公开(公告)号：US08563141B2

公开(公告)日：2013-10-22

申请号：US12716193

申请日：2010-03-02

申请人： Jae Joon Lee ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

发明人： Jae Joon Lee ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC分类号： B21C1/00

CPC分类号： H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

摘要： Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

摘要翻译： 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US20110163064A1

公开(公告)日：2011-07-07

申请号：US12716193

申请日：2010-03-02

申请人： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

发明人： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC分类号： C23F1/00 ,  B32B15/00 ,  B32B37/00 ,  B32B38/10

CPC分类号： H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

摘要： Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

摘要翻译： 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US20110048786A1

公开(公告)日：2011-03-03

申请号：US12870137

申请日：2010-08-27

申请人： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

发明人： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4015 ,  H05K3/007 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2203/0338 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.

摘要翻译： 这里公开了具有凹凸的印刷电路板及其制造方法。 具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。 凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

公开(公告)号：US08435376B2

公开(公告)日：2013-05-07

申请号：US12787300

申请日：2010-05-25

申请人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

发明人： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC分类号： B29C65/02 ,  B29C65/52 ,  B29C63/26 ,  B32B37/26 ,  B32B38/10

CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20110159282A1

公开(公告)日：2011-06-30

申请号：US12787300

申请日：2010-05-25

申请人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

发明人： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC分类号： B32B7/12 ,  B32B38/10 ,  B32B38/00 ,  B32B37/02

CPC分类号： H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

摘要翻译： 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20090147488A1

公开(公告)日：2009-06-11

申请号：US12367768

申请日：2009-02-09

申请人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

发明人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

IPC分类号： H05K7/00

CPC分类号： H05K1/183 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/10734 ,  H05K2203/1394 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

公开(公告)号：US07506437B2

公开(公告)日：2009-03-24

申请号：US11128852

申请日：2005-05-13

申请人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

发明人： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Soo Jeong ,  Jin Yong Ahn

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/183 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/10734 ,  H05K2203/1394 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

摘要翻译： 公开了一种印刷电路板（PCB）及其制造方法。 接触部分形成在多层PCB的内层上。 形成凹槽以暴露内层的接触部分。 芯片封装安装在PCB上，同时倒装芯片结合到内层的暴露的接触部分。

公开(公告)号：US07485569B2

公开(公告)日：2009-02-03

申请号：US11137345

申请日：2005-05-24

申请人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

发明人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

IPC分类号： H01L21/4763

CPC分类号： H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

摘要翻译： 一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层 并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。 此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

公开(公告)号：US07564116B2

公开(公告)日：2009-07-21

申请号：US12016919

申请日：2008-01-18

申请人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk-Hyeon Cho ,  Ho Sik Jeon

发明人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk-Hyeon Cho ,  Ho Sik Jeon

IPC分类号： H01L29/00 ,  H05K3/30 ,  H01L21/20

CPC分类号： H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

摘要翻译： 具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。 还公开了印刷电路板的制造方法。

公开(公告)号：US07378326B2

公开(公告)日：2008-05-27

申请号：US11365219

申请日：2006-02-28

申请人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Ho Sik Jeon

发明人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Ho Sik Jeon

IPC分类号： H01L21/20 ,  H05K3/30

CPC分类号： H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

摘要翻译： 具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。 还公开了印刷电路板的制造方法。