公开(公告)号：US20090056994A1

公开(公告)日：2009-03-05

申请号：US11848860

申请日：2007-08-31

申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

IPC分类号： H05K1/02 ,  B05C9/14 ,  B05D3/10

CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

公开(公告)号：US20100075427A1

公开(公告)日：2010-03-25

申请号：US12628985

申请日：2009-12-01

申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

IPC分类号： G01N33/20

CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one embodiment a kit for carrying out the binding of metals to a substrate is provided, comprising: a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals; and instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.

摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个实施方案中，提供了一种用于进行金属与基底结合的试剂盒，其包含：包含用附着基团Y和结合基团X衍生的耐热有机分子的容器，所述结合基团X促进金属的结合; 以及通过将分子和/或表面加热至至少25℃的温度将有机分子耦合到基底上的教学材料。

公开(公告)号：US09763336B2

公开(公告)日：2017-09-12

申请号：US14009517

申请日：2010-07-06

申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC分类号： C23C8/12 ,  C23C22/63 ,  H05K3/38 ,  C23C8/16 ,  C23C22/83 ,  C09J5/02 ,  C08J5/12 ,  C23C8/40 ,  C23C8/80 ,  H05K3/46

CPC分类号： H05K3/385 ,  C08J5/12 ,  C08J2363/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2400/20 ,  C23C8/12 ,  C23C8/16 ,  C23C8/40 ,  C23C8/80 ,  C23C22/63 ,  C23C22/83 ,  H05K3/389 ,  H05K3/4673 ,  H05K2203/0315 ,  H05K2203/065 ,  H05K2203/1157

摘要： Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

公开(公告)号：US09345149B2

公开(公告)日：2016-05-17

申请号：US13142588

申请日：2010-07-06

申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC分类号： B32B38/08 ,  B05D5/12 ,  B32B37/14 ,  B05D3/10 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。

公开(公告)号：US08323769B2

公开(公告)日：2012-12-04

申请号：US12628978

申请日：2009-12-01

申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chieh Wei ,  Zhiming Liu ,  Lingyun Wei

IPC分类号： B32B3/10 ,  B32B15/04 ,  B32B15/08

CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

公开(公告)号：US20120125514A1

公开(公告)日：2012-05-24

申请号：US13142588

申请日：2010-07-06

申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC分类号： B32B38/08 ,  B05D5/12 ,  B32B37/14 ,  B05D3/10

CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。

公开(公告)号：US20140261897A1

公开(公告)日：2014-09-18

申请号：US14009517

申请日：2010-07-06

申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC分类号： C23C8/12 ,  C23C8/16

CPC分类号： H05K3/385 ,  C08J5/12 ,  C08J2363/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2400/20 ,  C23C8/12 ,  C23C8/16 ,  C23C8/40 ,  C23C8/80 ,  C23C22/63 ,  C23C22/83 ,  H05K3/389 ,  H05K3/4673 ,  H05K2203/0315 ,  H05K2203/065 ,  H05K2203/1157

摘要： Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

公开(公告)号：US20100071938A1

公开(公告)日：2010-03-25

申请号：US12628978

申请日：2009-12-01

申请人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chich Wei ,  Zhiming Liu ,  Lingyun Wei

发明人： Werner G. Kuhr ,  Steven Z. Shi ,  Jen-Chich Wei ,  Zhiming Liu ,  Lingyun Wei

IPC分类号： H05K1/03 ,  H05K1/00

CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/40 ,  H05K3/181 ,  H05K3/182 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/24322 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

摘要： Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

摘要翻译： 本发明的实施方案提供了处理基材表面的方法。 在一个特定方面，本发明的实施方案提供了处理促进一种或多种金属元素与表面结合的基材表面的方法。 根据本发明的一些实施方案，通过在有机溶剂中或在水溶液中含有反应性基团的分子的热反应，在任何导电，半导体或非导电表面上形成膜。 热反应可以在各种条件下生产。 另一方面，本发明提供一种印刷电路板，包括：至少一个基板; 连接到所述至少一个基底的有机分子层; 以及在所述有机分子层顶上的金属层。

公开(公告)号：US07348206B2

公开(公告)日：2008-03-25

申请号：US10040059

申请日：2001-10-26

申请人： David F. Bocian ,  Werner G. Kuhr ,  Jonathan S. Lindsey ,  Rajeeve Balkrishna Dabke ,  Zhiming Liu

发明人： David F. Bocian ,  Werner G. Kuhr ,  Jonathan S. Lindsey ,  Rajeeve Balkrishna Dabke ,  Zhiming Liu

IPC分类号： H01L51/40

CPC分类号： G11C13/0019 ,  B05D1/185 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G11B9/14 ,  G11B9/149 ,  G11C13/0014 ,  G11C13/025 ,  H01L51/0075 ,  H01L51/0077 ,  H01L51/0595

摘要： This invention provides a new method of forming a self-assembling monolayer (SAM) of alcohol-terminated or thiol-terminated organic molecules (e.g. ferrocenes, porphyrins, etc.) on a silicon or other group IV element surface. The assembly is based on the formation of an E-O— or an E-S— bond where E is the group IV element (e.g. Si, Ge, etc.). The procedure has been successfully used on both P- and n-type group IV element surfaces. The assemblies are stable under ambient conditions and can be exposed to repeated electrochemical cycling.

摘要翻译： 本发明提供了一种在硅或其它IV族元素表面上形成醇封端或硫醇封端的有机分子（例如二茂铁，卟啉等）的自组装单层（SAM）的新方法。 该组合基于形成E-O-或E-S-键，其中E是IV族元素（例如Si，Ge等）。 该程序已经成功地用于P型和N型IV族元件表面。 组件在环境条件下是稳定的并且可以暴露于重复的电化学循环。

公开(公告)号：US20090121210A1

公开(公告)日：2009-05-14

申请号：US12050364

申请日：2008-03-18

申请人： David F. Bocian ,  Werner G. Kuhr ,  Jonathan S. Lindsey ,  Rajeeve B. Dabke ,  Zhiming Liu

发明人： David F. Bocian ,  Werner G. Kuhr ,  Jonathan S. Lindsey ,  Rajeeve B. Dabke ,  Zhiming Liu

IPC分类号： H01L45/00 ,  C07D207/46 ,  C07F15/02 ,  C07F7/02 ,  C07F7/30 ,  H01L25/00

CPC分类号： G11C13/0019 ,  B05D1/185 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G11B9/14 ,  G11B9/149 ,  G11C13/0014 ,  G11C13/025 ,  H01L51/0075 ,  H01L51/0077 ,  H01L51/0595

摘要： This invention provides a new method of forming a self-assembling monolayer (SAM) of alcohol-terminated or thiol-terminated organic molecules (e.g. ferrocenes, porphyrins, etc.) on a silicon or other group IV element surface. The assembly is based on the formation of an E-O— or an E-S— bond where E is the group IV element (e.g. Si, Ge, etc.). The procedure has been successfully used on both P- and n-type group IV element surfaces. The assemblies are stable under ambient conditions and can be exposed to repeated electrochemical cycling.

摘要翻译： 本发明提供了一种在硅或其它IV族元素表面上形成醇封端或硫醇封端的有机分子（例如二茂铁，卟啉等）的自组装单层（SAM）的新方法。 该组合基于形成E-O-或E-S-键，其中E是IV族元素（例如Si，Ge等）。 该程序已经成功地用于P型和N型IV族元件表面。 组件在环境条件下是稳定的并且可以暴露于重复的电化学循环。