公开(公告)号：US20130135823A1

公开(公告)日：2013-05-30

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US08994169B2

公开(公告)日：2015-03-31

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H01L23/34 ,  H01L23/467 ,  H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US20110316144A1

公开(公告)日：2011-12-29

申请号：US13158486

申请日：2011-06-13

申请人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

发明人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

IPC分类号： H01L23/373 ,  F28F7/00

CPC分类号： H01L23/36 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.

摘要翻译： 散热器包括第一粘合剂层和布置在第一粘合剂层上的散热层，并且具有通过第一粘合层和散热层延伸穿过的通气口。 散热器形成半导体封装的最外部分。 因此，当在制造过程中散热器经由其粘合剂层粘合到下面的结构时，通风口允许空气通过。 因此，空气不会以散热器和底层结构之间的气泡的形式被捕获。

公开(公告)号：US20110304763A1

公开(公告)日：2011-12-15

申请号：US13095155

申请日：2011-04-27

申请人： Mi-Na Choi ,  Kyoung-Sei Choi ,  Hee-Seok Lee ,  Yong-Hoon Kim ,  Hee-Jung Hwang ,  Se-Ran Bae

发明人： Mi-Na Choi ,  Kyoung-Sei Choi ,  Hee-Seok Lee ,  Yong-Hoon Kim ,  Hee-Jung Hwang ,  Se-Ran Bae

IPC分类号： H04N5/225 ,  H01L31/0216

CPC分类号： H04N5/2253

摘要： An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to surround the light receiving unit, and an electromagnetic wave shielding layer formed on the logic unit and not formed on the light receiving unit.

摘要翻译： 图像传感器芯片，相机模块以及包含图像传感器芯片和相机模块的装置包括光入射的光接收单元，围绕光接收单元的逻辑单元和形成在该光接收单元上的电磁波屏蔽层 逻辑单元，并且不形成在光接收单元上。

公开(公告)号：US08648478B2

公开(公告)日：2014-02-11

申请号：US13158486

申请日：2011-06-13

申请人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

发明人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

IPC分类号： H01L23/373 ,  F28F7/00

CPC分类号： H01L23/36 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.

摘要翻译： 散热器包括第一粘合剂层和布置在第一粘合剂层上的散热层，并且具有通过第一粘合层和散热层延伸穿过的通气口。 散热器形成半导体封装的最外部分。 因此，当在制造过程中散热器经由其粘合剂层粘合到下面的结构时，通风口允许空气通过。 因此，空气不会以散热器和底层结构之间的气泡的形式被捕获。

公开(公告)号：US08183046B2

公开(公告)日：2012-05-22

申请号：US11622098

申请日：2007-01-11

申请人： Yi Lu ,  Hee-Jung Hwang ,  Nathan Sieracki ,  Dewain Garner

发明人： Yi Lu ,  Hee-Jung Hwang ,  Nathan Sieracki ,  Dewain Garner

IPC分类号： G01N31/00 ,  G01N21/00

CPC分类号： A01N1/02 ,  A01N1/0221 ,  G01N21/80 ,  G01N31/221 ,  Y10T436/102499 ,  Y10T436/104165 ,  Y10T436/106664 ,  Y10T436/108331

摘要： A method for preparing a composition that includes selecting a pH of the composition; selecting a first buffer with a negative temperature coefficient; selecting a second buffer with a positive temperature coefficient; and forming the composition comprising the first buffer and the second buffer. The composition has an average temperature coefficient, ΔpH/ΔT(Ta,Tb)≦1×10−3 pH-unit/K and a ΔpH(Ta,Tb)≦0.31 pH-unit for Ta=4 K and Tb=313 K.

摘要翻译： 一种制备组合物的方法，所述组合物包括选择所述组合物的pH; 选择具有负温度系数的第一缓冲器; 选择具有正温度系数的第二缓冲器; 以及形成包含第一缓冲液和第二缓冲液的组合物。 该组合物的平均温度系数为＆Dgr; T（Ta，Tb）＆nlE; 1×10-3 pH单位/ K和a＆Dgr; pH（Ta，Tb）＆nlE; 0.31 pH单位 = 4K，Tb = 313K。

公开(公告)号：US20080171393A1

公开(公告)日：2008-07-17

申请号：US11622098

申请日：2007-01-11

申请人： Yi Lu ,  Hee-Jung Hwang ,  Nathan Sieracki ,  Dewain Garner

发明人： Yi Lu ,  Hee-Jung Hwang ,  Nathan Sieracki ,  Dewain Garner

IPC分类号： G01N21/00

CPC分类号： A01N1/02 ,  A01N1/0221 ,  G01N21/80 ,  G01N31/221 ,  Y10T436/102499 ,  Y10T436/104165 ,  Y10T436/106664 ,  Y10T436/108331

摘要： A method for preparing a composition that includes selecting a pH of the composition; selecting a first buffer with a negative temperature coefficient; selecting a second buffer with a positive temperature coefficient; and forming the composition comprising the first buffer and the second buffer. The composition has an average temperature coefficient, ΔpH/ΔT(Ta,Tb)≦1×10−3 pH-unit/K and a ΔpH(Ta,Tb)≦0.31 pH-unit for Ta=4 K and Tb=313 K.

摘要翻译： 一种制备组合物的方法，所述组合物包括选择所述组合物的pH; 选择具有负温度系数的第一缓冲器; 选择具有正温度系数的第二缓冲器; 以及形成包含第一缓冲液和第二缓冲液的组合物。 该组合物具有平均温度系数，DeltapH / DeltaT（T ，T ）= 1×10 -3 -3 pH单位/ K， 一个DeltapH（T a，a，B b）= 0.31 PH-UNIT对于T a = 4 K和T B b， SUB> = 313 K.