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    Carrier for manufacturing substrate and method of manufacturing substrate using the same
    1.
    发明授权
    Carrier for manufacturing substrate and method of manufacturing substrate using the same 失效
    用于制造基板的载体和使用其的制造基板的方法

    公开(公告)号：US08435376B2

    公开(公告)日：2013-05-07

    申请号：US12787300

    申请日：2010-05-25

    申请人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    发明人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    IPC分类号： B29C65/02 ,  B29C65/52 ,  B29C63/26 ,  B32B37/26 ,  B32B38/10

    CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

    摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

    摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

    CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME
    2.
    发明申请
    CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME 失效
    用于制造基板的承载件及其制造方法

    公开(公告)号：US20110159282A1

    公开(公告)日：2011-06-30

    申请号：US12787300

    申请日：2010-05-25

    申请人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    发明人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    IPC分类号： B32B7/12 ,  B32B38/10 ,  B32B38/00 ,  B32B37/02

    CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

    摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

    摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

    Package substrate
    7.
    发明申请
    Package substrate 审中-公开
    封装衬底

    公开(公告)号：US20110076472A1

    公开(公告)日：2011-03-31

    申请号：US12655516

    申请日：2009-12-30

    申请人： Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

    发明人： Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

    IPC分类号： B32B7/02

    CPC分类号： H05K3/4682 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/0352 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

    摘要： Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and the plating thickness of the second plating layer is greater than the plating thickness of the first plating layer, thus balancing the plating volumes of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate which results from the coefficients of thermal expansion being different.

    摘要翻译： 公开了一种封装基板，其中形成在要连接到母板的层上的第一镀层的电镀面积大于形成在要连接到母板的层上的第二镀层的镀覆面积 电子部分，并且第二镀层的镀层厚度大于第一镀层的镀层厚度，从而平衡形成在包装衬底的层上的镀层的镀层体积，从而最小化封装衬底的翘曲 来自热膨胀系数的结果不同。