公开(公告)号：US20130009296A1

公开(公告)日：2013-01-10

申请号：US13348308

申请日：2012-01-11

Applicant: Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

Inventor： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45014 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2224/83 ,  H01L2924/206

Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. The lead frame can include a plurality of terminals with stamped features at edges of the terminals. The stamped features can include flattened portions that are thinner than other portions of the terminals and extend laterally beyond the edges of the terminals. Such stamped features can help mechanically interlock the terminals with the plastic molding of the package body. The stamped features can include patterns and/or other features that may further increase interlocking between the terminals and the package body.

Abstract translation: 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 引线框架可以包括在端子的边缘处具有冲压特征的多个端子。 冲压的特征可以包括比端子的其它部分薄的扁平部分，并且横向延伸超过端子的边缘。 这种冲压的特征可以帮助机械地将端子与包装体的塑料成型机械地互锁。 冲压的特征可以包括可以进一步增加端子和封装主体之间的互锁的图案和/或其他特征。

公开(公告)号：US08106493B2

公开(公告)日：2012-01-31

申请号：US12903626

申请日：2010-10-13

Applicant: Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

Inventor： Anthony C. Tsui ,  Mohammad Eslamy ,  Anthony Chia ,  Hongbo Yang ,  Ming Zhou ,  Jian Xu

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

Abstract translation: 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US20120005650A1

公开(公告)日：2012-01-05

申请号：US13220080

申请日：2011-08-29

Applicant: JAMES E. CARRICK ,  Peter Szpak ,  Robert O. Aberg ,  Andrew C. Bartlett ,  Xiaocang Lin ,  Hongbo Yang

Inventor： JAMES E. CARRICK ,  Peter Szpak ,  Robert O. Aberg ,  Andrew C. Bartlett ,  Xiaocang Lin ,  Hongbo Yang

IPC: G06F9/44

CPC classification number: G06F8/34 ,  G06F8/35 ,  G06F8/37 ,  G06F8/38

Abstract: A computer-implemented method for generating code based on a graphical model may include: translating the graphical model into a graphical model code, the graphical model code including a first graphical model code function; performing a lookup of the first graphical model code function in a hardware specific library, the hardware specific library comprising a plurality of relationships between graphical model code functions and hardware specific functions, where the first graphical model code function is one of the graphical model code functions; obtaining a matched hardware specific function based on the lookup, wherein the matched hardware specific function is one of the hardware specific functions from the hardware specific library; and modifying the graphical model code based on the matched hardware specific function.

Abstract translation: 用于基于图形模型生成代码的计算机实现的方法可以包括：将所述图形模型转换成图形模型代码，所述图形模型代码包括第一图形模型代码功能; 在硬件特定库中执行对第一图形模型代码功能的查找，硬件特定库包括图形模型代码功能和硬件特定功能之间的多个关系，其中第一图形模型代码功能是图形模型代码功能之一 ; 基于查找获得匹配的硬件特定功能，其中匹配的硬件特定功能是来自硬件特定库的硬件特定功能之一; 并基于匹配的硬件特定功能修改图形模型代码。

公开(公告)号：US20080111219A1

公开(公告)日：2008-05-15

申请号：US11559819

申请日：2006-11-14

Applicant: James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

Inventor： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49541 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

Abstract: Embodiments in accordance with the present invention relate to packaging designs for vertical conduction semiconductor devices which include low electrical resistance contacts with a top surface of the die. In one embodiment, the low resistance contact may be established by the use of Aluminum ribbon bonding with one side of a leadframe, or with both of opposite sides of a leadframe. In accordance with a particular embodiment, the vertical conduction device may be housed within a Quad Flat No-lead (QFN) package modified for that purpose.

Abstract translation: 根据本发明的实施例涉及用于垂直导电半导体器件的封装设计，其包括与管芯的顶表面的低电阻接触。 在一个实施例中，低电阻触点可以通过使用与引线框架的一侧或者引线框架的两侧的铝带接合来建立。 根据特定实施例，垂直传导装置可以容纳在为此目的修改的四边形无引线（QFN）封装中。

公开(公告)号：USD558694S1

公开(公告)日：2008-01-01

申请号：US29240406

申请日：2005-10-11

Applicant: James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

Designer： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang

公开(公告)号：US08260598B2

公开(公告)日：2012-09-04

申请号：US11652955

申请日：2007-01-11

Applicant: Hongbo Yang ,  Xiaocang Lin ,  Haihua Feng

Inventor： Hongbo Yang ,  Xiaocang Lin ,  Haihua Feng

IPC: G06F17/50 ,  G06F9/44 ,  G06F9/45 ,  G06G7/62

CPC classification number: G06F8/34

Abstract: A method and apparatus to generate code to represent a graphical model formed of multiple graphical modeling components and at least one variable-sized signal is presented. Each variable-sized signal is represented using a size-vector in the generated code. The generated code is optimized by representing multiple variable-sized signals with the same size-vector such that at least two variable-sized signals share a size-vector in the generated code. The size of the variable-sized signal is capable of changing during the execution of the graphical model. The method and apparatus also identifies the owners of the variable-sized signals.

