公开(公告)号：US20070153104A1

公开(公告)日：2007-07-05

申请号：US11275417

申请日：2005-12-30

申请人： John Ellis-Monaghan ,  Mark Jaffe ,  Alain Loiseau ,  Richard Rassel

发明人： John Ellis-Monaghan ,  Mark Jaffe ,  Alain Loiseau ,  Richard Rassel

IPC分类号： H04N9/04

CPC分类号： H04N9/045

摘要： A pixel array in an image sensor, the image sensor and a digital camera including the image sensor. The image sensor includes a pixel array with colored pixels and unfiltered (color filter-free) pixels. Each unfiltered pixel occupies one or more array locations. The colored pixels may be arranged in uninterrupted rows and columns with unfiltered pixels disposed between the uninterrupted rows and columns. The image sensor may in CMOS with the unfiltered pixels reducing low-light noise and improving low-light sensitivity.

摘要翻译： 图像传感器中的像素阵列，图像传感器和包括图像传感器的数字照相机。 图像传感器包括具有彩色像素和未滤波（无滤色器）像素的像素阵列。 每个未过滤的像素占据一个或多个阵列位置。 彩色像素可以布置在不间断的行和列中，其中未过滤的像素布置在不间断的行和列之间。 图像传感器可以在CMOS中，未滤色像素降低低光噪声并改善低光灵敏度。

公开(公告)号：US20070108485A1

公开(公告)日：2007-05-17

申请号：US11619024

申请日：2007-01-02

申请人： James Adkisson ,  John Ellis-Monaghan ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel

发明人： James Adkisson ,  John Ellis-Monaghan ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel

IPC分类号： H01L31/113 ,  H01L21/00

CPC分类号： H01L27/14609 ,  H01L27/1463 ,  H01L27/14641 ,  H01L27/14643 ,  H01L31/035281

摘要： A structure (and method for forming the same) for an image sensor cell. The method includes providing a semiconductor substrate. Then, a charge collection well is formed in the semiconductor substrate, the charge collection well comprising dopants of a first doping polarity. Next, a surface pinning layer is formed in the charge collection well, the surface pinning layer comprising dopants of a second doping polarity opposite to the first doping polarity. Then, an electrically conductive push electrode is formed in direct physical contact with the surface pinning layer but not in direct physical contact with the charge collection well. Then, a transfer transistor is formed on the semiconductor substrate. The transfer transistor includes first and second source/drain regions and a channel region. The first and second source/drain regions comprise dopants of the first doping polarity. The first source/drain region is in direct physical contact with the charge collection well.

摘要翻译： 用于图像传感器单元的结构（及其形成方法）。 该方法包括提供半导体衬底。 然后，在半导体衬底中形成电荷收集阱，电荷收集阱包含第一掺杂极性的掺杂剂。 接下来，在电荷收集阱中形成表面钉扎层，表面钉扎层包括与第一掺杂极性相反的第二掺杂极性的掺杂剂。 然后，导电的推动电极形成为与表面钉扎层直接物理接触，但不与电荷收集阱直接物理接触。 然后，在半导体衬底上形成传输晶体管。 传输晶体管包括第一和第二源极/漏极区域和沟道区域。 第一和第二源/漏区包括第一掺杂极性的掺杂剂。 第一源极/漏极区域与电荷收集阱直接物理接触。

公开(公告)号：US20060186505A1

公开(公告)日：2006-08-24

申请号：US10906510

申请日：2005-02-23

申请人： James Adkisson ,  John Ellis-Monaghan ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel

发明人： James Adkisson ,  John Ellis-Monaghan ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel

IPC分类号： H01L31/06

CPC分类号： H01L27/14609 ,  H01L27/1463 ,  H01L27/14641 ,  H01L27/14643 ,  H01L31/035281

摘要： A structure (and method for forming the same) for an image sensor cell. The structure includes (a) a semiconductor substrate; (b) a charge collection well on the substrate, the charge collection well comprising a semiconductor material doped with a first doping polarity; (c) a surface pinning layer on and in direct physical contact with the charge collection well, the surface pinning layer comprising a semiconductor material doped with a second doping polarity opposite to the first doping polarity; and (d) an electrically conducting push electrode being in direct physical contact with the surface pinning layer but not being in direct physical contact with the charge collection well.

摘要翻译： 用于图像传感器单元的结构（及其形成方法）。 该结构包括（a）半导体衬底; （b）在所述衬底上的电荷收集阱，所述电荷收集阱包括掺杂有第一掺杂极性的半导体材料; （c）与电荷收集阱直接物理接触的表面钉扎层，所述表面钉扎层包括掺杂有与第一掺杂极性相反的第二掺杂极性的半导体材料; 和（d）与表面钉扎层直接物理接触但不与电荷收集阱直接物理接触的导电推动电极。

公开(公告)号：US09543356B2

公开(公告)日：2017-01-10

申请号：US12538194

申请日：2009-08-10

申请人： Jeffrey P. Gambino ,  Mark D. Jaffe ,  John Ellis-Monaghan ,  Richard Rassel

