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22 条记录 (耗时 0.031 秒)

    Solid imaging system
    2.
    发明授权
    Solid imaging system 失效
    固体成像系统

    公开(公告)号：US5143817A

    公开(公告)日：1992-09-01

    申请号：US455473

    申请日：1989-12-22

    申请人： John A. Lawton ,  Roxy N. Fan

    发明人： John A. Lawton ,  Roxy N. Fan

    IPC分类号： B29C35/08 ,  B29C67/00 ,  B29K105/24 ,  G03F7/20

    CPC分类号： B29C67/0066 ,  B29K2995/0073

    摘要： An apparatus and method for fabricating integral three-dimensional objects from successive layers of photoformable compositions by exposing the layers of the composition through a detachable flexible transparent film, one side of the film being in contact with the composition and the other side of the film with a rigid transparent plate, which guides and supports the film.

    摘要翻译： 一种用于通过将组合物的层暴露于可拆卸的柔性透明膜（45）的一层（45秒）的方式从可光成像组合物的连续层（11）制造整体的三维物体的装置和方法，所述膜的一侧（45秒）与 该组合物和另一侧（45分钟）具有刚性透明板（47），其引导并支撑该膜。

    Investment casting pattern material comprising thermally-collapsible expanded microspheres
    4.
    发明授权
    Investment casting pattern material comprising thermally-collapsible expanded microspheres 失效
    包括热膨胀膨胀微球的熔模铸造图案材料

    公开(公告)号：US5364889A

    公开(公告)日：1994-11-15

    申请号：US873818

    申请日：1992-04-27

    申请人： John A. Quinn ,  Roxy N. Fan

    发明人： John A. Quinn ,  Roxy N. Fan

    IPC分类号： B22C7/02 ,  B22C9/04 ,  B29C35/08 ,  B29C67/00 ,  C08F2/50 ,  C08K5/00

    CPC分类号： B22C7/02 ,  B22C9/04

    摘要： A method and composition for forming investment casting patterns wherein thermally-collapsible microspheres are incorporated into the pattern composition. The patterns can be made either by conventional pattern forming techniques or by solid imaging techniques. After investing the microsphere containing pattern in the ceramic shell, the pattern and shell are heated, causing a collapse of the microspheres and thereby preventing cracking of the shell. The shell is then heated to burn-out the remaining pattern material and fire the shell, thereby creating a mold.

    摘要翻译： 一种用于形成熔模铸造图案的方法和组合物，其中将热可收缩微球体结合到图案组合物中。 图案可以通过常规图案形成技术或通过固体成像技术制成。 在将微球含有图案投入到陶瓷壳体中之后，图案和壳体被加热，导致微球的塌陷，从而防止壳体开裂。 然后将壳体加热以烧尽剩余的图案材料并对外壳进行火焰，从而形成模具。

    Embedded catalyst receptors for metallization of dielectrics
    5.
    发明授权
    Embedded catalyst receptors for metallization of dielectrics 失效
    用于金属化电介质的嵌入式催化剂受体

    公开(公告)号：US5112726A

    公开(公告)日：1992-05-12

    申请号：US362137

    申请日：1989-06-06

    申请人： Abraham B. Cohen ,  Roxy N. Fan ,  John A. Quinn

    发明人： Abraham B. Cohen ,  Roxy N. Fan ,  John A. Quinn

    IPC分类号： G03F7/004 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38

    CPC分类号： G03F7/0047 ,  H05K3/184 ,  H05K3/185 ,  H05K3/38 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2203/0525 ,  H05K2203/1415 ,  H05K3/0023

    摘要： The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprisesa. an electrically insulative substrate bearingb. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, andc. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.

    摘要翻译： 本发明涉及一种用于通过在其上无电镀导电金属来制备印刷电路的层压板，其包括a。 b。电绝缘基板轴承b。 交联聚合物粘合剂的粘附层，其不溶于光致介质显影溶液，其部分地嵌入有从粘合剂表面远离基材突出的细分散的吸附剂颗粒，其突出表面相对于化学镀催化剂是吸附性的 还原性前体，和c。 固态的光致电介质层贴着粘合剂层和吸附剂颗粒。

    Negative-working multilayer photosensitive tonable element
    8.
    发明授权
    Negative-working multilayer photosensitive tonable element 失效
    负性多层感光色调元件

    公开(公告)号：US4247619A

    公开(公告)日：1981-01-27

    申请号：US105648

    申请日：1979-12-20

    申请人： Abraham B. Cohen ,  Roxy N. Fan

    发明人： Abraham B. Cohen ,  Roxy N. Fan

    IPC分类号： G03F3/10 ,  G03F7/34 ,  G03C11/12

    CPC分类号： G03F3/103 ,  G03F7/34

    摘要： An improved peel apart photosensitive element comprises a strippable cover sheet, a photoadherent layer, and a tacky, nonphotosensitive contiguous layer receptive to colorant or particulate material, and a support. The element is useful in applications such as color proofing. Such elements are capable of producing reverse toned or colored images as well as duplicate colored images with greatly improved tonal range and image fidelity.

    摘要翻译： 改进的剥离感光元件包括可剥离的覆盖片，光粘着层和接受着色剂或颗粒材料的粘性，非光敏邻接层和支持体。 该元素在诸如彩色打样等应用中是有用的。 这些元件能够产生反色调或彩色图像以及重复的彩色图像，具有极大改善的色调范围和图像保真度。

    Preparation of photoformed plastic multistrate by via formation first
    10.
    发明授权
    Preparation of photoformed plastic multistrate by via formation first 失效
    首先通过通孔形成制备光致变形塑料多药

    公开(公告)号：US4572764A

    公开(公告)日：1986-02-25

    申请号：US681189

    申请日：1984-12-13

    申请人： Roxy N. Fan

    发明人： Roxy N. Fan

    IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46 ,  B44C1/22 ,  B05D5/12 ,  G03C5/00

    CPC分类号： H05K3/0023 ,  H05K3/184 ,  H05K3/4661 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/0525 ,  H05K2203/072 ,  H05K2203/1415 ,  H05K3/102 ,  H05K3/246 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

    摘要： Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.

    摘要翻译： 制备多层印刷电路的方法包括层压到承载电路图形或导电表面的基底上，所述光敏层在曝光时发粘或变粘， 通过与底层电路图案相关的通孔图像将层压体暴露于光化辐射（如果存在） 任选地在暴露或未曝光的区域（例如用溶剂）中去除感光层的可移除通孔图像，或者通过去除覆盖片（如果存在）剥离; 将第二感光组合物的层层压到剩余的粘性感光层上; 通过所述通孔图像区域和导电电路图案的至少一个覆盖段的注册图像图案将所述层压体暴露于光化辐射，以形成具有非粘性区域和可移除电路图像区域的图像表面; 通过其溶剂去除曝光或未曝光区域中的感光层的可移除电路图像区域，或者通过覆盖片剥离（如果存在），可以通过下部光敏剂的可移除通孔图像区域（如果存在的话）被 其溶剂; 将细碎的材料例如铜嵌入粘性区域中; 任选地通过光化辐射和/或加热固化层压体; 电化学镀以形成互连的导电电路。 可以添加额外的电路层。