摘要:
The present invention discloses a missile ejection system and a canister thereof. The missile ejection system comprises: comprising: a canister formed as a cylindrical shell, a partition wall protruding from an inner wall of the canister so as to divide the canister into a first chamber for housing a missile therewithin and a second chamber, and having at least one hole therethrough for allowing the flowing of gas through the partition wall, a gas generator secured to the partition wall in the second chamber so that a gas outlet thereof faces in an opposite direction from the first chamber, and an obturator including a sealing plate formed with a concave surface toward a fore-end of the missile for enclosing a tail end of the missile, and a radially extending skirt plate extended from the circumference of the sealing plate to the inner wall of the canister and inclined toward the fore-end of the missile for covering the space between the missile and the inner canister, wherein the missile is propelled by the pressure of the gas discharged out of the gas generator from the second chamber to the first chamber through the hole, being pressurized by the flown-in gas in the first chamber, pushing upon the obturator. Thereby, the system is able to effectively release a missile from a canister by a gas generator without using a missile propulsion engine, thereby fundamentally preventing the damage of ground equipments or peripheral missiles.
摘要:
A semiconductor package stack, comprising: a lower semiconductor package including a lower semiconductor chip mounted on a lower package board; an upper semiconductor package stacked on the lower semiconductor package and including an upper semiconductor chip mounted on an upper package board, wherein the upper package board includes an opening configured to expose a lower surface of the upper semiconductor chip; and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of the lower semiconductor chip.
摘要:
A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern.
摘要:
The present invention discloses a missile ejection system and a canister thereof. The missile ejection system comprises: comprising: a canister formed as a cylindrical shell, a partition wall protruding from an inner wall of the canister so as to divide the canister into a first chamber for housing a missile therewithin and a second chamber, and having at least one hole therethrough for allowing the flowing of gas through the partition wall, a gas generator secured to the partition wall in the second chamber so that a gas outlet thereof faces in an opposite direction from the first chamber, and an obturator including a sealing plate formed with a concave surface toward a fore-end of the missile for enclosing a tail end of the missile, and a radially extending skirt plate extended from the circumference of the sealing plate to the inner wall of the canister and inclined toward the fore-end of the missile for covering the space between the missile and the inner canister, wherein the missile is propelled by the pressure of the gas discharged out of the gas generator from the second chamber to the first chamber through the hole, being pressurized by the flown-in gas in the first chamber, pushing upon the obturator. Thereby, the system is able to effectively release a missile from a canister by a gas generator without using a missile propulsion engine, thereby fundamentally preventing the damage of ground equipments or peripheral missiles.
摘要:
A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.
摘要:
A semiconductor package stack may include a lower semiconductor package and an upper semiconductor package stacked on a lower package board. The upper semiconductor package may include an upper semiconductor chip mounted on an upper package board with an opening configured to expose a lower surface of the upper semiconductor chip and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of a lower semiconductor chip.
摘要:
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.
摘要:
According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.
摘要:
A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.
摘要:
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.