公开(公告)号：US08994169B2

公开(公告)日：2015-03-31

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H01L23/34 ,  H01L23/467 ,  H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US20130135823A1

公开(公告)日：2013-05-30

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US09391009B2

公开(公告)日：2016-07-12

申请号：US14289900

申请日：2014-05-29

申请人： Eon Soo Jang ,  Kyol Park ,  Jongwoo Park ,  Jin-Kwon Bae ,  Yunhyeok Im ,  Jichul Kim ,  Soojae Park

发明人： Eon Soo Jang ,  Kyol Park ,  Jongwoo Park ,  Jin-Kwon Bae ,  Yunhyeok Im ,  Jichul Kim ,  Soojae Park

IPC分类号： H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/433 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.

摘要翻译： 根据示例实施例，半导体封装包括下封装，下封装上的上封装并且彼此横向间隔开，下封装和上封装之间的下热排出部分，位于上封装之间的中间热排出部 并连接到下部散热部，以及上部热封装上的上部散热部，并与中间散热部连接。

公开(公告)号：US09202773B2

公开(公告)日：2015-12-01

申请号：US13547595

申请日：2012-07-12

申请人： Jin-Kwon Bae ,  Eun-Seok Cho

发明人： Jin-Kwon Bae ,  Eun-Seok Cho

IPC分类号： H05K7/20 ,  H01L23/467

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

摘要翻译： 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。

公开(公告)号：US09228763B2

公开(公告)日：2016-01-05

申请号：US13692394

申请日：2012-12-03

申请人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

发明人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC分类号： H01L35/32 ,  F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

摘要翻译： 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度，将热电冷却封装的温度与目标温度进行比较，当热电冷却封装的温度高于 目标温度，并且当热电冷却封装的温度变得低于目标温度时，停止热电冷却器的操作。