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公开(公告)号：US5608260A
公开(公告)日：1997-03-04
申请号：US366633
申请日：1994-12-30
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/85439 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/14
摘要： A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
摘要翻译： 引线框架具有导电指状物，其中绝缘膜位于手指的第一部分上。 绝缘膜具有开口，由贵金属形成的接触垫设置在该开口中。 芯片上的焊盘被引线接合到引线框上的这些接触焊盘。 第一部分被封装在模制包装中。 该结构抑制银迁移，提供电线和引线框架之间的绝缘，并提供塑料封装和引线框架之间的改进的粘合性。 具有用于提供接触垫的开口的单个绝缘膜提供了所有这些特征。
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公开(公告)号：US5776801A
公开(公告)日：1998-07-07
申请号：US606513
申请日：1996-02-23
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/85439 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/14
摘要： A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
摘要翻译： 引线框架具有导电指状物，其中绝缘膜位于手指的第一部分上。 绝缘膜具有开口，由贵金属形成的接触垫设置在该开口中。 芯片上的焊盘被引线接合到引线框上的这些接触焊盘。 第一部分被封装在模制包装中。 该结构抑制银迁移，提供电线和引线框架之间的绝缘，并提供塑料封装和引线框架之间的改进的粘合性。 具有用于提供接触垫的开口的单个绝缘膜提供了所有这些特征。
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公开(公告)号：US06603195B1
公开(公告)日：2003-08-05
申请号：US09605173
申请日：2000-06-28
申请人： David V. Caletka , James L. Carper , John P. Cincotta , Kibby B. Horsford , Gary H. Irish , John J. Lajza, Jr. , Gordon C. Osborne, Jr. , Charles R. Ramsey , Robert M. Smith , Michael J. Vadnais
发明人： David V. Caletka , James L. Carper , John P. Cincotta , Kibby B. Horsford , Gary H. Irish , John J. Lajza, Jr. , Gordon C. Osborne, Jr. , Charles R. Ramsey , Robert M. Smith , Michael J. Vadnais
IPC分类号： H01L2350
CPC分类号： H01L23/16 , H01L23/4951 , H01L23/49551 , H01L24/48 , H01L2224/05599 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/20752 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
摘要翻译： 半导体模块包括半导体芯片，具有引线指的引线框架和用于减少翘曲的密封剂内的向下固定构件，并且通过平衡引线指和密封剂之间的热应力来提供更平面的封装。 下降组件可以是引线框架的弯曲部分。 它也可以是单独的体，例如虚拟半导体芯片。
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公开(公告)号：US07846083B2
公开(公告)日：2010-12-07
申请号：US11679487
申请日：2007-02-27
IPC分类号： A61N1/00
CPC分类号： A61M1/1072 , A61M1/1008 , A61M1/1037 , A61M1/106 , A61M1/122 , A61M1/125
摘要： A pump has an elongated shell with a generally elliptical shape, an outer convex surface and an inner concave surface. A peripheral side edge located between the inner and outer surfaces terminates in a bead edge. A flexible airtight membrane has a membrane edge bonded to the outer shell surface adjacent to the bead edge. Preforming the membrane edge looped with a maximum linear span of curvature that is greater than a maximal transverse linear extent of the bead edge, membrane operational wear during inflation and deflation cycles is reduced in the region around the bead edge. A process of forming a blood pump with a membrane preform is also provided.
摘要翻译： 泵具有大致椭圆形的细长壳体，外凸面和内凹面。 位于内表面和外表面之间的周边侧边缘终止于边缘。 柔性密封膜具有与胎圈边缘相邻的外壳表面结合的膜边缘。 预先形成最大线性曲率跨度的膜边缘，其大于胎圈边缘的最大横向线性范围，在充气和放气周期期间的膜操作磨损在珠边缘周围的区域减小。 还提供了一种形成具有膜预制件的血液泵的过程。
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公开(公告)号：US07405106B2
公开(公告)日：2008-07-29
申请号：US11439016
申请日：2006-05-23
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49503 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01028 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H05K3/341 , H05K2201/0367 , H05K2201/0373 , H05K2201/10689 , H05K2201/10727 , H05K2201/10969 , H05K2201/2036 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.
