公开(公告)号：US20100140782A1

公开(公告)日：2010-06-10

申请号：US12633433

申请日：2009-12-08

申请人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-sub Kwak ,  Youn-Ho Choi

发明人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-sub Kwak ,  Youn-Ho Choi

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H05K1/188 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0554

摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。

公开(公告)号：US08237255B2

公开(公告)日：2012-08-07

申请号：US12633433

申请日：2009-12-08

申请人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

发明人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

IPC分类号： H01L23/48

CPC分类号： H05K1/188 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0554

摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。

公开(公告)号：US08630096B2

公开(公告)日：2014-01-14

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/00 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US20080061404A1

公开(公告)日：2008-03-13

申请号：US11895430

申请日：2007-08-24

申请人： Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi ,  Ho-Seong Seo ,  Sang-Hyun Kim

发明人： Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi ,  Ho-Seong Seo ,  Sang-Hyun Kim

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.

摘要翻译： 一种电子电路封装及其制造方法。 该方法包括：在印刷电路板上集成射频电路器件和半导体管芯; 在射频电路装置周围的印刷电路板上形成金属缓冲垫; 在所述印刷电路板上形成模具，以将所述射频电路器件和所述半导体管芯包括在其中; 以及在所述模制件的一部分上形成一个或多个凹槽并将罐插入所述槽中。 电子电路封装包括：印刷电路板; 集成在印刷电路板上的射频电路器件和半导体管芯; 在印刷电路板上形成的包括射频电路器件和半导体管芯的模制件; 在模制件中形成的一个或多个凹槽以封闭射频电路装置; 并且可以插入槽中的罐。

公开(公告)号：US20080117608A1

公开(公告)日：2008-05-22

申请号：US11974962

申请日：2007-10-17

申请人： Ho-Seong Seo ,  Young-Min Lee ,  Shi-Yun Cho ,  Youn-Ho Choi ,  Sang-Hyun Kim

发明人： Ho-Seong Seo ,  Young-Min Lee ,  Shi-Yun Cho ,  Youn-Ho Choi ,  Sang-Hyun Kim

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/10 ,  H05K3/42

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/0035 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09127 ,  Y10T29/49165

摘要： Disclosed are a multi-layer PCB and a fabricating method thereof. The multi-layer PCB includes: a core; a plurality of insulation layers and a plurality of conductive pattern layers alternatively stacked on both sides of the core; and a plurality of via holes formed through the core and the insulation layers. The fabricating method may includes the steps of: forming a conductive pattern layer on each of both sides of a core, and forming via holes through the core; attaching a double-stick tape with weak adhesive strength to a portion of each of a upper surface and a lower surface of the core; and forming an insulation layer on each of a upper surface and a lower surface of the core to cover the double-stick tapes, and forming a conductive pattern layer on each of the insulation layers.

摘要翻译： 公开了一种多层PCB及其制造方法。 多层PCB包括：核心; 多个绝缘层和交替堆叠在芯的两侧上的多个导电图案层; 以及形成在所述芯和所述绝缘层上的多个通孔。 制造方法可以包括以下步骤：在芯的两侧的每一侧上形成导电图案层，并且形成穿过芯的通孔; 将具有弱粘合强度的双面胶带附着到芯的上表面和下表面的每一个的一部分; 并且在所述芯的上表面和下表面的每一个上形成绝缘层以覆盖所述双色带，并且在每个所述绝缘层上形成导电图案层。

公开(公告)号：US20100007475A1

公开(公告)日：2010-01-14

申请号：US12498683

申请日：2009-07-07

申请人： Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

发明人： Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

IPC分类号： G08B6/00

CPC分类号： H04M1/72544 ,  G06F3/016

摘要： An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.

