公开(公告)号：US08341338B2

公开(公告)日：2012-12-25

申请号：US12772452

申请日：2010-05-03

申请人： Jin-Hyuk Lee ,  Jang hwan Kim ,  Han-Chan Jo ,  Yeong-Jae Woo ,  Dong hyun Song

发明人： Jin-Hyuk Lee ,  Jang hwan Kim ,  Han-Chan Jo ,  Yeong-Jae Woo ,  Dong hyun Song

IPC分类号： G06F13/00 ,  G06F12/00 ,  G06F3/00 ,  G06F5/00

CPC分类号： G06F12/0873 ,  G06F2212/214 ,  G06F2212/261

摘要： A data storage device comprises a plurality of memory devices, a buffer memory, and a controller. The plurality of memory devices are connected to a plurality of channels and a plurality of ways. The buffer memory temporarily stores data to be written in the memory devices. The controller stores the data in the buffer memory based on channel and way information of the memory devices.

摘要翻译： 数据存储装置包括多个存储器件，缓冲存储器和控制器。 多个存储器件连接到多个通道和多个通道。 缓冲存储器临时存储要写入存储器件的数据。 控制器基于存储器件的通道和方式信息将数据存储在缓冲存储器中。

公开(公告)号：US20160189583A1

公开(公告)日：2016-06-30

申请号：US14973296

申请日：2015-12-17

申请人： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

发明人： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

IPC分类号： G09G3/04

CPC分类号： G09G3/20 ,  G09G2310/0275 ,  G09G2330/021 ,  G09G2360/18

摘要： Devices that include a logic circuit and first and second buffers are provided. The first buffer is spaced apart from the logic circuit by a first distance (and/or is refreshed in a first cycle), and the second buffer is spaced apart from the logic circuit by a second distance that is shorter than the first distance (and/or is refreshed in a second cycle that is different from the first cycle). Moreover, the logic circuit is configured to output, to the first buffer, first data corresponding to fewer toggles than second data that is output from the logic circuit to the second buffer. Methods of operating the devices are also provided.

摘要翻译： 提供了包括逻辑电路和第一和第二缓冲器的设备。 第一缓冲器与逻辑电路间隔第一距离（和/或在第一周期中刷新），并且第二缓冲器与逻辑电路隔开比第一距离短的第二距离（和 /或在与第一周期不同的第二周期中刷新）。 此外，逻辑电路被配置为向第一缓冲器输出与从逻辑电路输出到第二缓冲器的第二数据相比较少的切换的第一数据。 还提供了操作设备的方法。

公开(公告)号：US08612836B2

公开(公告)日：2013-12-17

申请号：US13025463

申请日：2011-02-11

申请人： Han Bin Yoon ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

发明人： Han Bin Yoon ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

IPC分类号： H03M13/00

CPC分类号： G06F12/0246 ,  G06F11/1068 ,  G06F2212/1032 ,  G06F2212/7207 ,  H03M13/05

摘要： The non-volatile memory system includes a non-volatile memory and a controller. The non-volatile memory includes a data region including a sector region for storing sector data, and an uncorrectable information region for storing uncorrectable sector information on the sector region. The controller includes an information generation unit for generating the uncorrectable sector information that indicates whether the sector region is assigned to an uncorrectable sector region, according to a command output from a host.

摘要翻译： 非易失性存储器系统包括非易失性存储器和控制器。 非易失性存储器包括包括用于存储扇区数据的扇区区域的数据区域和用于在扇区区域上存储不可校正扇区信息的不可校正信息区域。 控制器包括信息生成单元，用于根据从主机输出的命令，生成指示扇区是否分配给不可校正扇区的不可校正扇区信息。

公开(公告)号：US20090022850A1

公开(公告)日：2009-01-22

申请号：US12087161

申请日：2005-12-29

申请人： Ji-Young Oh ,  Si-Young Yang ,  Min-Soo Kwon ,  Jiyoung Oh ,  Jin-Hyuk Lee ,  Gyeong-Ho Han ,  Ui-Chan Koh

