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公开(公告)号：US20110228490A1
公开(公告)日：2011-09-22
申请号：US13050378
申请日：2011-03-17
申请人： Yu-Su KIM , Kyu-Sub Kwak , Young-Min LEE , Shi-Yun Cho , Jea-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
发明人： Yu-Su KIM , Kyu-Sub Kwak , Young-Min LEE , Shi-Yun Cho , Jea-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
IPC分类号： H05K1/18
CPC分类号： H05K3/323 , H05K1/189 , H05K2201/10159
摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。
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公开(公告)号：US20100007475A1
公开(公告)日：2010-01-14
申请号：US12498683
申请日：2009-07-07
申请人： Ho-Jin Lee , Young-Min Lee , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi , Ji-Hyun Jung
发明人： Ho-Jin Lee , Young-Min Lee , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi , Ji-Hyun Jung
IPC分类号： G08B6/00
CPC分类号： H04M1/72544 , G06F3/016
摘要： An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.
摘要翻译： 一种用于允许用户动态地欣赏视频的装置和方法。 在每个预设的时间单位计算图像数据之间的差异，并且生成与所计算的差异相对应的振动，使得用户可以感测视频内的对象的运动变化。 在视频再现时，通过在要再现的场景之间施加闪光灯等的照明效果来显示场景。 在视频再现时，可以向用户提供更多的享受和各种触觉效果。
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公开(公告)号：US08630096B2
公开(公告)日：2014-01-14
申请号：US13050378
申请日：2011-03-17
申请人： Yu-Su Kim , Kyu-Sub Kwak , Young-Min Lee , Shi-Yun Cho , Jae-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
发明人： Yu-Su Kim , Kyu-Sub Kwak , Young-Min Lee , Shi-Yun Cho , Jae-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
CPC分类号： H05K3/323 , H05K1/189 , H05K2201/10159
摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。
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公开(公告)号：US08217768B2
公开(公告)日：2012-07-10
申请号：US12498683
申请日：2009-07-07
申请人： Ho-Jin Lee , Young-Min Lee , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi , Ji-Hyun Jung
发明人： Ho-Jin Lee , Young-Min Lee , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi , Ji-Hyun Jung
IPC分类号： H04B3/36
CPC分类号： H04M1/72544 , G06F3/016
摘要： An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.
摘要翻译： 一种用于允许用户动态地欣赏视频的装置和方法。 在每个预设的时间单位计算图像数据之间的差异，并且生成与所计算的差异相对应的振动，使得用户可以感测视频内的对象的运动变化。 在视频再现时，通过在要再现的场景之间施加闪光灯等的照明效果来显示场景。 在视频再现时，可以向用户提供更多的享受和各种触觉效果。
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公开(公告)号：US08053681B2
公开(公告)日：2011-11-08
申请号：US12201153
申请日：2008-08-29
申请人： Ji-Hyun Jung , Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi
发明人： Ji-Hyun Jung , Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L23/49838 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/2518 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/10674 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole.
摘要翻译： IC封装包括：具有堆叠的多个绝缘层和多个导电图案层的多层PCB，以及通过多个绝缘层形成的多个通孔，用于层之间的电连接; 以及设置在所述多层绝缘层的芯绝缘层中以嵌入所述多层PCB中且在其表面上包括多个输入/输出焊盘的IC芯片。 设置在IC芯片的最外区域的输入/输出焊盘通过连接构件而不通过所述通孔而连接到外部端子，剩余的输入/输出焊盘除了布置在 IC芯片通过通孔与外部端子耦合。
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公开(公告)号：US20090057001A1
公开(公告)日：2009-03-05
申请号：US12201153
申请日：2008-08-29
申请人： Ji-Hyun JUNG , Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi
发明人： Ji-Hyun JUNG , Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi
CPC分类号： H05K1/185 , H01L23/49838 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/2518 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4602 , H05K2201/09227 , H05K2201/09509 , H05K2201/10674 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole.
摘要翻译： IC封装包括：具有堆叠的多个绝缘层和多个导电图案层的多层PCB，以及通过多个绝缘层形成的多个通孔，用于层之间的电连接; 以及设置在所述多层绝缘层的芯绝缘层中以嵌入所述多层PCB中且在其表面上包括多个输入/输出焊盘的IC芯片。 设置在IC芯片的最外区域的输入/输出焊盘通过连接构件而不通过所述通孔而连接到外部端子，剩余的输入/输出焊盘除了布置在 IC芯片通过通孔与外部端子耦合。
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公开(公告)号：US08552302B2
公开(公告)日：2013-10-08
申请号：US12974763
申请日：2010-12-21
申请人： Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
发明人： Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
IPC分类号： H05K1/03
摘要： An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要翻译： 公开了一种嵌入式电路板，其包括形成有多个空腔的第一覆铜层压板，并且包括嵌入空腔中的具有不同厚度的多个芯片，设置在该空腔中的第二覆铜层压板，以使第一覆铜层压板达到 与芯片; 以及设置在第一和第二覆铜层压板的上表面上的树脂涂覆铜箔。
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8.发明申请PRINTED CIRCUIT BOARD HAVING BUILT-IN INTEGRATED CIRCUIT PACKAGE AND FABRICATION METHOD THEREFOR 有权具有内置集成电路封装的印刷电路板及其制造方法公开(公告)号：US20100140782A1
公开(公告)日：2010-06-10
申请号：US12633433
申请日：2009-12-08
申请人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
CPC分类号： H05K1/188 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/4602 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0554
摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.
摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。
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公开(公告)号：US20080061404A1
公开(公告)日：2008-03-13
申请号：US11895430
申请日：2007-08-24
申请人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
发明人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/66 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.
摘要翻译： 一种电子电路封装及其制造方法。 该方法包括：在印刷电路板上集成射频电路器件和半导体管芯; 在射频电路装置周围的印刷电路板上形成金属缓冲垫; 在所述印刷电路板上形成模具，以将所述射频电路器件和所述半导体管芯包括在其中; 以及在所述模制件的一部分上形成一个或多个凹槽并将罐插入所述槽中。 电子电路封装包括：印刷电路板; 集成在印刷电路板上的射频电路器件和半导体管芯; 在印刷电路板上形成的包括射频电路器件和半导体管芯的模制件; 在模制件中形成的一个或多个凹槽以封闭射频电路装置; 并且可以插入槽中的罐。
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10.发明授权公开(公告)号：US08237255B2
公开(公告)日：2012-08-07
申请号：US12633433
申请日：2009-12-08
申请人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-Sub Kwak , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-Sub Kwak , Youn-Ho Choi
IPC分类号： H01L23/48
CPC分类号： H05K1/188 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/4602 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0554
摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.
摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。
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