公开(公告)号：US20080225505A1

公开(公告)日：2008-09-18

申请号：US12129283

申请日：2008-05-29

申请人： John R. Martin ,  Manolo G. Mena ,  Elmer S. Lacsamana ,  Michael P. Duffy ,  William A. Webster ,  Lawrence E. Felton ,  Maurice S. Karpman

发明人： John R. Martin ,  Manolo G. Mena ,  Elmer S. Lacsamana ,  Michael P. Duffy ,  William A. Webster ,  Lawrence E. Felton ,  Maurice S. Karpman

IPC分类号： H01L21/50 ,  H05K7/00

CPC分类号： B81C1/00896

摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

公开(公告)号：US07416984B2

公开(公告)日：2008-08-26

申请号：US10914576

申请日：2004-08-09

申请人： John R. Martin ,  Manolo G. Mena ,  Elmer S. Lacsamana ,  Maurice S. Karpman

发明人： John R. Martin ,  Manolo G. Mena ,  Elmer S. Lacsamana ,  Maurice S. Karpman

IPC分类号： H01L21/302

CPC分类号： B81C1/00896

摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

摘要翻译： 制造MEMS器件的方法在其可移动结构形成之后移除器件晶片的底侧。 为此，该方法提供了具有初始底侧的器件晶片。 接下来，该方法在器件晶片上形成可移动结构，然后基本上去除器件晶片的整个初始底侧。 整个初始底部的移除有效地形成最终底部。

公开(公告)号：US06964882B2

公开(公告)日：2005-11-15

申请号：US10259188

申请日：2002-09-27

申请人： Chang-Han Yun ,  Lawrence E. Felton ,  Maurice S. Karpman ,  John A. Yasaitis ,  Michael W. Judy ,  Colin Gormley

发明人： Chang-Han Yun ,  Lawrence E. Felton ,  Maurice S. Karpman ,  John A. Yasaitis ,  Michael W. Judy ,  Colin Gormley

IPC分类号： B81C1/00 ,  B81C3/00 ,  H01L23/12

CPC分类号： B81C1/00238 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2201/019

摘要： A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.

摘要翻译： 使用倒装技术来制造复杂的微机电系统。 在两个晶片的每一个的正面上制造各种微加工结构。 将一个晶片翻转并结合到另一个晶片，使得两个晶片的前侧以翻转堆叠的结构结合在一起。

公开(公告)号：US06933163B2

公开(公告)日：2005-08-23

申请号：US10259173

申请日：2002-09-27

申请人： Chang-Han Yun ,  Lawrence E. Felton ,  Maurice S. Karpman ,  John A. Yasaitis ,  Michael W. Judy ,  Colin Gormley

发明人： Chang-Han Yun ,  Lawrence E. Felton ,  Maurice S. Karpman ,  John A. Yasaitis ,  Michael W. Judy ,  Colin Gormley

IPC分类号： B81B7/00 ,  B81C3/00 ,  H01L21/00

CPC分类号： B81B7/0006 ,  B81B2201/042 ,  B81B2207/07 ,  B81C2201/019

摘要： An intermediate electrode layer is used to fabricate an integrated micro-electromechanical system. An intermediate electrode layer is formed on an integrated circuit wafer. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer. A micro-electromechanical system wafer having micromachined optical mirrors is bonded to the integrated circuit wafer such that the drive electrodes are positioned a predetermined distance from the optical mirrors.

摘要翻译： 中间电极层用于制造集成的微机电系统。 在集成电路晶片上形成中间电极层。 中间电极层将驱动电极设置在集成电路晶片的表面上方的预定高度。 具有微加工光学镜的微电子机电系统晶片被结合到集成电路晶片，使得驱动电极位于距离光学镜的预定距离处。

公开(公告)号：US07166911B2

公开(公告)日：2007-01-23

申请号：US10952424

申请日：2004-09-28

申请人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

发明人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

IPC分类号： H01L23/12

CPC分类号： B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中，接触面积小于衬底的底表面的表面积。 因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此，这个空间没有隔离器。 此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

公开(公告)号：US06713829B1

公开(公告)日：2004-03-30

申请号：US10386579

申请日：2003-03-12

申请人： Maurice S. Karpman

发明人： Maurice S. Karpman

IPC分类号： H01L2982

CPC分类号： G01C21/165

摘要： A position sensor includes a receiver capable of receiving a position signal from an external source, and an inertial motion unit capable of sensing movement and producing a movement signal based upon the sensed movement. The position sensor also includes a processor operatively coupled with the receiver and the inertial motion unit. The processor is capable of calculating position information based on at least one of the position signal and the movement signal. Moreover, the receiver, inertial motion unit and processor are formed on a single chip.