发明人： Ji-Young Oh ,  Si-Young Yang ,  Min-Soo Kwon ,  Jiyoung Oh ,  Jin-Hyuk Lee ,  Gyeong-Ho Han ,  Ui-Chan Koh

IPC分类号： A23B7/10 ,  C12N1/20

CPC分类号： C12P19/02 ,  A23B7/105 ,  A23B7/155 ,  C12R1/01

摘要： The present invention relates to acid tolerant Leuconostoc mesenteroides with excellent mannitol productivity and the use thereof. The inventive lactic acid bacteria is useful as a food additive composition and a Kimchi starter. Kimchi prepared with the addition of the inventive lactic acid bacteria is maintained at a suitable ripening degree over an extended period of time than to the prior Kimchis, and has excellent sensory properties, including excellent refreshing taste, weak sour odor and a very soft quality of sour taste.

摘要翻译： 本发明涉及具有优异的甘露醇生产力的耐酸性明串珠菌肠炎菌及其用途。 本发明的乳酸菌可用作食品添加剂组合物和泡菜起子。 通过添加本发明的乳酸菌制备的泡菜在延长的时间段内保持在合适的成熟度上，而不是以前的Kimchis，并且具有优异的感官特性，包括优异的清爽味道，弱酸味和非常柔软的质量 酸味。

公开(公告)号：US07196000B2

公开(公告)日：2007-03-27

申请号：US10690782

申请日：2003-10-21

申请人： Jin-Hyuk Lee ,  Gu-Sung Kim ,  Dong-Ho Lee ,  Dong-Hyeon Jang

发明人： Jin-Hyuk Lee ,  Gu-Sung Kim ,  Dong-Ho Lee ,  Dong-Hyeon Jang

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433

摘要： A semiconductor wafer with semiconductor chips having chip pads and a passivation layer is provided. First and second dielectric layers are sequentially formed on the passivation layer. The first and second dielectric layers form a ball pad area that includes an embossed portion, i.e., having a non-planar surface. A metal wiring layer is formed on the resulting structure including the embossed portion. A third dielectric layer is formed on the metal wiring layer. A portion of the third dielectric layer located on the embossed portion is removed to form a ball pad. A solder ball is formed on the embossed ball pad. With the embossed ball pad, the contact area between the solder balls and the metal wiring layer is increased, thereby improving the connection reliability.

摘要翻译： 提供了具有芯片焊盘和钝化层的半导体芯片的半导体晶片。 第一和第二电介质层依次形成在钝化层上。 第一和第二电介质层形成包括压花部分，即具有非平面表面的球垫区域。 在所得到的包括压纹部分的结构上形成金属布线层。 第三电介质层形成在金属布线层上。 位于压花部分上的第三电介质层的一部分被去除以形成球垫。 在浮雕球垫上形成焊球。 利用压纹球垫，焊球和金属布线层之间的接触面积增加，从而提高连接可靠性。

公开(公告)号：US10366646B2

公开(公告)日：2019-07-30

申请号：US14973296

申请日：2015-12-17

申请人： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

发明人： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

IPC分类号： G09G3/20

摘要： Devices that include a logic circuit and first and second buffers are provided. The first buffer is spaced apart from the logic circuit by a first distance (and/or is refreshed in a first cycle), and the second buffer is spaced apart from the logic circuit by a second distance that is shorter than the first distance (and/or is refreshed in a second cycle that is different from the first cycle). Moreover, the logic circuit is configured to output, to the first buffer, first data corresponding to fewer toggles than second data that is output from the logic circuit to the second buffer. Methods of operating the devices are also provided.

公开(公告)号：US07247936B2

公开(公告)日：2007-07-24

申请号：US10739456

申请日：2003-12-17

申请人： Dae-Woo Son ,  Jin-Hyuk Lee ,  Kwan-Jai Lee

发明人： Dae-Woo Son ,  Jin-Hyuk Lee ,  Kwan-Jai Lee

IPC分类号： H01L23/48

CPC分类号： H01L24/16 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05099

摘要： A semiconductor chip package includes an IC chip and a tape circuit substrate. The tape circuit substrate has a base film and a plurality of beam leads formed on the base film. One end portion of each beam lead extends from the base film, and the extended portion has a widthwise wavy portion. The widthwise wavy portion may be, for example, semicircular shaped, S-shaped or zig-zag shaped. The IC chip has chip pads formed on a top surface thereof.

