公开(公告)号：US20080304821A1

公开(公告)日：2008-12-11

申请号：US12149751

申请日：2008-05-07

申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

IPC分类号： G03B17/00 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

摘要： The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.

摘要翻译： 本发明涉及一种具有灵活性的相机模块封装及其制造方法。 提供了根据本发明的相机模块包装，其包括安装有图像传感器的硅晶片在其顶表面的中心并且设置有图像传感器两侧的焊盘，透镜单元被打开以在安装中形成凸透镜 图像传感器的一部分在晶片的上部，以及柔性板，其紧密接合到晶片的底表面并且通过内部图案电连接到焊盘。 相机模块封装可以被薄制造，并且由于相机模块封装具有灵活性，所以相机模块封装可以容易地附接到可弯曲的基板和IT设备的内部。

公开(公告)号：US20090014827A1

公开(公告)日：2009-01-15

申请号：US12155836

申请日：2008-06-10

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H04N5/2257

摘要： Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.

摘要翻译： 提供了包括晶片的晶片级的图像传感器模块; 安装在晶片的一个表面上的图像传感器; 在晶片的一个表面上形成在图像传感器外部的无线通信芯片; 以及安装在晶片的一个表面上的保护盖。

公开(公告)号：US20080296577A1

公开(公告)日：2008-12-04

申请号：US12155268

申请日：2008-05-30

申请人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

发明人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

IPC分类号： H01L31/00 ,  H01L21/02

CPC分类号： H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.

摘要翻译： 提供了一种照相机模块包装，包括：具有设置在其一个表面上的图像传感器的基板和与图像传感器电连接的焊盘; 保护盖通过围绕图像传感器的粘合剂附着在基板上，以密封图像传感器，保护盖透射光; 以及围绕保护盖的支撑部分，支撑部分粘附并支撑形成对应于图像传感器的至少一个透镜。 相机模块包装的厚度和尺寸减小，并且在透镜和图像传感器之间的焦距误差最小化，从而实现精度和高可靠性。

公开(公告)号：US20080296714A1

公开(公告)日：2008-12-04

申请号：US12155267

申请日：2008-05-30

申请人： Jingli Yuan ,  Won Kvu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Young Do Kweon ,  Jae Cheon Doh

发明人： Jingli Yuan ,  Won Kvu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Young Do Kweon ,  Jae Cheon Doh

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate. The wafer level package may be useful to have an electrical connection structure using vias without any need to a bonding wire, an electrode pad and an electrode lead in the conventional wafer level package since a packaging process is carried out by bonding a wafer for an upper substrate with a plurality of the vias being provided in a wafer for a lower substrate

摘要翻译： 提供了能够简单且容易地在封装过程中封装图像传感器的图像传感器的晶片级封装及其制造方法。 图像传感器的晶片级封装包括下基板，其包括图像传感器，耦合到图像传感器的导电图案以及耦合到导电图案的多个通孔; 具有与所述图像传感器对应的多个微透镜的微透镜阵列膜，所述微透镜形成在所述下基板上; 以及围绕图像传感器同时与图像传感器间隔开并与上基板接触的密封线。 晶片级封装可能有用于具有使用通孔的电连接结构，而不需要常规晶片级封装中的接合线，电极焊盘和电极引线，因为封装过程是通过将用于上部 具有多个通孔的基板设置在用于下基板的晶片中

公开(公告)号：US08315056B2

公开(公告)日：2012-11-20

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  H05K1/03

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

公开(公告)号：US08134077B2

公开(公告)日：2012-03-13

申请号：US12614405

申请日：2009-11-07

申请人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

发明人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

IPC分类号： H05K7/20 ,  H05K1/00

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

公开(公告)号：US20120000697A1

公开(公告)日：2012-01-05

申请号：US12954416

申请日：2010-11-24

申请人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

发明人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

IPC分类号： H05K1/03 ,  H05K3/02 ,  H05K1/02

CPC分类号： H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L23/498 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.

摘要翻译： 本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。 印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求 可以克服厚膜电镀抗蚀剂的原料。 此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。

公开(公告)号：US08310023B2

公开(公告)日：2012-11-13

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L23/52

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US08198543B2

公开(公告)日：2012-06-12

申请号：US12618726

申请日：2009-11-14

申请人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

发明人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

IPC分类号： H05K1/00

CPC分类号： H05K3/4641 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/189 ,  H05K3/462 ,  H05K3/4691 ,  H05K2203/0315 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

摘要翻译： 公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路 并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得 刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。 还提供了制造刚性柔性电路板的方法。

公开(公告)号：US07816156B2

公开(公告)日：2010-10-19

申请号：US11882167

申请日：2007-07-31

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。