摘要翻译： QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。
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公开(公告)号：US6156171A
公开(公告)日：2000-12-05
申请号：US45989
申请日：1993-04-09
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.
摘要翻译： 根据本发明的装置向多个基板的表面提供单层或多层涂层。 该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度 对于所述多个托盘中的每一个，所述输出端为常数。 根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置， 减少和加热手段的手段。
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公开(公告)号：US5972184A
公开(公告)日：1999-10-26
申请号：US45975
申请日：1993-04-09
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： A high throughput sputtering apparatus which provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus comprises a plurality of buffer and sputtering chambers which include an input end and an output end. The substrates are transported through the chambers at varying rates of speed such that the rate of speed of a pallet from the input end to the output end is a constant for each of the pallets. The high throughput sputtering apparatus also includes a transport system which transports the substrates through the sputtering chambers at variable velocities, a high capacity vacuum pump system which evacuates the ambient pressure within the sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation, a substrate heating system which heats the substrates to a temperature conducive to sputtering the coatings thereon and provides a substantially uniform temperature profile over the surface of the substrates; and an electronic control system which provides control signals to and for receiving feedback input from other components of the apparatus. The electronic control system is programmable to control the sputtering chambers, the transport system, the vacuum pump system, and the substrate heating system. The substrate heating system efficiently maintains a desired substrate temperature by minimizing radiative heat losses as the substrates proceed through the sputtering apparatus. The high throughput sputtering apparatus provides substrates to be sputtered in a rapid and uniform heating process to optimize film integrity during the sputtering steps, provides successive layers of thin films on the substrates, and removes the sputtered substrates without contaminating the environment.
摘要翻译： 一种高通量溅射装置，其向多个基板的表面提供单层或多层涂层。 该装置包括多个缓冲和溅射室，其包括输入端和输出端。 基板以不同的速度传送通过室，使得托盘从输入端到输出端的速度速率对于每个托盘是恒定的。 高通量溅射装置还包括以可变速度输送基板通过溅射室的输送系统，将真空室内的环境压力排出到足以实现溅射操作的压力范围内的真空度的高容量真空泵系统 衬底加热系统，其将衬底加热到有利于溅射其上的涂层的温度，并在衬底的表面上提供基本均匀的温度分布; 以及电子控制系统，其向控制信号提供控制信号并从该设备的其他部件接收反馈输入。 电子控制系统可编程控制溅射室，输送系统，真空泵系统和基板加热系统。 当衬底通过溅射装置进行时，衬底加热系统通过最小化辐射热损失来有效地保持期望的衬底温度。 高通量溅射装置提供在快速且均匀的加热过程中溅射的基板，以在溅射步骤期间优化膜的完整性，在基板上提供连续的薄膜层，并且在不污染环境的情况下去除溅射的基板。
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公开(公告)号：US5620594A
公开(公告)日：1997-04-15
申请号：US491864
申请日：1995-08-22
申请人： Robert M. Smith , John E. Adams , James E. Delves
发明人： Robert M. Smith , John E. Adams , James E. Delves
CPC分类号： E03B1/04 , B01D21/0012 , B01D21/009 , B01D21/02 , B01D21/2466 , B01D21/34 , B01D2221/02 , E03B2001/045
摘要： A water management system is disclosed comprising a first distribution system having a wastewater outlet connected to a settling chamber, which has an overflow to a discharge chamber. The settling chamber has a means for removing settled solids comprising a fluidizing duct having a supply unit connected to a source of water under pressure and a discharge duct within the supply duct for discharge of a slurry of solids from the settling chamber. The discharge chamber is connected to a storage tank for supplying treated water to a second water distribution system.