摘要翻译： 半导体芯片封装包括IC芯片和磁带电路基板。 带状电路基板具有基膜和形成在基膜上的多个光束引线。 每个光束引线的一个端部从基膜延伸，并且延伸部分具有宽度方向的波浪形部分。 横向波状部分可以是例如半圆形，S形或锯齿形。 IC芯片具有形成在其顶表面上的芯片焊盘。

公开(公告)号：US20110202818A1

公开(公告)日：2011-08-18

申请号：US13025463

申请日：2011-02-11

申请人： Han Bin YOON ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

发明人： Han Bin YOON ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

IPC分类号： H03M13/05 ,  G06F12/08 ,  G06F11/10

CPC分类号： G06F12/0246 ,  G06F11/1068 ,  G06F2212/1032 ,  G06F2212/7207 ,  H03M13/05

摘要： The non-volatile memory system includes a non-volatile memory and a controller. The non-volatile memory includes a data region including a sector region for storing sector data, and an uncorrectable information region for storing uncorrectable sector information on the sector region. The controller includes an information generation unit for generating the uncorrectable sector information that indicates whether the sector region is assigned to an uncorrectable sector region, according to a command output from a host.

摘要翻译： 非易失性存储器系统包括非易失性存储器和控制器。 非易失性存储器包括包括用于存储扇区数据的扇区区域的数据区域和用于在扇区区域上存储不可校正扇区信息的不可校正信息区域。 控制器包括信息生成单元，用于根据从主机输出的命令，生成指示扇区是否分配给不可校正扇区的不可校正扇区信息。

公开(公告)号：US06812578B2

公开(公告)日：2004-11-02

申请号：US10068628

申请日：2002-02-06

申请人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

发明人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

IPC分类号： H01L2348

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.

摘要翻译： 根据本发明的各种实施例，半导体器件的焊盘结构减少了光束引线接合中由热机械应力引起的损伤。 还提供了一种制造改进的焊盘结构的方法。 优选在接合焊盘金属层和电介质层之间形成多晶硅膜片。 多晶硅薄膜板吸收外部热机械应力，并提高粘合拉伸试验（BPT）中的焊盘的耐久性。 接合焊盘金属层与电介质层之间的接合也得到改善。 还提供了其他特点和优点。

公开(公告)号：US06717272B2

公开(公告)日：2004-04-06

申请号：US10376110

申请日：2003-02-26

申请人： Jin-Hyuk Lee ,  Sa-Yoon Kang ,  Dong-Whee Kwon ,  Ji-Yong You ,  Hye-Soo Shin

发明人： Jin-Hyuk Lee ,  Sa-Yoon Kang ,  Dong-Whee Kwon ,  Ji-Yong You ,  Hye-Soo Shin

IPC分类号： H01L2352

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/05001 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device for reinforcing a substructure of a bond pad and a method for fabricating the same are provided. According to an embodiment, a semiconductor device for reinforcing a substructure of a bond pad comprises a semiconductor substrate and a substructure formed on the semiconductor substrate. The semiconductor device further includes an interlevel dielectric layer formed on the substructure. The interlevel dielectric layer includes a contact opening formed therein. The contact opening comprises a plurality of separate dots connected to each other. A contact plug is formed in the contact opening.

摘要翻译： 提供一种用于加强接合焊盘的子结构的半导体器件及其制造方法。 根据实施例，用于加强接合焊盘的子结构的半导体器件包括形成在半导体衬底上的半导体衬底和子结构。 半导体器件还包括形成在子结构上的层间电介质层。 层间电介质层包括形成在其中的接触开口。 接触开口包括彼此连接的多个分开的点。 接触插塞形成在接触开口中。