摘要:
A semiconductor optical amplifier system comprises a hermetic package. In the typical implementation, this hermetic package is a standard 0.75 inch×0.5 inch package, such as a butterfly package. An optical bench is sealed within this package. A first fiber pigtail enters this package via a feed-through to connect to the bench and terminate above the bench. A second optical fiber pigtail enters the package via a second fiber feed-through to connect to the bench and similarly, terminate above the bench. A semiconductor amplifier chip is connected to the bench to provide amplification. Isolators are further incorporated along with a monitoring diode to yield a fully integrated system.
摘要:
A system and process for tuning the PER of an electronic system during and/or after its manufacture includes fixtures that allow for the axial rotation of the polarization-maintaining optical fiber relative to the optical system after the optical fiber has been installed in the system. The degradation in the PER ratio of the optical system results from mechanical stresses placed on the fiber during the manufacture of the systems. For example, in the case of optical pump manufacturing, the semiconductor laser is installed on a submount. The PM fiber enters a package through a fiber feedthrough in a ferrule and then is secured down onto the submount, such that the endface of the pigtail is held in proximity to the exit facet of the semiconductor laser. In such systems, highly robust fixturing processes are used, typically such as solder bonding, in which the fiber is metallized and solder bonded either directly or indirectly to the submount. Further, solder is typically applied to seal the ferrule around the fiber since these packages must be hermetically sealed to provide for the long-term stable operation. The solder bonding processes can create asymmetries in the residual stress fields applied around the circumference of the fiber after the solder has cooled. These asymmetric stress fields lead to distortions in the stress-induced birefringent medium of the fiber. This results in coupling between the two polarization modes of the PM fiber, and consequently the degradation of the PER of the system from that expected from the separate components, for which the present invention can compensate.
摘要:
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens. the refractive lens is preferably formed using grey-scale lithography and dry etching the first layer.
摘要:
Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is “quasi-extrusion” in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.
摘要:
Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is “quasi-extrusion” in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.
摘要:
An optical monitoring system provides for out-of-band calibration. As a result, calibration can be performed simultaneously with monitoring. This can be used to accomplish faster and/or more accurate scanning. In addition, the need for complex switching and/or multiplexing capabilities can be avoided. The system comprises a signal source of an optical signal having spectrally separated channels, which are distributed within a spectral band, such as a WDM signal. A reference source generates a reference signal outside of the spectral band. A tunable filter filters the optical signal and the reference signal. A reference signal detector then detects the filtered reference signal, while an optical signal detector detects the filtered optical signal.
摘要:
An optical component manipulation system has two opposed jaws, which can each be independently positioned relative to each other in a coordinate plane to thereby effect the desired positioning of optical components within the larger system. Z-axis rigidity is provided by air-bearings. Laser heating of the jaws is used for solder, or similar heat driven bonding, processes.
摘要:
An integrated optical monitoring system comprises a hermetic package and an optical bench sealed within a package. An optical fiber pigtail enters the package via a feed-through to connect and terminate above the bench. A tunable filter is connected to the top of the bench and filters an optical signal transmitted by the fiber pigtail. A detector, also connected to the bench, detects the filtered signal from the tunable filter. Thus, the entire system is integrated together, on a single bench within a preferably small package. This configuration makes the system useful as a subsystem, for example, in a larger system offering higher levels of functionality and optical signal processing capability.
摘要:
Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is “quasi-extrusion” in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.
摘要:
Dry oxygen, dry air, or other gases such as ozone are hermetically sealed within the package of the external cavity laser or ASE swept source to avoid packaging-induced failure or PIF. PIF due to hydrocarbon breakdown at optical interfaces with high power densities is believed to occur at the SLED and/or SOA facets as well as the tunable Fabry-Perot reflector/filter elements and/or output fiber. Because the laser is an external cavity tunable laser and the configuration of the ASE swept sources, the power output can be low while the internal power at surfaces can be high leading to PIF at output powers much lower than the 50 mW.