摘要翻译： 位置传感器包括能够接收来自外部源的位置信号的接收器和能够基于感测到的移动来感测运动并产生运动信号的惯性运动单元。 位置传感器还包括与接收器和惯性运动单元可操作地耦合的处理器。 处理器能够基于位置信号和移动信号中的至少一个来计算位置信息。 此外，接收器，惯性运动单元和处理器形成在单个芯片上。

公开(公告)号：US06686993B1

公开(公告)日：2004-02-03

申请号：US09799887

申请日：2001-03-05

申请人： Maurice S. Karpman ,  Nicholas Pizzi, Jr.

发明人： Maurice S. Karpman ,  Nicholas Pizzi, Jr.

IPC分类号： G01N2100

CPC分类号： B81C99/005 ,  G01M11/005

摘要： A probe card characterizes optical structures formed on a MEMS wafer. The probe includes a substrate having a circuit thereon. The substrate has an opening wherein a plurality of metal probes, electrically coupled to the circuit, pass through the opening. The probe card further includes an optical test device electrically coupled to the circuit. The optical test device includes a light source and a photosensitive area. The photosensitive area receives directly light reflected from the optical structures. The optical test device can be positioned directly over the opening, or the optical test device can be positioned on a periphery of the opening. Furthermore, the optical test device can be positioned so as to provide a test light beam that is parallel to the wafer to test pop-up optical MEMS components. The optical test device also may be positioned between the probe card and the MEMS wafer.

摘要翻译： 探针卡表征在MEMS晶片上形成的光学结构。 探针包括其上具有电路的基板。 衬底具有开口，其中电耦合到电路的多个金属探针穿过开口。 探针卡还包括电耦合到电路的光学测试装置。 光学测试装置包括光源和感光区域。 感光区域直接接收从光学结构反射的光。 光学测试装置可以直接定位在开口上方，或者光学测试装置可以位于开口的周边上。 此外，可以将光学测试装置定位成提供与晶片平行的测试光束以测试弹出式光学MEMS组件。 光学测试装置也可以位于探针卡和MEMS晶片之间。

公开(公告)号：US06448109B1

公开(公告)日：2002-09-10

申请号：US09713693

申请日：2000-11-15

申请人： Maurice S. Karpman

发明人： Maurice S. Karpman

IPC分类号： H01L2144

CPC分类号： B81B7/0077 ,  B81C1/00873 ,  H01L21/50 ,  H01L2924/15153 ,  Y10T156/1092

摘要： Individual caps are provided for mutually spaced MEMS on a common wafer by establishing a fixed spatial array of caps in positions that correspond to the positions of the MEMS on the wafer, and simultaneously bonding the caps to corresponding MEMS. The caps are preferably held in place within recesses in a template, and include protective sealing rings that are bonded to the MEMS wafer. The wafer is diced into individual MEMS chips after the caps have been bonded. The caps can be provided with circuitry that faces away from MEMS wafer and is wire bonded to the wafer, or that faces towards the wafer with a flip-chip mounting.

