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    Camera module package
    1.
    发明申请
    Camera module package 审中-公开
    相机模块包

    公开(公告)号：US20080296577A1

    公开(公告)日：2008-12-04

    申请号：US12155268

    申请日：2008-05-30

    申请人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

    发明人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

    IPC分类号： H01L31/00 ,  H01L21/02

    CPC分类号： H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.

    摘要翻译： 提供了一种照相机模块包装，包括：具有设置在其一个表面上的图像传感器的基板和与图像传感器电连接的焊盘; 保护盖通过围绕图像传感器的粘合剂附着在基板上，以密封图像传感器，保护盖透射光; 以及围绕保护盖的支撑部分，支撑部分粘附并支撑形成对应于图像传感器的至少一个透镜。 相机模块包装的厚度和尺寸减小，并且在透镜和图像传感器之间的焦距误差最小化，从而实现精度和高可靠性。

    Wafer level package of image sensor and method for manufacturing the same
    2.
    发明申请
    Wafer level package of image sensor and method for manufacturing the same 审中-公开
    图像传感器的晶片级封装及其制造方法

    公开(公告)号：US20080296714A1

    公开(公告)日：2008-12-04

    申请号：US12155267

    申请日：2008-05-30

    申请人： Jingli Yuan ,  Won Kvu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Young Do Kweon ,  Jae Cheon Doh

    发明人： Jingli Yuan ,  Won Kvu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Young Do Kweon ,  Jae Cheon Doh

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate. The wafer level package may be useful to have an electrical connection structure using vias without any need to a bonding wire, an electrode pad and an electrode lead in the conventional wafer level package since a packaging process is carried out by bonding a wafer for an upper substrate with a plurality of the vias being provided in a wafer for a lower substrate

    摘要翻译： 提供了能够简单且容易地在封装过程中封装图像传感器的图像传感器的晶片级封装及其制造方法。 图像传感器的晶片级封装包括下基板，其包括图像传感器，耦合到图像传感器的导电图案以及耦合到导电图案的多个通孔; 具有与所述图像传感器对应的多个微透镜的微透镜阵列膜，所述微透镜形成在所述下基板上; 以及围绕图像传感器同时与图像传感器间隔开并与上基板接触的密封线。 晶片级封装可能有用于具有使用通孔的电连接结构，而不需要常规晶片级封装中的接合线，电极焊盘和电极引线，因为封装过程是通过将用于上部 具有多个通孔的基板设置在用于下基板的晶片中

    Camera module package and method of manufacturing the same
    3.
    发明申请
    Camera module package and method of manufacturing the same 审中-公开
    相机模块包装及其制造方法相同

    公开(公告)号：US20080304821A1

    公开(公告)日：2008-12-11

    申请号：US12149751

    申请日：2008-05-07

    申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

    发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

    IPC分类号： G03B17/00 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

    摘要： The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.

    摘要翻译： 本发明涉及一种具有灵活性的相机模块封装及其制造方法。 提供了根据本发明的相机模块包装，其包括安装有图像传感器的硅晶片在其顶表面的中心并且设置有图像传感器两侧的焊盘，透镜单元被打开以在安装中形成凸透镜 图像传感器的一部分在晶片的上部，以及柔性板，其紧密接合到晶片的底表面并且通过内部图案电连接到焊盘。 相机模块封装可以被薄制造，并且由于相机模块封装具有灵活性，所以相机模块封装可以容易地附接到可弯曲的基板和IT设备的内部。

    SEMICONDUCTOR PACKAGE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE 失效
    半导体封装

    公开(公告)号：US20130105954A1

    公开(公告)日：2013-05-02

    申请号：US13352146

    申请日：2012-01-17

    申请人： Chang Hyun Lim ,  Chang Jae Heo ,  Young Ki Lee ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Chang Jae Heo ,  Young Ki Lee ,  Sung Keun Park

    IPC分类号： H01L23/495

    CPC分类号： H01L23/36 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively formed at both sides of the second surface of the substrate, wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.

    摘要翻译： 本文公开了一种半导体封装，包括：具有第一表面和第二表面的基板; 形成在所述基板的第一表面上的至少一个半导体器件; 分别形成在基板的第一表面的两侧的第一引线框架; 以及分别形成在所述基板的第二表面的两侧的第二引线框架，其中所述第一引线框架和所述第二引线框架通过隔离距离基座间隔开。

    Heat-radiating substrate and method of manufacturing the same
    7.
    发明授权
    Heat-radiating substrate and method of manufacturing the same 有权
    散热基板及其制造方法

    公开(公告)号：US08315056B2

    公开(公告)日：2012-11-20

    申请号：US12884058

    申请日：2010-09-16

    申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    IPC分类号： H05K7/20 ,  H05K1/03

    CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。