摘要翻译： 一种用于允许用户动态地欣赏视频的装置和方法。 在每个预设的时间单位计算图像数据之间的差异，并且生成与所计算的差异相对应的振动，使得用户可以感测视频内的对象的运动变化。 在视频再现时，通过在要再现的场景之间施加闪光灯等的照明效果来显示场景。 在视频再现时，可以向用户提供更多的享受和各种触觉效果。

公开(公告)号：US08217768B2

公开(公告)日：2012-07-10

申请号：US12498683

申请日：2009-07-07

申请人： Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

发明人： Ho-Jin Lee ,  Young-Min Lee ,  Shi-Yun Cho ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Ji-Hyun Jung

IPC分类号： H04B3/36

CPC分类号： H04M1/72544 ,  G06F3/016

摘要： An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.

摘要翻译： 一种用于允许用户动态地欣赏视频的装置和方法。 在每个预设的时间单位计算图像数据之间的差异，并且生成与所计算的差异相对应的振动，使得用户可以感测视频内的对象的运动变化。 在视频再现时，通过在要再现的场景之间施加闪光灯等的照明效果来显示场景。 在视频再现时，可以向用户提供更多的享受和各种触觉效果。

公开(公告)号：US08053681B2

公开(公告)日：2011-11-08

申请号：US12201153

申请日：2008-08-29

申请人： Ji-Hyun Jung ,  Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi

发明人： Ji-Hyun Jung ,  Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/10674 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole.

摘要翻译： IC封装包括：具有堆叠的多个绝缘层和多个导电图案层的多层PCB，以及通过多个绝缘层形成的多个通孔，用于层之间的电连接; 以及设置在所述多层绝缘层的芯绝缘层中以嵌入所述多层PCB中且在其表面上包括多个输入/输出焊盘的IC芯片。 设置在IC芯片的最外区域的输入/输出焊盘通过连接构件而不通过所述通孔而连接到外部端子，剩余的输入/输出焊盘除了布置在 IC芯片通过通孔与外部端子耦合。

公开(公告)号：US20090057001A1

公开(公告)日：2009-03-05

申请号：US12201153

申请日：2008-08-29

申请人： Ji-Hyun JUNG ,  Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi

发明人： Ji-Hyun JUNG ,  Shi-Yun Cho ,  Young-Min Lee ,  Youn-Ho Choi

IPC分类号： H01R12/04 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/10674 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole.

摘要翻译： IC封装包括：具有堆叠的多个绝缘层和多个导电图案层的多层PCB，以及通过多个绝缘层形成的多个通孔，用于层之间的电连接; 以及设置在所述多层绝缘层的芯绝缘层中以嵌入所述多层PCB中且在其表面上包括多个输入/输出焊盘的IC芯片。 设置在IC芯片的最外区域的输入/输出焊盘通过连接构件而不通过所述通孔而连接到外部端子，剩余的输入/输出焊盘除了布置在 IC芯片通过通孔与外部端子耦合。

公开(公告)号：US20100146463A1

公开(公告)日：2010-06-10

申请号：US12631298

申请日：2009-12-04

申请人： Shi-Yun CHO ,  Ji-Hyun Jung ,  Ho-Jin Lee ,  Young-Min Lee ,  Ho-Seong Seo ,  Youn-Ho Choi

发明人： Shi-Yun CHO ,  Ji-Hyun Jung ,  Ho-Jin Lee ,  Young-Min Lee ,  Ho-Seong Seo ,  Youn-Ho Choi

IPC分类号： H04W88/02 ,  G06F3/033

CPC分类号： H04M1/72519 ,  G06F1/163 ,  G06F3/0488 ,  H04B1/385 ,  H04M2250/22

摘要： A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.

摘要翻译： 提供了一种观看手机和使用手表手机处理来电的方法。 在手表电话中，显示装置包括触摸屏面板和显示器，以手表模式关闭触摸屏面板，在空闲模式下或接收到来电时打开触摸屏面板，并至少显示 收到来电后，呼叫连接和呼叫拒绝的两个区域。 单模式选择键选择监视模式和空闲模式之一。 控制器执行控制操作，使得触摸屏面板在观看模式下被关闭，并且在空闲模式下或接收到来电时被接通，并且当至少两个呼叫区域连接或拒绝来电时 接收到来电时显示的连接或呼叫拒绝被指向或拖动到。