Abstract translation: 提出了一种生成代码以表示由多个图形建模组件和至少一个可变大小的信号形成的图形模型的方法和装置。 每个可变大小的信号使用生成的代码中的大小向量来表示。 生成的代码通过表示具有相同大小向量的多个可变大小的信号而被优化，使得至少两个可变大小的信号在生成的代码中共享一个大小向量。 可变尺寸信号的大小在图形模型的执行过程中能够改变。 该方法和装置还识别可变大小信号的所有者。

公开(公告)号：US20120181676A1

公开(公告)日：2012-07-19

申请号：US13348283

申请日：2012-01-11

Applicant: Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

Inventor： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/60 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/17106 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48839 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/206

Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

Abstract translation: 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中，引线框架（例如销钉）的部分通过冲压移动离开平台的水平面。 在某些实施例中，可以通过冲压将凹口或复杂的横截面轮廓（例如倒角的）赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术，以便于制造具有这种冲压特征的封装。

公开(公告)号：US08015543B1

公开(公告)日：2011-09-06

申请号：US11651623

申请日：2007-01-10

Applicant: James E. Carrick ,  Peter Szpak ,  Robert O. Aberg ,  Andrew C. Bartlett ,  Xiaocang Lin ,  Hongbo Yang

Inventor： James E. Carrick ,  Peter Szpak ,  Robert O. Aberg ,  Andrew C. Bartlett ,  Xiaocang Lin ,  Hongbo Yang

IPC: G06F9/44

CPC classification number: G06F8/34 ,  G06F8/35 ,  G06F8/37 ,  G06F8/38

Abstract: A computer-implemented method for generating code based on a graphical model may include: translating the graphical model into a graphical model code, the graphical model code including a first graphical model code function; performing a lookup of the first graphical model code function in a hardware specific library, the hardware specific library comprising a plurality of relationships between graphical model code functions and hardware specific functions, where the first graphical model code function is one of the graphical model code functions; obtaining a matched hardware specific function based on the lookup, wherein the matched hardware specific function is one of the hardware specific functions from the hardware specific library; and modifying the graphical model code based on the matched hardware specific function.

Abstract translation: 用于基于图形模型生成代码的计算机实现的方法可以包括：将所述图形模型转换成图形模型代码，所述图形模型代码包括第一图形模型代码功能; 在硬件特定库中执行对第一图形模型代码功能的查找，硬件特定库包括图形模型代码功能和硬件特定功能之间的多个关系，其中第一图形模型代码功能是图形模型代码功能之一 ; 基于查找获得匹配的硬件特定功能，其中匹配的硬件特定功能是来自硬件特定库的硬件特定功能之一; 并基于匹配的硬件特定功能修改图形模型代码。

公开(公告)号：US20090179265A1

公开(公告)日：2009-07-16

申请号：US11944116

申请日：2007-11-21

Applicant: James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

Inventor： James Harnden ,  Anthony Chia ,  Liming Wong ,  Hongbo Yang ,  Anthony C. Tsui ,  Hui Teng ,  Ming Zhou ,  Lynda Harnden

IPC: H01L27/088 ,  H01L21/56

CPC classification number: H01M10/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13091 ,  H01L2924/3011 ,  H02J7/0031 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

Abstract translation: 本发明的实施例涉及用于双向和反向阻断电池开关的改进的管芯布局。 根据一个实施例，两个开关在管芯封装中并排定向，而不是端对端。 该配置降低了给定模具面积的总开关电阻，通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本，并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接，从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。

公开(公告)号：USD588557S1

公开(公告)日：2009-03-17

申请号：US29292225

申请日：2007-10-02

Applicant: James Harnden ,  Anthony Chia ,  Hongbo Yang ,  Teng Hui

Designer： James Harnden ,  Anthony Chia ,  Hongbo Yang ,  Teng Hui