公开(公告)号：US20120056261A1

公开(公告)日：2012-03-08

申请号：US13285172

申请日：2011-10-31

申请人： James Harnden ,  Lynda Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

发明人： James Harnden ,  Lynda Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

IPC分类号： H01L29/78 ,  H01L21/56

CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

摘要翻译： 本发明的实施例涉及一种用于双向和反向阻断电池开关的改进的封装。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

公开(公告)号：US20090179265A1

公开(公告)日：2009-07-16

申请号：US11944116

申请日：2007-11-21

申请人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

IPC分类号： H01L27/088 ,  H01L21/56

CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

摘要翻译： 本发明的实施例涉及用于双向和反向阻断电池开关的改进的管芯布局。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

公开(公告)号：US08097945B2

公开(公告)日：2012-01-17

申请号：US11944116

申请日：2007-11-21

申请人： James Harnden ,  Lynda Harnden, legal representative ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

IPC分类号： H01L23/48 ,  H01L29/66 ,  H01L23/62 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00 ,  H01L21/336

CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

摘要翻译： 本发明的实施例涉及用于双向和反向阻断电池开关的改进的管芯布局。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

公开(公告)号：US08558368B2

公开(公告)日：2013-10-15

申请号：US13285172

申请日：2011-10-31

申请人： Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

发明人： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou

IPC分类号： H01L23/48 ,  H01L29/66 ,  H01L23/62 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L29/00 ,  H01L21/336

CPC分类号： H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

摘要翻译： 本发明的实施例涉及一种用于双向和反向阻断电池开关的改进的封装。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

公开(公告)号：US20130009296A1

公开(公告)日：2013-01-10

申请号：US13348308

申请日：2012-01-11

申请人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

发明人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45014 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2224/83 ,  H01L2924/206

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. The lead frame can include a plurality of terminals with stamped features at edges of the terminals. The stamped features can include flattened portions that are thinner than other portions of the terminals and extend laterally beyond the edges of the terminals. Such stamped features can help mechanically interlock the terminals with the plastic molding of the package body. The stamped features can include patterns and/or other features that may further increase interlocking between the terminals and the package body.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 引线框架可以包括在端子的边缘处具有冲压特征的多个端子。 冲压的特征可以包括比端子的其它部分薄的扁平部分，并且横向延伸超过端子的边缘。 这种冲压的特征可以帮助机械地将端子与包装体的塑料成型机械地互锁。 冲压的特征可以包括可以进一步增加端子和封装主体之间的互锁的图案和/或其他特征。

公开(公告)号：US08106493B2

公开(公告)日：2012-01-31

申请号：US12903626

申请日：2010-10-13

申请人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

发明人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US20110024886A1

公开(公告)日：2011-02-03

申请号：US12903626

申请日：2010-10-13

申请人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

发明人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US20120181676A1

公开(公告)日：2012-07-19

申请号：US13348283

申请日：2012-01-11

申请人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

发明人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/60 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/17106 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48839 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/206

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US20090250796A1

公开(公告)日：2009-10-08

申请号：US12191527

申请日：2008-08-14

申请人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

发明人： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US20130017652A1

公开(公告)日：2013-01-17

申请号：US13348332

申请日：2012-01-11

申请人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

发明人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC分类号： H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/37664 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/92252 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/206

摘要： Embodiments of the present invention relate to forming semiconductor device package with a heat sink. In one embodiment, a subassembly comprising a die attached to a lead frame is formed, a heat sink is provided in a molding cavity, and the subassembly is coupled to the heat sink while the heat sink is in the molding cavity. In certain embodiments, a second component of the lead frame can be substituted for the heat sink. Such techniques can simplify the manufacturing process for semiconductor packages having a heat sink or lead frame with a second component.

摘要翻译： 本发明的实施例涉及用散热器形成半导体器件封装。 在一个实施例中，形成包括连接到引线框架的管芯的子组件，在模制腔中设置散热器，并且在散热器处于模腔中时，子组件联接到散热器。 在某些实施例中，引线框架的第二部件可以代替散热器。 这样的技术可以简化具有散热器或具有第二部件的引线框的半导体封装的制造工艺。