I, II and III - ##SPC1##wherein n is 0 or 1; x, y and z are integers; y:z = from 10:15 to 15:10, x:y and x:z = from 1:100 to 100:1; x + y + z = from 30 to 600; the carbonyl group of Formula I is meta and/or para to the oxy group thereof; the carbonyl groups of Formula II are meta and/or para to each other; and the oxy atoms of Formula III are meta and/or para to each other; and in more than 50% of the total of sid moieties having said mentioned groups therein they are of para configuration. For Formulas I and II n is preferably 0 and for Formula III it is usually 1.

    摘要翻译： 通过加热至高温制备高模量羟基苯甲酰基共聚酯纤维，并拉伸分子量范围为2,000至200,000，熔点至少为250℃并含有式I，II和III的重复部分的氧代苯甲酰基共聚酯纤维， 其中n为0或1; x，y和z是整数; y：z = 10:15〜15:10，x：y，x：z = 1：100〜100：1; x + y + z = 30〜600; 式I的羰基是其氧基的间位和/或对位; 式II的羰基是彼此的间位和/或对位的; 并且式III的氧原子彼此是间位和/或对位的; 并且在其中具有所述组的sid部分的总数的50％以上是它们的对位构型。 对于式I和II，n优选为0，对于式III，其通常为1。

    Composition, coated article and method of coating
    7.
    发明授权
    Composition, coated article and method of coating 失效
    组合物，涂层制品和涂层方法

    公开(公告)号：US4690962A

    公开(公告)日：1987-09-01

    申请号：US835083

    申请日：1986-04-07

    申请人： Roger J. Clark ,  James Economy ,  Mary A. Flandera ,  John R. Susko ,  Robin A. Wheater

    发明人： Roger J. Clark ,  James Economy ,  Mary A. Flandera ,  John R. Susko ,  Robin A. Wheater

    IPC分类号： G03F7/025 ,  H01L21/312 ,  H01L23/14 ,  H01L23/498 ,  C08K5/34 ,  C08K5/00 ,  C08L49/00

    CPC分类号： G03F7/025 ,  H01L21/312 ,  H01L23/145 ,  H01L23/49894 ,  H01L2924/0002

    摘要： An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein D is ##STR2## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR3## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein x is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer wtih the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.

    摘要翻译： 一种电子电路，其具有形成在基板上的导电图案，并且在所述基板的至少一个表面上具有由下式的可溶性可聚合低聚物获得的膜：其中D是图像，其中M 其中R是烷基或芳族基团;其中R是烷基或芳基; 其中Ar是芳基; 其中x是大于2但小于30的整数，z是零或整数，y是y和z之和等于x的整数; 并且其中n是1至10的整数。通过将上述组合物施加到基材上然后通过进一步聚合硬化组合物来涂覆基材。 优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。

    Process for coating a substrate with polyimide
    9.
    发明授权
    Process for coating a substrate with polyimide 失效
    用聚酰亚胺涂覆基材的方法

    公开(公告)号：US4467000A

    公开(公告)日：1984-08-21

    申请号：US480164

    申请日：1983-03-29

    申请人： James Economy ,  Willi Volksen ,  Do Y. Yoon

    发明人： James Economy ,  Willi Volksen ,  Do Y. Yoon

    IPC分类号： C09D177/00 ,  B05D3/02 ,  B05D5/00 ,  B05D7/24 ,  C08G73/10 ,  C09D179/08 ,  C08G69/26

    CPC分类号： B05D3/0209 ,  C08G73/1071 ,  Y10T428/31721

    摘要： A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.

    摘要翻译： 一种用于涂覆基材以提供良好的平坦化和良好的机械和热稳定性的方法，该方法包括将由氨基二胺和芳族二酐形成的低聚物施加到底物上的氨基封端的低聚物和酯， 酯由芳族四羧酸和醇形成，并通过使所述低聚物和所述酯原位反应，其特征在于酯与低聚物的胺基反应以在温度下形成高分子量聚酰胺 在40℃至140℃之间，并继续反应形成环状酰亚胺。