摘要翻译： 通过在对应于晶片上的MEMS位置的位置处建立固定的空间阵列的盖，并且将盖连接到对应的MEMS上，在共同的晶片上为相互间隔的MEMS提供单独的盖。 盖子优选地保持在模板中的凹部内的适当位置，并且包括结合到MEMS晶片的保护性密封环。 在盖已经结合之后，将晶片切成单独的MEMS芯片。 盖可以设置有远离MEMS晶片的电路，并且被引线接合到晶片，或者通过倒装芯片安装面向晶片。

公开(公告)号：US5657165A

公开(公告)日：1997-08-12

申请号：US540871

申请日：1995-10-11

申请人： Maurice S. Karpman ,  Allen Becker

发明人： Maurice S. Karpman ,  Allen Becker

IPC分类号： G02B27/02 ,  G02B27/00 ,  G02B27/01 ,  G09G3/20 ,  G09G3/36 ,  H04N3/08 ,  H04N9/30 ,  G02B27/14 ,  G02B26/08

CPC分类号： H04N9/30 ,  G02B27/017 ,  G02B27/0172 ,  H04N3/08 ,  G02B2027/0154

摘要： A miniature, full-color display includes two rows of light-emitting elements that are both selected to emit light in substantially non-overlapping wavelength ranges comprising a blue-green wavelength range and a red wavelength range. The light-emitting elements as well as a magnifying lens, and an oscillating mirror are placed in a light-tight box having an opening through which the mirror may be viewed. The light from the blue-green elements is filtered by a filter which transmits either blue or green light depending on the mirror movement. The light-emitting devices are selectively illuminated as the mirror moves to create a full-color, substantially planar, two-dimensional image. The light box may be sized to be hand-held, or may be capable of being mounted to a pair of glasses, a headband or similar device.

摘要翻译： 微型全色显示器包括两排发光元件，它们被选择为以包括蓝绿色波长范围和红色波长范围的基本上不重叠的波长范围发光。 发光元件以及放大透镜和振动反射镜被放置在具有可以观看反射镜的开口的不透光盒中。 来自蓝绿色元件的光由滤光器滤光，滤光片根据镜面运动传输蓝光或绿光。 当镜子移动时，发光器件被选择性地照亮以产生全色，基本上平面的二维图像。 灯箱的尺寸可以是手持式的，或者可以能够安装到一副眼镜，头带或类似装置上。

公开(公告)号：US06534340B1

公开(公告)日：2003-03-18

申请号：US09195279

申请日：1998-11-18

申请人： Maurice S. Karpman ,  Dipak Sengupta

发明人： Maurice S. Karpman ,  Dipak Sengupta

IPC分类号： H01L2148

CPC分类号： H01L27/14625 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A cover cap for semiconductor wafer devices is disclosed. According to the invention, a wafer of material that is at least one of photo-etchable or transparent is patterned and attached as a cover to a substrate including a number of semiconductor devices. Preferably, the cover wafer is made from a photo-etchable material so that portions of the cover wafer may be selectively sensitized and etched. In particular, one or more cover caps may be defined in the cover wafer such that each cover cap corresponds to a respective device on the device substrate. Once the cover wafer is attached to the device substrate to form an assembly, the assembly is diced into individual devices and the devices are packaged. The invention provides several advantages for a number of semiconductor device fabrication applications, including those relating to image sensors, and micro-machined devices such as MEMS. For example, a cover wafer attached to the device substrate prior to dicing and packaging of individual devices provides more robust devices by protecting the device substrate from any number of environmental hazards, such as particulate contamination, moisture, processing agents such as solvents, and inadvertent scratching of the device substrate surface.

摘要翻译： 公开了一种用于半导体晶片装置的盖帽。 根据本发明，将至少一种可光刻蚀或透明的材料晶片图案化并作为盖子附着到包括多个半导体器件的衬底上。 优选地，覆盖晶片由光刻蚀材料制成，使得覆盖晶片的部分可以被选择性地敏化和蚀刻。 特别地，可以在封盖晶片中限定一个或多个盖帽，使得每个盖帽对应于装置基板上的相应装置。 一旦将封面晶片连接到器件基板以形成组件，则将该组件切成单独的器件并且将器件封装在一起。 本发明为许多半导体器件制造应用提供了几个优点，包括与图像传感器有关的那些，以及诸如MEMS的微加工器件。 例如，在单独设备的切割和封装之前附接到设备基板的覆盖晶片通过保护设备基板免受任何数量的环境危害（例如颗粒污染物，水分，加工剂如溶剂和无意的）而提供更坚固的设备 刮擦设备基板表面。