发明人： Jeffrey P. Gambino ,  Mark D. Jaffe ,  John Ellis-Monaghan ,  Richard Rassel

IPC分类号： H01L27/148 ,  H01L27/146

CPC分类号： H01L27/14689 ,  H01L27/14609 ,  H01L27/14623 ,  H01L27/1464

摘要： CMOS image sensor pixel sensor cells, methods for fabricating the pixel sensor cells and design structures for fabricating the pixel sensor cells are designed to allow for back side illumination in global shutter mode by providing light shielding from back side illumination of at least one transistor within the pixel sensor cells. In a first particular generalized embodiment, a light shielding layer is located and formed interposed between a first semiconductor layer that includes a photoactive region and a second semiconductor layer that includes the at least a second transistor, or a floating diffusion, that is shielded by the light blocking layer. In a second generalized embodiment, a thin film transistor and a metal-insulator-metal capacitor are used in place of a floating diffusion, and located shielded in a dielectric isolated metallization stack over a carrier substrate.

摘要翻译： CMOS图像传感器像素传感器单元，用于制造像素传感器单元的方法和用于制造像素传感器单元的设计结构被设计成允许在全局快门模式中进行背面照明，通过提供来自至少一个晶体管的背侧照明的光屏蔽 像素传感器单元。 在第一特定广义实施例中，遮光层位于包括光活性区的第一半导体层和包括至少第二晶体管的第二半导体层之间并形成，或者浮置扩散部被屏蔽 遮光层。 在第二广义实施例中，使用薄膜晶体管和金属 - 绝缘体 - 金属电容器来代替浮动扩散，并且被定位在载体衬底上的介电隔离金属化堆叠中。

公开(公告)号：US20080108170A1

公开(公告)日：2008-05-08

申请号：US11959841

申请日：2007-12-19

申请人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Robert Leidy ,  Richard Rassel ,  Anthony Stamper

发明人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Robert Leidy ,  Richard Rassel ,  Anthony Stamper

IPC分类号： H01L21/04

CPC分类号： H01L27/14636 ,  H01L21/76819 ,  H01L21/76834 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14645 ,  H01L27/14683

摘要： A CMOS image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The CMOS image sensor includes structures having a minimum thickness of barrier layer metal that traverses the optical path of each pixel in the sensor array or, that have portions of barrier layer metal selectively removed from the optical paths of each pixel, thereby minimizing reflectance. That is, by implementing various block or single mask methodologies, portions of the barrier layer metal are completely removed at locations of the optical path for each pixel in the array. In a further embodiment, the barrier metal layer may be formed atop the Cu metallization by a self-aligned deposition.

摘要翻译： CMOS图像传感器和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合较薄的层间电介质堆叠以产生呈现增加的光灵敏度的像素阵列。 CMOS图像传感器包括具有穿过传感器阵列中的每个像素的光路的阻挡层金属的最小厚度的结构，或者具有从每个像素的光路中选择性地去除的阻挡层金属的部分，从而使反射率最小化的结构。 也就是说，通过实现各种块或单掩模方法，在阵列中的每个像素的光路的位置处完全去除了阻挡层金属的部分。 在另一个实施例中，阻挡金属层可以通过自对准沉积形成在Cu金属化之上。

公开(公告)号：US20060110905A1

公开(公告)日：2006-05-25

申请号：US10904677

申请日：2004-11-23

申请人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel ,  Edmund Sprogis

发明人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Richard Rassel ,  Edmund Sprogis

IPC分类号： H01L21/44 ,  H01L21/50

CPC分类号： H01L24/02 ,  H01L23/3114 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/00

摘要： A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.

摘要翻译： 用于实现通过晶片连接到集成电路或电子封装的接合焊盘及其制造方法。 接合焊盘包括高表面积铝键合焊盘，以便得到接合焊盘和电引线之间的高度可靠的低电阻连接。

公开(公告)号：US20070158711A1

公开(公告)日：2007-07-12

申请号：US11275497

申请日：2006-01-10

申请人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Jeffrey Johnson ,  Jerome Lasky ,  Richard Rassel

发明人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Jeffrey Johnson ,  Jerome Lasky ,  Richard Rassel

IPC分类号： H01L31/113 ,  H01L27/148 ,  H01L29/768

CPC分类号： H01L27/1462 ,  H01L27/14603 ,  H01L27/1463

摘要： Structures and method for forming the same. The semiconductor structure comprises a photo diode that includes a first semiconductor region and a second semiconductor region. The first and second semiconductor regions are doped with a first and second doping polarities, respectively, and the first and second doping polarities are opposite. The semiconductor structure also comprises a transfer gate that comprises (i) a first extension region, (ii) a second extension region, and (iii) a floating diffusion region. The first and second extension regions are in direct physical contact with the photo diode and the floating diffusion region, respectively. The semiconductor structure further comprises a charge pushing region. The charge pushing region overlaps the first semiconductor region and does not overlap the floating diffusion region. The charge pushing region comprises a transparent and electrically conducting material.

