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    BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
    2.
    发明申请
    BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH 有权
    双向，反向阻塞电池开关

    公开(公告)号：US20120056261A1

    公开(公告)日：2012-03-08

    申请号：US13285172

    申请日：2011-10-31

    申请人： James Harnden ,  Lynda Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

    发明人： James Harnden ,  Lynda Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

    IPC分类号： H01L29/78 ,  H01L21/56

    CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

    摘要翻译： 本发明的实施例涉及一种用于双向和反向阻断电池开关的改进的封装。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

    BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
    3.
    发明申请
    BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH 有权
    双向，反向阻塞电池开关

    公开(公告)号：US20090179265A1

    公开(公告)日：2009-07-16

    申请号：US11944116

    申请日：2007-11-21

    申请人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

    发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

    IPC分类号： H01L27/088 ,  H01L21/56

    CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

    摘要翻译： 本发明的实施例涉及用于双向和反向阻断电池开关的改进的管芯布局。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

    Bi-directional, reverse blocking battery switch
    4.
    发明授权
    Bi-directional, reverse blocking battery switch 有权
    双向，反向阻断电池开关

    公开(公告)号：US08558368B2

    公开(公告)日：2013-10-15

    申请号：US13285172

    申请日：2011-10-31

    申请人： Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

    发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

    IPC分类号： H01L23/48 ,  H01L29/66 ,  H01L23/62 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L29/00 ,  H01L21/336

    CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

    摘要翻译： 本发明的实施例涉及一种用于双向和反向阻断电池开关的改进的封装。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

    Semiconductor device package leadframe formed from multiple metal layers
    10.
    发明申请
    Semiconductor device package leadframe formed from multiple metal layers 审中-公开
    由多个金属层形成的半导体器件封装引线框架

    公开(公告)号：US20070130759A1

    公开(公告)日：2007-06-14

    申请号：US11416994

    申请日：2006-05-02

    申请人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

    发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

    IPC分类号： H01L21/00

    CPC分类号： H01L23/3107 ,  H01L21/4821 ,  H01L23/49534 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/01046 ,  H01L2924/01079 ,  Y10T29/49117 ,  Y10T29/49121

    摘要： A leadframe having raised features for use a semiconductor device package, is fabricated by bonding together at least two metal layers. A first metal layer may define the lateral dimensions of the leadframe, including any diepad and leads. A second metal layer bonded to the first metal layer, may define the raised features of the leadframe, such as steps for physically securing the leadframe within the package body. The multiple metal layers may be bonded together by a number of possible techniques, including but not limited to ultrasonic welding, soft soldering, or the use of epoxy. Prior to or after bonding, one or more of the metal layers may be coined or stamped to form additional features such as offsets or channels.

    摘要翻译： 通过将至少两个金属层结合在一起而制造具有用于使用半导体器件封装的凸起特征的引线框架。 第一金属层可以限定引线框架的横向尺寸，包括任何凹凸和引线。 结合到第一金属层的第二金属层可以限定引线框的凸起特征，例如用于物理地将引线框固定在封装主体内的步骤。 多个金属层可以通过多种可能的技术结合在一起，包括但不限于超声波焊接，软焊接或使用环氧树脂。 在粘合之前或之后，一个或多个金属层可以被压印或冲压以形成诸如偏移或通道的附加特征。