摘要翻译： PCT No.PCT / GB93 / 02667 Sec。 371日期：1995年8月22日 102（e）日期1995年8月22日PCT提交1993年12月29日PCT公布。 WO94 / 16157 PCT公开号 日期1994年7月21日公开了一种水管理系统，其包括具有连接到沉降室的废水出口的第一分配系统，该沉降室具有到排出室的溢流。 沉降室具有用于去除沉降的固体的装置，包括流化通道，流化管道具有连接到压力下的水源的供应单元和供应管道内的排放管道，用于从沉降室排出固体浆料。 排放室连接到用于将经处理的水供应到第二配水系统的储罐。
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公开(公告)号：US5562159A
公开(公告)日：1996-10-08
申请号：US295698
申请日：1995-01-09
申请人： Robert M. Smith , John E. Adams
发明人： Robert M. Smith , John E. Adams
CPC分类号： E21B43/40 , E21B43/121
摘要： A method of raising material, such as production fluid (6), from a bore hole (3) involves pumping water down a pipe (7) to a fluidising unit (A) so that the water activates and entrains the material and carries it up through a discharge conduit (8) to a separator (B).
摘要翻译： PCT No.PCT / GB93 / 00526 Sec。 371日期1995年1月9日 102（e）日期1995年1月9日PCT 1993年3月12日PCT公布。 公开号WO93 / 18279 日期1993年9月16日从钻孔（3）提取诸如生产流体（6）的材料的方法包括将水从管道（7）泵送到流化单元（A），使得水活化并夹带 材料，并通过排放管道（8）运送到分离器（B）。
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公开(公告)号：US5455949A
公开(公告)日：1995-10-03
申请号：US755708
申请日：1991-09-06
申请人： Ralph O. Conder , Jeffrey A. Grantz , Scott A. Plaetzer , Robert M. Smith , William N. J. Tindall
发明人： Ralph O. Conder , Jeffrey A. Grantz , Scott A. Plaetzer , Robert M. Smith , William N. J. Tindall
CPC分类号： G06F9/542 , G06F11/0775 , G06F2201/865
摘要： An improved method and system is described for generalized handling of conditions occurring during program execution in a computer system having a multi-language Condition Manager (CM). A general signaling routine having object code for an external entry point suitable for linking to application programs written in any language supporting external calls is used. The signaling routine may be used by programs to eliminate the step of checking return codes from subroutines by coding the subroutine to automatically signal the proper condition to the CM which in conjunction with user defined condition handlers takes proper actions in response to the condition. A general condition token which may be used as a feedback token is defined as a condition identifier, a format code for the condition identifier, a severity code for the condition, a control code for a facility identifier, a facility identifier and an optional handle for instance specific information. The signaling routine and the feedback token are used by subroutines which can optionally provide for passing an address, where a feedback token can be stored. The subroutine signals conditions if the severity of the condition is greater than a threshold or else stores a feedback token at the address.
摘要翻译： 描述了一种改进的方法和系统，用于在具有多语言条件管理器（CM）的计算机系统中对在程序执行期间发生的状况的广义处理。 使用具有用于外部入口点的目标代码的通用信令程序，该外部入口点适于链接到以支持外部呼叫的任何语言编写的应用程序。 程序可以使用信令程序来消除通过对子程序进行编码来检查子程序的返回代码的步骤，以自动向CM指示适当的条件，其结合用户定义的条件处理程序响应该条件采取适当的动作。 可以用作反馈令牌的通用条件令牌被定义为条件标识符，条件标识符的格式代码，条件的严重性代码，设施标识符的控制代码，设施标识符和可选句柄 实例具体信息。 信令例程和反馈令牌由子程序使用，子程序可以可选地提供传递地址，其中可以存储反馈令牌。 如果条件的严重性大于阈值，则子程序发出信号，或者在地址处存储反馈令牌。
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