摘要翻译： 结构及其形成方法。 该半导体结构包括包含第一半导体区域和第二半导体区域的光电二极管。 第一和第二半导体区域分别掺杂有第一和第二掺杂极性，并且第一和第二掺杂极性相反。 半导体结构还包括传输门，其包括（i）第一延伸区，（ii）第二延伸区和（iii）浮动扩散区。 第一和第二延伸区分别与光电二极管和浮动扩散区直接物理接触。 半导体结构还包括电荷推送区域。 电荷推送区域与第一半导体区域重叠，并且不与浮动扩散区域重叠。 电荷推送区域包括透明且导电的材料。

公开(公告)号：US20070194397A1

公开(公告)日：2007-08-23

申请号：US11276218

申请日：2006-02-17

申请人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Alan Loiseau ,  Richard Rassel

发明人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Alan Loiseau ,  Richard Rassel

IPC分类号： H01L31/0232 ,  H01L31/00

CPC分类号： H01L27/14643 ,  H01L27/14621 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14689

摘要： An imaging sensor with an array of FET pixels and method of forming the imaging sensor. Each pixel is a semiconductor island, e.g., N-type silicon on a Silicon on insulator (SOI) wafer. FETs are formed in one photodiode electrode, e.g., a P-well cathode. A color filter may be attached to an opposite surface of island. A protective layer (e.g., glass or quartz) or window is fixed to the pixel array at the color filters. The image sensor may be illuminated from the backside with cell wiring above the cell. So, an optical signal passes through the protective layer is filtered by the color filters and selectively sensed by a corresponding photo-sensor.

摘要翻译： 具有FET像素阵列的成像传感器和形成成像传感器的方法。 每个像素是半导体岛，例如绝缘体上硅（SOI）晶片上的N型硅。 FET形成在一个光电二极管电极中，例如P阱阴极。 滤色器可以附接到岛的相对表面。 保护层（例如，玻璃或石英）或窗口在滤色器处固定到像素阵列。 图像传感器可以从背面照亮，电池布线在电池单元上方。 因此，通过保护层的光学信号被滤色器过滤并被相应的光电传感器选择性地感测。

公开(公告)号：US20060138480A1

公开(公告)日：2006-06-29

申请号：US10905277

申请日：2004-12-23

申请人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Robert Leidy ,  Richard Rassel ,  Anthony Stamper

发明人： James Adkisson ,  Jeffrey Gambino ,  Mark Jaffe ,  Robert Leidy ,  Richard Rassel ,  Anthony Stamper

IPC分类号： H01L31/113 ,  H01L31/0232 ,  H01L31/00

CPC分类号： H01L27/14636 ,  H01L21/76819 ,  H01L21/76834 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14645 ,  H01L27/14683

摘要： An image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The image sensor includes structures having a minimum thickness of barrier layer metal that traverses the optical path of each pixel in the sensor array or, that have portions of barrier layer metal selectively removed from the optical paths of each pixel, thereby minimizing reflectance. That is, by implementing various block or single mask methodologies, portions of the barrier layer metal are completely removed at locations of the optical path for each pixel in the array. In a further embodiment, the barrier metal layer may be formed atop the Cu metallization by a self-aligned deposition.

摘要翻译： 一种图像传感器和制造方法，其中传感器包括铜（Cu）金属化水平，允许结合较薄的层间电介质堆叠以产生呈现增加的光敏度的像素阵列。 图像传感器包括具有穿过传感器阵列中的每个像素的光路的阻挡层金属的最小厚度的结构，或者具有从每个像素的光路中选择性地去除的阻挡层金属的部分，从而使反射率最小化。 也就是说，通过实现各种块或单掩模方法，在阵列中的每个像素的光路的位置处完全去除了阻挡层金属的部分。 在另一个实施例中，阻挡金属层可以通过自对准沉积形成在Cu金属化之上。

公开(公告)号：US07364078B2

公开(公告)日：2008-04-29

申请号：US10235800

申请日：2002-09-06

申请人： Kurt Raichle ,  Scott Krampitz ,  Jeff Patterson ,  Richard Rassel ,  Garret Miller

发明人： Kurt Raichle ,  Scott Krampitz ,  Jeff Patterson ,  Richard Rassel ,  Garret Miller

IPC分类号： G06K7/10

CPC分类号： H02J7/0009 ,  G01R31/3648 ,  H02J2007/0098

摘要： An apparatus for entering information into a battery test/charger that includes a bar code reader, a controller that is used to receive information from the bar code reader wherein the controller controls a battery tester/charger. In addition, a method for entering information into a battery tester/charger that includes reading a bar code and inputting information into a controller for the battery tester charger based on the bar code. An additional method of recording information about a battery that includes printing information on a bar code reflecting information about the battery and associating the bar code with the battery.

摘要翻译： 用于将信息输入到包括条形码读取器的电池测试/充电器的装置，用于从条形码读取器接收信息的控制器，其中控制器控制电池测试器/充电器。 另外，用于将信息输入到电池测试器/充电器中的方法包括：根据条形码读取条形码并将信息输入到用于电池测试器充电器的控制器中。 记录关于电池的信息的附加方法，其包括在反映关于电池的信息并将条形码与电池相关联的条形码上打印信息。